Abstract: An electrical component includes stacked electrode layers arranged on a foundation. The stacked electrode layers include a first type of electrode layer and a second type of electrode layer. Dielectric layers separate the stacked electrode layers to form at least one capacitor. Two pairs of external contacts are arranged such that one external contact in each pair of external contacts is located on a side of the foundation and such that connections between each pair of external contacts overlap. A first pair of the external contacts connects to the first type of electrode layer and a second pair of the external contacts connects to the second type of electrode layer. The first type of electrode layer includes a first conductive layer which connects to at least one of the first pair of external contacts and the second type of electrode layer includes a second conductive layer which connects to at least one of the second pair of external contacts.

Abstract: The invention concerns an electrical multi-layered component with a foundation (1) that has stacked electrode layers (2, 3) of a first and a second kind. The electrode layers (2, 3) are separated from each other by dielectric layers (4) and form at least one capacitance (C1, C2). The foundation (1) has two pairs (5, 6) of external contacts (7) that are located on opposite sides (8) of the foundation (1) in such a way that for each pair (5, 6) one external contact (7) each is located on each side (8), and that the direct connections of the external contacts (7) belonging to one pair (5, 6) each cross each other. The first pair (5) of external contacts (7) is connected to the electrode layers (2) of the first kind, and the second pair (6) of external contacts (7) is connected to the electrode layers (3) of the second kind. The diagonal throughput of the external contacts (7) through the component has the advantage that it makes the achievement of a miniaturized design feasible.