Patents by Inventor Walter M. Kirkbride

Walter M. Kirkbride has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electromagnetic interference and heatsinking
    Patent number: 6798662
    Abstract: A first apparatus includes a semiconductor device and a heatsink thermally coupled to the semiconductor device. The heatsink is located and formed to screen the device from external electromagnetic radiation or to contain radiation produced by the device. A second apparatus includes a semiconductor device, a heatsink thermally coupled to the semiconductor device, and a grounding structure having a capacitive coupling to the heatsink.
    Type: Grant
    Filed: February 26, 1999
    Date of Patent: September 28, 2004
    Assignee: Intel Corporation
    Inventors: Harry G. Skinner, Walter M. Kirkbride
  • Electromagnetic interference and heatsinking
    Patent number: 6583987
    Abstract: A first apparatus includes a semiconductor device and a heat dissipating device (e.g., a heatsink) thermally coupled to the semiconductor device. The heat dissipating device is located and formed to screen the semiconductor device from external electromagnetic radiation or to contain radiation produced by the semiconductor device. A second apparatus includes a semiconductor device, a heat dissipating device thermally coupled to the semiconductor device, and a grounding structure having a capacitive coupling to the heatsink.
    Type: Grant
    Filed: April 16, 2002
    Date of Patent: June 24, 2003
    Assignee: Intel Corporation
    Inventors: Harry G. Skinner, Walter M. Kirkbride
  • Electromagnetic interference and heatsinking
    Publication number: 20020114134
    Abstract: A first apparatus includes a semiconductor device and a heat dissipating device (e.g., a heatsink) thermally coupled to the semiconductor device. The heat dissipating device is located and formed to screen the semiconductor device from external electromagnetic radiation or to contain radiation produced by the semiconductor device. A second apparatus includes a semiconductor device, a heat dissipating device thermally coupled to the semiconductor device, and a grounding structure having a capacitive coupling to the heatsink.
    Type: Application
    Filed: April 16, 2002
    Publication date: August 22, 2002
    Applicant: Intel Corporation, a Delaware corporation
    Inventors: Harry G. Skinner, Walter M. Kirkbride