Patents by Inventor Walter Macht

Walter Macht has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD FOR DEPOSITING A PALLADIUM LAYER SUITABLE FOR WIRE BONDING ON CONDUCTORS OF A PRINTED CIRCUIT BOARD, AND PALLADIUM BATH FOR USE IN SAID METHOD
    Publication number: 20120244276
    Abstract: A method for generating a surface that can be bonded with gold wire. The surface is obtained by first depositing an exchange palladium layer made of the electrolyte on conductors of printed circuit boards, in particular on conductors made of copper or conductive paste. The exchange palladium layer is then reinforced with a palladium layer, deposited from a chemical palladium electrolyte. In order to protect the palladium, an exchange gold layer is then applied. An exchange palladium bath is used, comprising an organic brightener.
    Type: Application
    Filed: November 6, 2010
    Publication date: September 27, 2012
    Applicant: Doduco GmbH
    Inventors: Jochen Heber, Erwin Marka, Walter Macht, Silke Oelschlaeger