Abstract: A portable electronic device includes a portable housing and an electrical circuit positioned in the housing. A connector assembly is positioned in a wall of the housing. The connector assembly includes an internal connector extending into the housing, and an auxiliary connector rigidly coupled to the internal connector and accessible from outside the housing. The auxiliary connector is electrically connected to the internal connector. A flexible member electrically connects the internal connector to the electrical circuit. The flexible member is configured to transmit less than about 10% of an external impact force on the connector assembly to the electrical circuit.

Abstract: A portable electronic device includes a portable housing and an electrical circuit positioned in the housing. A connector assembly is positioned in a wall of the housing. The connector assembly includes an internal connector extending into the housing, and an auxiliary connector rigidly coupled to the internal connector and accessible from outside the housing. The auxiliary connector is electrically connected to the internal connector. A flexible member electrically connects the internal connector to the electrical circuit. The flexible member is configured to transmit less than about 10% of an external impact force on the connector assembly to the electrical circuit.

Abstract: A circuit shielding structure includes a circuitry package and a layer of conductive polymer material coating at least a portion of the circuitry package. The layer of conductive polymer material may include a metal filled polymer such as a silver particle filled fluoroelastomer.

Abstract: A circuit shielding structure includes a circuitry package and a layer of conductive polymer material coating at least a portion of the circuitry package. The layer of conductive polymer material may include a metal filled polymer such as a silver particle filled fluoroelastomer.

Abstract: A shielding and thermal dissipation structure for an electronic assembly including a distribution circuit and at least one electronic component mounted on a surface of the distribution circuit. A plastic housing overlays the at least one electronic component, and includes an outer periphery defining a housing interior and substantially surrounding the outer periphery of the at least one electronic component. A closed end on one side of the housing outer periphery has an interior surface facing the at least one electronic component with a metal coating about 5 microns thick on the interior surface. The metal coating is chosen from the group of nickel and gold. An electrically conductive gel in the housing interior about the plastic housing outer periphery (and preferably including carbon particles or carbon fibers) is in intimate contact with the distribution circuit and the metal coating.

Abstract: A thin flexible antenna has radiating elements made of thin nickel-titanium, a highly flexible and rigid alloy. The radiating elements are covered with silicone elastomer dielectric layers that have suitable elongation properties to withstand extreme bending stresses outer jackets cover the antenna. The outer jackets have a textured exterior surface that evenly distributes the bending stresses across the antenna.

Abstract: A termination contact for an antenna that has a Ni--Ti radiating element is formed by a layer of electrically conductive carbon filler disposed on the Ni--Ti radiating element. A conductive element is positioned on the layer of conductive carbon filler to provide electrical interface between the Ni--Ti radiating element and external RF circuitry. In to prevent contamination, a protective layer of silicon elastomer covers the conductive layer and the Ni--Ti radiating element such that a portion of the conductive element is exposed to provide a RF feed point.

Abstract: An integrated circuit module is provided having a substrate, an integrated circuit on the substrate and defining an active surface remote from the substrate, and a die attached to the active surface of the integrated circuit. A layer of non-conductive material conformally coats the die and active surface of the integrated circuit, with the layer of non-conductive material having a substantially level top surface. A plurality of vias are formed in the layer of non-conductive material aligned with the die and integrated circuit, respectively. A pattern of metallization is disposed on the top surface of the layer of non-conductive material extending through the plurality of vias and selectively interconnecting the die to the integrated circuit.

Abstract: A method for packaging an integrated circuit device includes forming a dielectric support layer on the surface of a substrate wherein the dielectric support layer includes an opening therein exposing at least a portion of an active region of the substrate. A protective layer is provided on the dielectric support layer opposite the substrate wherein the protective layer covers the exposed portion of the active region of the substrate thereby defining a cavity between the protective layer and the active region. More particularly, the step of forming the dielectric support layer can include forming a continuous dielectric layer on the surface of the substrate including the active region, and removing portions of the continuous dielectric layer from the active region to provide the opening of the dielectric support layer. Related structures are also discussed.

