Abstract: A method for producing a ceramic multilayer circuit system, and a corresponding multilayer circuit system are provided. An embodiment of the method includes sequential deposition of a plurality of circuit layers of the multilayer circuit system on a substrate using a powder spray method; pressing of the deposited plurality of circuit layers; and thermal sintering of the pressed plurality of circuit layers. The individual circuit layers have electrically conductive areas made of at least one conductive material and electrically insulating areas made of at least one ceramic material.

Abstract: The invention relates to a method for producing a ceramic component, a ceramic component, and a component assembly having a ceramic component and a connection component. The method according to the invention for producing a ceramic component (1) comprises the steps: a) providing a ceramic substrate (2), wherein a conducting path (3) is arranged in the interior and/or on the surface of the ceramic substrate (2), and at least some regions of the ceramic substrate (2) are covered by a glaze (5); b) creating a contacting opening (6) in the glaze (5) in a region of a contact region (15) of the conducting path (3) to be contacted; c) applying a metallic layer (7) in the region of the contacting opening (6) for contacting the conducting path (3) in the contact region (15).

Abstract: The invention relates to a control device (1) for a motor vehicle, comprising a housing (10) and at least one circuit carrier (20), which is arranged in an inner chamber of the housing (10) and comprises at least one first contact element (22) that establishes an electric connection to at least one second contact element (17) of a plug receptacle (50) on at least one housing wall (11), wherein the second contact element (17) is guided through the at least one housing wall (11) and is designed on the inside as a contact spring that rests against an associated first contact element (22) by spring force, and to a related method for mounting a control device for a motor vehicle. According to the invention, the at least one housing wall (11) comprises receiving means (11.1) for a first circuit carrier (20), wherein the first circuit carrier (20) is guided through guide means (13.1) designed in the housing (10), wherein the guide means (13.1) and/or the receiving means (11.

Abstract: The invention relates to a control device (1) for a motor vehicle, comprising a housing (10) and at least one circuit carrier (20), which is arranged in an inner chamber of the housing (10) and comprises at least one first contact element (22) that establishes an electric connection to at least one second contact element (17) of a plug receptacle (50) on at least one housing wall (11), wherein the second contact element (17) is guided through the at least one housing wall (11) and is designed on the inside as a contact spring that rests against an associated first contact element (22) by spring force, and to a related method for mounting a control device for a motor vehicle. According to the invention, the at least one housing wall (11) comprises receiving means (11.1) for a first circuit carrier (20), wherein the first circuit carrier (20) is guided through guide means (13.1) designed in the housing (10), wherein the guide means (13.1) and/or the receiving means (11.

Abstract: The invention relates to a method for producing a ceramic component, a ceramic component, and a component assembly having a ceramic component and a connection component. The method according to the invention for producing a ceramic component (1) comprises the steps: a) providing a ceramic substrate (2), wherein a conducting path (3) is arranged in the interior and/or on the surface of the ceramic substrate (2), and at least some regions of the ceramic substrate (2) are covered by a glaze (5); b) creating a contacting opening (6) in the glaze (5) in a region of a contact region (15) of the conducting path (3) to be contacted; c) applying a metallic layer (7) in the region of the contacting opening (6) for contacting the conducting path (3) in the contact region (15).

Abstract: A method for producing an electrical resistor, in particular a current sensing resistor, on a substrate, a resistor blank being placed on the substrate and then being heat-treated to form the resistor. To form the resistor blank, a palladium layer is applied to the substrate and a silver layer is applied to the palladium layer, or a silver layer is applied to the substrate and a palladium layer is applied to the silver layer, and the palladium of the palladium layer is then completely alloyed with the silver of the silver layer by heat treatment.

Abstract: A contact pin for an electronic circuit is described which has at least one ceramic circuit carrier, the circuit carrier having at least on feedthrough for accommodating the contact pin and the circuit carrier having electrical contact surfaces in the area of the feedthrough for accommodating the contact pin, and the contact pin being only elastically deformed when inserted into the feedthrough. The contact pin may have an electrical contact spring in the form of an insertion stop on the insertion side in addition to or instead of one of the radial bulges, the contact spring being generally designed in the shape of a circular sector and pressing onto the circuit carrier using the outer surface of the circular sector as a stop surface or having a barbed hook on the end which is inserted through the feedthrough in the circuit carrier, the barbed hook preventing the contact pin from sliding back after the contact pin has been inserted through the feedthrough.

Abstract: An electronic assembly has at least one conductor substrate carrying components, which conductor substrate is surrounded by a mechanical protection. The conductor substrate is encased using a molding compound as a mechanical protection and is contacted by at least one intrinsically stiff, spring-elastic electrical connection conductor, the connection conductor being embedded in the molding compound, at least in sections.

