Abstract: A foil-based package and a method for manufacturing a foil-based package includes, among other things, a first and a second foil substrate. An electronic component is arranged between the two foil substrates in a sandwich-like manner. Due to the component thickness, there is a distance difference between the two foil substrates between the mounting area of the component and ears outside of the mounting area. The foil-based package and the method provides means for reducing and/or compensating a distance difference between the first foil substrate and the second foil substrate caused by the component thickness.

Abstract: The invention relates to a pump having a piezo diaphragm transducer arranged at a pump body of the pump, and to a method for producing a pump, wherein a piezo diaphragm transducer is mounted to a pump body, wherein the method, among other things, has providing a piezoceramic layer. In accordance with the invention, at least one piezo element is diced from the piezoceramic layer so that the at least one piezo element has a regular polygon shape having at least six corners. In addition, the method has forming the piezo diaphragm transducer by mounting the piezo element to a pump diaphragm.

Abstract: A foil-based package and a method for manufacturing a foil-based package includes, among other things, a first and a second foil substrate. An electronic component is arranged between the two foil substrates in a sandwich-like manner. Due to the component thickness, there is a distance difference between the two foil substrates between the mounting area of the component and ears outside of the mounting area. The foil-based package and the method provides means for reducing and/or compensating a distance difference between the first foil substrate and the second foil substrate caused by the component thickness.

Abstract: The invention relates to a method in which a layer compound having a substrate having an adhesive layer applied thereon at least in regions is provided. An opening extending through the substrate and through the adhesive layer is introduced therein in order to obtain a patterned layer compound. A microchip having an active region arranged on the outside of the chip is provided, wherein the active region is a sensor area or a radiation coupling-out area. In addition, in accordance with the invention, the microchip is arranged on the adhesive layer of the patterned layer compound such that the active region is exposed through the opening.

Abstract: The invention relates to a pump having a piezo diaphragm transducer arranged at a pump body of the pump, and to a method for producing a pump, wherein a piezo diaphragm transducer is mounted to a pump body, wherein the method, among other things, has providing a piezoceramic layer. In accordance with the invention, at least one piezo element is diced from the piezoceramic layer so that the at least one piezo element has a regular polygon shape having at least six corners. In addition, the method has forming the piezo diaphragm transducer by mounting the piezo element to a pump diaphragm.