Abstract: A shock and vibration attenuating structure and method is provided for an electronic assembly including a distribution circuit and at least one electronic component mounted on a surface of the distribution circuit. The shock and vibration attenuating structure includes a layer of elastomer material adapted to overlay the distribution circuit and substantially conform to the at least one electronic component. The layer includes a negative image of at least part of the at least one electronic component to allow the elastomer material to envelope the at least part of the at least one electronic component, and at least one relief formed in the elastomer material. The at least one relief is spaced from the negative image of the at least one electronic component and has a predetermined size, shape, and location in the elastomer material selected to protect the electronic component from shock and vibration induced loads and deflections with the layer overlaying the electronic assembly.

Abstract: An apparatus and method for packaging a microelectronic device to be connectable to a distribution circuit. The apparatus is in the form of a microelectronic package including a microelectronic device having first and second oppositely facing surfaces and a plurality of Input/Output pads on the first surface capable of being electrically interconnected to a distribution circuit, a base adapted to support the microelectronic device in a predetermined operative relationship to a distribution circuit, and a first layer of elastomer gel sandwiched between the first surface and the base. The first surface of the microelectronic device overlays the base so as to allow an electrical interconnection through the base between the microelectronic device and a distribution circuit.

Abstract: A flexible strip transmission line is disclosed. The flexible strip transmission lines consists of a plurality of flexible layers enabling the transmission line to be folded or repeatably bent. The central layer consists of a flexible dielectric material. On opposing side of the dielectric layer are first and second flexible ground planes formed of a metalized fabric. The flexible ground plane layers are bonded to the dielectric material using a bonding agent such as silicone adhesive. An abrasion resistant material is connected to the outer surface of the flexible ground plane layers to provide a protective exterior shell.

Abstract: A high density interconnect (HDI) structure having a dielectric multi-layer interconnect structure on a substrate is fabricated by forming a chip well, placing a chip in the well, and connecting the chip to the interconnect structure. Additionally, temperature sensitive chips or devices may be located beneath the dielectric multi-layer interconnect structure. A spacer die may be located in the substrate while the interconnect structure is fabricated and removed after a chip well aligned with the spacer die is formed, in order to accommodate a chip thickness which is greater than the dielectric multi-layer interconnect structure thickness.

Abstract: An improved high density interconnect structure may include electronic components mounted on both sides of its substrate or a substrate which is only as thick as the semiconductor chips which reduces the overall structure thickness to the thickness of the semiconductor chips plus the combined thickness of the high density interconnect structure's dielectric and conductive layers. In the two-sided structures, feedthroughs, which are preferably hermetic, provide connections between opposite sides of the substrate. Substrates of either of these types may be stacked to form a three-dimensional structure. Means for connecting between adjacent substrates are preferably incorporated within the boundaries of the stack rather than on the outside surface thereof.

Abstract: In a focal plane array sensor hybrid, a focal plane array fabricated in a chip of one semiconductor material and a read out circuit fabricated in one or more chips of a different semiconductor material are connected by a high density interconnect structure in which a layer of dielectric material is bonded to the chips and has interconnecting conductors disposed thereon and extending through via holes therein into ohmic contact with appropriate contact pads of the chips. Inclusion of a flexible portion in the high density interconnect structure enables the readout and the focal plane array chips to be disposed in different planes to provide a compact structure. Focal plane array sensor hybrid testing and repair are both facilitated by this structure.

Abstract: In a focal plane array sensor hybrid, a focal plane array fabricated in a chip of one semiconductor material and a read out circuit fabricated in one or more chips of a different semiconductor material are connected by a high density interconnect structure in which a layer of dielectric material is bonded to the chips and has interconnecting conductors disposed thereon and extending through via holes therein into ohmic contact with appropriate contact pads of the chips. Inclusion of a flexible portion in the high density interconnect structure enables the readout and the focal plane array chips to be disposed in different planes to provide a compact structure. Focal plane array sensor hybrid testing and repair are both facilitated by this structure.