Patents by Inventor Walter R. Hedlund, III

Walter R. Hedlund, III has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit encapsulation
    Patent number: 6710257
    Abstract: A circuit on a circuit board is encapsulated using a first mold section and a second mold section. The first mold section closes on one side of the board, and the first mold section has an exposed first conduit. The second mold section closes on another side of the board, and the second mold section has a second conduit for pushing molding compound into a mold cavity in at least one of the mold sections. The second conduit has a side opened to the first mold section when the first and section mold sections are closed on the circuit board. A piston extends through the first conduit to close the side of the second conduit.
    Type: Grant
    Filed: March 15, 2002
    Date of Patent: March 23, 2004
    Assignee: VLT Corporation
    Inventors: John R. Saxelby, Jr., Walter R. Hedlund, III
  • Circuit encapsulation
    Patent number: 6403009
    Abstract: A circuit on a circuit board is encapsulated using a first mold section and a second mold section. The first mold section closes on one side of the board, and the first mold section has an exposed first conduit. The second mold section closes on another side of the board, and the second mold section has a second conduit for pushing molding compound into a mold cavity in at least one of the mold sections. The second conduit has a side opened to the first mold section when the first and section mold sections are closed on the circuit board. A piston extends through the first conduit to close the side of the second conduit.
    Type: Grant
    Filed: June 22, 1999
    Date of Patent: June 11, 2002
    Assignee: VLT Corporation
    Inventors: John R. Saxelby, Jr., Walter R. Hedlund, III
  • Apparatus for circuit encapsulation
    Patent number: 5945130
    Abstract: A circuit on a circuit board is encapsulated using a first mold section and a second mold section. The first mold section closes on one side of the board, and the first mold section has an exposed first conduit. The second mold section closes on another side of the board, and the second mold section has a second conduit for pushing molding compound into a mold cavity in at least one of the mold sections. The second conduit has a side opened to the first mold section when the first and section mold sections are closed on the circuit board. A piston extends through the first conduit to close the side of the second conduit.
    Type: Grant
    Filed: February 20, 1997
    Date of Patent: August 31, 1999
    Assignee: VLT Corporation
    Inventors: John R. Saxelby, Jr., Walter R. Hedlund, III
  • Circuit encapsulation process
    Patent number: 5728600
    Abstract: A method for encapsulating portions of a circuit formed on a substrate. The substrate has two faces and perimeter sides. Encapsulating surrounds, in molding compound, a portion of one of the faces of the substrate and a portion of the sides of the substrate, and during encapsulation a portion of the one face of the substrate that bears conductive pads is left unencapsulated.An encapsulated circuit including a substrate having two faces and perimeter sides around the faces and a circuit formed on the substrate. The substrate also includes conductive pads that are formed on a portion of one of the faces near one of the sides and are connected to the circuit. An integrally formed encapsulating mass encapsulates all of the one face except in the region of the pads, all of the other face except in a region opposite to the region of the pads, and all of the sides.
    Type: Grant
    Filed: November 15, 1994
    Date of Patent: March 17, 1998
    Assignee: VLT Corporation
    Inventors: John R. Saxelby, Jr., Walter R. Hedlund, III
  • Packaging electrical components having a scallop formed in an edge of a circuit board
    Patent number: 5644103
    Abstract: A structure includes a baseplate, a circuit board parallel and adjacent to the baseplate, and an electronic component. The circuit board has an edge with a scallop formed in the edge, and the scallop is plated with a conductive material. The electronic component includes a power-dissipating surface and a pad for making electrical connection. The electronic component is mounted with the power-dissipating surface in contact with the baseplate and the pad electrically connected to the conductive material.
    Type: Grant
    Filed: November 10, 1994
    Date of Patent: July 1, 1997
    Assignee: VLT Corporation
    Inventors: Stephen R. Pullen, Walter R. Hedlund, III