Abstract: The invention pertains to a process for throughplating of printed circuit boards using conductive plastics for direct plating, wherein a polymer film with intrinsic electric conductivity is adhesively deposited on non-conductive areas of the printed circuit boards, whereupon a metal film is applied. Selective production of the polymer film has previously been seen as requiring an oxidative pre-treatment of the printed circuit board, though this can negatively affect the further course of the process. With the present invention the potential negative effects are avoided by forgoing the oxidation pre-treatment.