Abstract: Methods for chemical mechanical polishing (CMP) of semiconductor substrates, and more particularly to temperature control during such chemical mechanical polishing are provided. In one aspect, the method comprises polishing the substrate with a polishing surface during a polishing process to remove a portion of the conductive material, repeatedly monitoring a temperature of the polishing surface during the polishing process, and exposing the polishing surface to a rate quench process in response to the monitored temperature so as to achieve a target value for the monitored temperature during the polishing process.

Abstract: Methods for chemical mechanical polishing (CMP) of semiconductor substrates, and more particularly to temperature control during such chemical mechanical polishing are provided. In one aspect, the method comprises polishing the substrate with a polishing surface during a polishing process to remove a portion of the conductive material, repeatedly monitoring a temperature of the polishing surface during the polishing process, and exposing the polishing surface to a rate quench process in response to the monitored temperature so as to achieve a target value for the monitored temperature during the polishing process.

Abstract: Methods and systems are provided for an event-based configuration interface between a service supporting mobile connectivity and device drivers exposing WWAN data services. Object identifiers (OIDs) are passed between the service and the device drivers. Asynchronous communication is enabled. Methods and systems for using OIDs to negotiate configuration, including PINs, SIMs and signal strength, of WWAN devices such as GSM and CDMA-based devices are provided.

Abstract: Embodiments described herein generally provide a method for processing metals disposed on a substrate in a chemical mechanical polishing system. The apparatus advantageously facilitates efficient bulk and residual conductive material removal from a substrate. In one embodiment a method for chemical mechanical polishing (CMP) of a conductive material disposed on a substrate is provided. A substrate comprising a conductive material disposed over an underlying barrier material is positioned on a first platen containing a first polishing pad. The substrate is polished on a first platen to remove a bulk portion of the conductive material. A rate quench process is performed in order to reduce a metal ion concentration in the polishing slurry. The substrate is polished on the first platen to breakthrough the conductive material exposing a portion of the underlying barrier material.

Abstract: A bumper guard for attachment to a sports racquet. The sports racquet includes a frame having a head portion with an outer peripheral surface and a plurality of grommet holes formed into the head portion for supporting a string bed. The bumper guard includes an elongate body having a first length, an inner surface and an outer surface. The body includes a central region and first and second wings. The central region, when installed on the racquet, is generally centered about a plane defined by the string bed. The first and second wings extend from the central region. The inner surface of the body configured to generally conform with the peripheral outer surface of the head portion. Each of the first and second wings has an inner wall and an outer wall defining at least one elongate hollow cavity.

Abstract: A string protecting jacket of a game racket frame comprises a jacket base provided with a plurality of string protecting projections spaced at an interval and dimensioned to fit securely into the string holes of the game racket frame. Each of the string protecting projections is provided axially with a through hole dimensioned to receive therein a string to be strung in the game racket frame. The jacket base body has an upper seat and a lower seat, which have respectively a plurality of horizontal through holes spaced at an interval such that the horizontal through holes can be matched with the through holes of the string protecting projections so as to bring about the stringing of the game racket frame in various manners.

Abstract: A composite racket having at least one portion made of a thermoplastic resin and having the remaining portion made of a thermosetting resin is disclosed. The thermoplastic and thermosetting resins provide different dynamic stiffness, flexibility and toughness so that the racket possesses desired characteristics in the zones where they are necessary. The racket is fabricated by preforming a fiber reinforced thermoplastic resin in a first mold to form one of the frame portions and placing this preformed portion in a second mold. A fiber reinforced thermosetting resin is then formed into the other frame portion in the second mold and joined to the frame portion formed using thermoplastic resin at the throat section of the racket.

Abstract: A racket includes a substantially oval-shaped frame, a shaft, and a neck portion interconnecting the frame and the shaft. The shaft has a first portion adjacent to the neck portion and a second portion serving as a handle for the racket. The frame, the neck portion, and the first portion of the shaft are integrally made of a first material. The second portion of the shaft is made of a second material different from the first material. A layer of elastic and adhesive material is provided between respective joint end faces of the first and second portions to interconnect the first and second portions.