Abstract: An improved molding composition is provided which exhibits desirable weathering resistance and UV stability comprising an oxymethylene copolymer having at least one chain containing from about 85 to 99.6 mole percent of oxymethylene units interspersed with about 0.4 to 15 mole percent of oxyethylene units, about 0.1 to 1 percent by weight of 1,6-hexamethylene bis-(3,5-di-tert-butyl)-4 hydroxy hydrocinnamate, about 0.015 to 0.4 percent by weight of 2,4,6-triamino-symtriazine, about 0.1 to 0.75 percent by weight of bis(1,2,2,6,6-pentamethyl-4-piperidinyl) ((3,5-bis(1,1-dimethylethyl-4-hydroxyphenol)methyl)) butyl propanedioate and about 0.25 to 1.0 percent by weight of 2-hydroxy-4-n-octoxy-benzophenone.