Abstract: In a method for producing a conductive coating on an insulating substrate, at least one surface of an electrically insulating substrate is equipped, in selected regions, with a coating of an electrically highly conductive first metal; the coated surface is cleaned; the coating made of the first metal on the substrate is seeded with seeds of a second metal; a layer of the second metal is deposited onto the layer thus seeded; the substrate thus coated is fired.

Abstract: A method for producing a ceramic multilayer circuit system, and a corresponding multilayer circuit system are provided. An embodiment of the method includes sequential deposition of a plurality of circuit layers of the multilayer circuit system on a substrate using a powder spray method; pressing of the deposited plurality of circuit layers; and thermal sintering of the pressed plurality of circuit layers. The individual circuit layers have electrically conductive areas made of at least one conductive material and electrically insulating areas made of at least one ceramic material.

Abstract: A method for producing an electrical resistor, in particular a current sensing resistor, on a substrate, a resistor blank being placed on the substrate and then being heat-treated to form the resistor. To form the resistor blank, a palladium layer is applied to the substrate and a silver layer is applied to the palladium layer, or a silver layer is applied to the substrate and a palladium layer is applied to the silver layer, and the palladium of the palladium layer is then completely alloyed with the silver of the silver layer by heat treatment.

Abstract: A method for producing a printed circuit, including at least the following steps: feeding different colloid inks to different printing nozzles of at least one print head, the colloid inks each containing a printing carrier and particles of a basic substance; printing individual droplets of the different colloid inks onto a substrate surface of a substrate between printed circuit traces in such a way that the droplets intermix to form a resistance layer; and baking the substrate having the printed circuit traces and the imprinted resistance layer in such a way that the printing carrier is at least substantially removed. The resistors can therefore be printed quickly, advantageously in one run of the print head. A suitable square resistance value can be set for each resistor by appropriate dosing of the individual colloid inks, so that the surface requirement on the substrate is small.

Abstract: The invention relates to an unfired, adhesive ceramic film (1) having an unfired ceramic film (10) and an adhesive film (30), as well as to a method for producing a ceramic film (1) of the invention.

Abstract: A method of producing a hybrid product composed of a plurality of wiring planes includes printing a plurality of wiring planes with a homogenous metallization base material, performing at least one corresponding sintering step for fixing the metallization base material, and homogeneously chemically coating of freely located sintered metallization base material with at least one coating material; and also a sensor circuit or an evaluating circuit for a sensor as well as a control device are proposed with the hybrid product produced in accordance with the method.

Abstract: In a ceramic hybrid substrate and a method for treating the surface of a ceramic hybrid substrate having ceramic surface areas and metallic surface areas, the ceramic surface areas are esterified.

Abstract: In a method for producing a conductive coating on an insulating substrate, at least one surface of an electrically insulating substrate is equipped, in selected regions, with a coating of an electrically highly conductive first metal; the coated surface is cleaned; the coating made of the first metal on the substrate is seeded with seeds of a second metal; a layer of the second metal is deposited onto the layer thus seeded; the substrate thus coated is fired.

Abstract: A method for a parallel manufacturing of a plurality of piezoelectric actuators and a corresponding piezoelectric actuator utilize a plurality of thin foils composed of an unfired piezoelectric ceramic material which stacked one over another. On surface of foils, an electrode is provided for each actuator. For contacting electrodes, first and second connecting openings are provided. Electrodes have cut-outs which surround either first or second connecting openings. An electrically conductive paste is introduced into connecting openings. The stacked arrangement is fired and split up into the individual actuators. As internal electrodes, the electrodes are insulated from the surroundings.

Abstract: A method for a parallel manufacturing of a plurality of piezoelectric actuators and a corresponding piezoelectric actuator utilize a plurality of thin foils composed of an unfired piezoelectric ceramic material which are stacked one over another. On surface of foils, an electrode is provided for each actuator. For contacting electrodes, first and second connecting openings are provided. Electrodes have cut-outs which surround either first or second connecting openings. An electrically conductive paste is introduced into connecting openings. The stacked arrangement is fired and split up into the individual actuators. As internal electrodes, the electrodes are insulated from the surroundings.

Abstract: A pressure sensor includes a housing, a support plate arranged on a mounting surface of the housing, a sensor element arranged in the housing, and at least one connector element joined in electrically conductive fashion to at least one contact surface of the support plate. A method for manufacturing a pressure sensor in such a way that the pressure sensor on the one hand can be manufactured easily and on the other hand is resistant to malfunction and is operational over a long period of time. The at least one connector element is arranged flush with the mounting surface and joined directly to the at least one contact surface. A capillary adhesive layer is arranged between the support plate and the mounting surface.

Abstract: A high-dielectric lead-free paste serves for the manufacture of at least one area having a high dielectric constant in a ceramic multilayer circuit. The lead-free dielectric paste is basically made of barium titanate nano powder of a suitable particle size and sinters at temperatures below 1000.degree. C., preferably in a range of 800.degree. C. to 1000.degree. C.