Abstract: An apparatus for removing a ring-shaped reinforcement, edge from a ground semiconductor wafer, which is cohesively connected to an elastic carrier film and is fixed to a circumferential wafer frame via the carrier film, includes a holding device, which has a support having suction openings for holding the semiconductor wafer on the support surface of the support, and a separating device, which includes a device for integrally detaching the reinforcement edge from the carrier film.

Abstract: An apparatus for removing a ring-shaped reinforcement, edge from a ground semiconductor wafer, which is cohesively connected to an elastic carrier film and is fixed to a circumferential wafer frame via the carrier film, includes a holding device, which has a support having suction openings for holding the semiconductor wafer on the support surface of the support, and a separating device, which includes a device for integrally detaching the reinforcement edge from the carrier film.

Abstract: A fillable cushion (30, 31) for the protection of four corners, two edges and a surface area of an essentially cuboidal article (19) to be packed is shown, the cushion comprising at least two layers of plastic films. The cushion has near its longitudinal ends in each case a recess, by means of which the cushion can be pushed onto at least one corner of the cuboidal article, the cushion being dimensioned in such a way that its longitudinal extent between the two recesses corresponds to the length of the two edges to be protected plus the length of the diagonal of the surface area to be protected. The method and the apparatus for fabricating fillable cushions provide that the welding is performed with ultrasound.