Patents by Inventor Walter Pessl

Walter Pessl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cooling component carrier material by carbon structure within dielectric shell
    Patent number: 10736222
    Abstract: A component carrier includes component carrier material and a heat spreading module with a carbon structure enclosed within a dielectric shell for disabling contact between the carbon structure and the component carrier material.
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: August 4, 2020
    Assignee: AT&S Austria Technologies & Systemtechnik Aktiengesellschaft
    Inventors: Jonathan Silvano de Sousa, Markus Leitgeb, Walter Pessl
  • Cooling Component Carrier Material by Carbon Structure Within Dielectric Shell
    Publication number: 20190174638
    Abstract: A component carrier includes component carrier material and a heat spreading module with a carbon structure enclosed within a dielectric shell for disabling contact between the carbon structure and the component carrier material.
    Type: Application
    Filed: June 29, 2017
    Publication date: June 6, 2019
    Applicant: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Jonathan Silvano de Sousa, Markus Leitgeb, Walter Pessl