Abstract: A microwave-frequency microcircuit assembly includes an integrated circuit structure having a circuit ground. A support structure includes a grounded metallic carrier, and a dielectric substrate having a top surface, a bottom surface contacting the carrier, and a capacitor via extending through the dielectric substrate. A metallization on the top surface of the substrate includes an input metallization trace to the integrated circuit structure, an output metallization trace from the integrated circuit structure, and a substrate ground plane upon which the integrated circuit structure is affixed. A thin-film capacitor resides in the capacitor via and is electrically connected between the substrate ground plane and the carrier. An electrical resistor is connected between the circuit ground of the integrated circuit structure and the carrier to self-bias the integrated circuit structure.

Abstract: A modular beamformer system for providing signals to at least two radiating elements of a phased array antenna is provided. The system includes a right-hand circular polarization beamformer module and a left-hand circular polarization beamformer module. The left and right circular polarization beamformer modules are coupled to two radiating elements. Each beamformer module includes two groups of beamforming circuitry, one per radiating element. At least one feeder line extends from each beamforming circuitry and is coupled to one of the radiating elements to transmit an output of each beamforming circuitry.

Abstract: A millimeter wave multilayer phased array assembly has a multilayer board consisting of several laminated printed wiring boards (PWBs) and a frame having a waveguide input and waveguide output. The PWBs are made of a high frequency laminate material and have a pattern of metalization to perform varying electronic tasks. These tasks include electrical interconnection, RF signal transmission, DC current routing and DC signal routing.