Abstract: A booster antenna structure for a chip card. The booster antenna structure includes a first electrical circuit, which forms a first resonant circuit, a second electrical circuit which forms a second resonant circuit, and a parallel coupling between the first electrical circuit and the second electrical circuit. The booster antenna structure is formed of a single wire.

Abstract: A functional skin patch having a first surface and a second surface opposite the first surface is provided. The functional skin patch includes a functional unit having a thermo harvester and an antenna unit. The thermo harvester has a first terminal thermally connected to the first surface and a second terminal. The antenna unit has a first terminal thermally connected to the second terminal of the thermo harvester and a second terminal thermally connected to the second surface. The antenna unit has a stacked layer structure including, in this sequence, a metal layer thermally connected to the second terminal of the thermo harvester, a ferrite layer thermally connected to the metal layer, and an antenna layer thermally connected to the ferrite layer.

Abstract: Various embodiments provide a chip. The chip has a carrier, an integrated circuit formed above the carrier, and an energy storage element. The energy storage element has a first electrode and a second electrode and is used to supply the integrated circuit with electrical energy. The carrier, the integrated circuit and the energy storage element are monolithically formed, the first electrode being formed from the carrier.

Abstract: Embodiments relate to intelligent sensing devices, systems, and methods for the measurement of a wide variety of parameters. In embodiments, an intelligent sensing device includes at least one sensor configured to measure a characteristic proximate the sensing device as a data parameter, an integrated circuit electrically coupled to the at least one sensor, the integrated circuit comprising memory and configured to store the data parameter in the memory, and an antenna electrically coupled to the integrated circuit and configured to transmit the data parameter stored in the memory to a remote device.

Abstract: In various embodiments, a chip arrangement includes a first chip having a first antenna which is monolithically integrated in the first chip and is intended to communicate with at least one of an external reader or an external writer; a second chip having a second antenna which is monolithically integrated in the second chip and is intended to communicate with the at least one of the external reader or the external writer; and a booster antenna which is coupled to the first antenna in a first coupling area in order to increase a range of the first antenna and is coupled to the second antenna in a second coupling area in order to increase a range of the second antenna.

Abstract: In various embodiments, a booster antenna for a chip arrangement, for example a smart card, is provided. The booster antenna can have: a first electrical circuit, which forms a first resonant circuit with a phase resonance; and a second electrical circuit, which forms a second resonant circuit with a phase resonance and/or absolute resonance; wherein the first electrical circuit and the second electrical circuit are coupled to one another.

Abstract: A circuit arrangement includes a first antenna configured to couple to an electromagnetic field from a first frequency band and a second antenna configured to couple to an electromagnetic field from a second frequency band, the second frequency band being different than the first frequency band. The first antenna is connected in series with the second antenna as an electrical supply line therefor.

Abstract: In various embodiments, a circuit arrangement is provided, including a first antenna tuned to a first frequency range, a second antenna tuned to a second frequency range being different from the first frequency range, a controller coupled to the first antenna and the second antenna, wherein the controller is configured to receive its operational power via at least one of the first antenna and the second antenna, and a deactivating structure configured to deactivate the communication of the controller via the second antenna upon reception of electromagnetic waves with the first frequency range via the first antenna.

Abstract: In various embodiments, a Radio Frequency Identification apparatus includes a coupling body having a metal material and a transponder chip configured to contactlessly transmit data. The transponder chip is physically coupled to the coupling body, has a storage element which stores the data, and has a first electrode which is at a distance from the coupling body. The coupling body is in the form of a second electrode for the transponder chip configured to couple the transponder chip to an external Radio Frequency Identification reader for reading the data.

Abstract: In various embodiments, a chip arrangement includes a first chip having a first antenna which is monolithically integrated in the first chip and is intended to communicate with at least one of an external reader or an external writer; a second chip having a second antenna which is monolithically integrated in the second chip and is intended to communicate with the at least one of the external reader or the external writer; and a booster antenna which is coupled to the first antenna in a first coupling area in order to increase a range of the first antenna and is coupled to the second antenna in a second coupling area in order to increase a range of the second antenna.

Abstract: Various embodiments provide a chip. The chip has a carrier, an integrated circuit formed above the carrier, and an energy storage element. The energy storage element has a first electrode and a second electrode and is used to supply the integrated circuit with electrical energy. The carrier, the integrated circuit and the energy storage element are monolithically formed, the first electrode being formed from the carrier.

Abstract: In various embodiments, a booster antenna for a chip arrangement is provided. The booster antenna includes: a first circuit, which forms a first resonant circuit; a second circuit, which forms a second resonant circuit, wherein the first circuit is electrically conductively connected to the second circuit; and a third circuit, which forms a third resonant circuit, wherein the third circuit is electrically conductively connected to the second circuit.

Abstract: In various embodiments, a booster antenna for a chip arrangement, for example a smart card, is provided. The booster antenna can have: a first electrical circuit, which forms a first resonant circuit with a phase resonance; and a second electrical circuit, which forms a second resonant circuit with a phase resonance and/or absolute resonance; wherein the first electrical circuit and the second electrical circuit are coupled to one another.