Patents by Inventor Wan-An YANG

Wan-An YANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240124241
    Abstract: A transporting device can transport at least one product, the transporting device includes a mounting frame, a driving mechanism, a transmitting mechanism including a plurality of bent portions, a plurality of guiding mechanisms, and a supporting mechanism. Each guiding mechanism includes a rotating wheel and a guiding plate. Each bent portion is connected to the rotating wheel. The guiding plate is connected to the rotating wheel. The supporting mechanism can support the product. The driving mechanism is further connected to the rotating wheel and can drive the transmitting mechanism to rotate to drive the supporting mechanism to move. The driving mechanism is further connected to the guiding plate, the guiding plate and the rotating wheel can synchronously rotate to drive the supporting mechanism to pass through the bent portions. The present disclosure further provides a heating device.
    Type: Application
    Filed: December 27, 2023
    Publication date: April 18, 2024
    Inventors: Huan ZHANG, Qi KUANG, Hua WAN, Yi LIU, Wei-Wei WU, Jing-Chao YANG, Wen-Jin XIA
  • Publication number: 20240083971
    Abstract: The present description relates to covalent immune recruiters (CIRs) comprising an Fc receptor targeting domain (FTD), a covalent binding group (CBG), and a target binding domain (TBD), wherein on binding of the FTD to a cognate Fc receptor, the CBG forms a covalent bond with an amino acid in the Fc receptor. The present description also includes functionalized cells modified by covalent binding of the CIR, methods and uses thereof, for example, methods of functionalizing cells, and methods and uses of such cells for recognition of target cells.
    Type: Application
    Filed: August 15, 2023
    Publication date: March 14, 2024
    Inventors: Anthony Rullo, Yonghong Wan, Eden Kapcan, Zi Ling Yang
  • Patent number: 11832146
    Abstract: An electronic device includes an indoor positioner and a positioning engine server. The indoor positioner has an antenna array including a plurality of antenna units. The indoor positioner divides the antenna units into multiple antenna unit groups, receives a wireless signal from user equipment at each time point via the antenna unit groups, and calculates a plurality of angles of arrival (AOA) corresponding to the antenna unit groups at each time point. The positioning engine server receives and stores the angles of arrival corresponding to the antenna unit groups at each time point, and filters the angles of arrival according to the angle sizes of the angles of arrival corresponding to the antenna unit groups at each time point stored in an observation period.
    Type: Grant
    Filed: March 17, 2021
    Date of Patent: November 28, 2023
    Assignee: QUANTA COMPUTER INC.
    Inventors: Po-Shan Kao, Cheng-Yang Tseng, Wan-An Yang, Yan-Cheng Chang
  • Patent number: 11800633
    Abstract: An inductor and a power module are respectively provided. The inductor includes an insulating body and a conductive body. The insulating body has a top surface and a bottom surface. The conductive body includes two pin parts and a heat dissipation part. A portion of each of the pin parts is exposed outside the bottom surface. The portions of the two pin parts exposed outside the insulating body are configured to fix to a circuit board. The heat dissipation part is connected to the two pin parts, the heat dissipation part is exposed outside the top surface, and the heat dissipation part is configured to connect to an external heat dissipation member. When the inductor is fixed to the circuit board through the two pin parts exposed outside the bottom surface, the two pin parts and the bottom surface jointly define an accommodating space for accommodating a chip.
    Type: Grant
    Filed: November 10, 2021
    Date of Patent: October 24, 2023
    Assignee: CHILISIN ELECTRONICS CORP.
    Inventors: Hung-Chih Liang, Pin-Yu Chen, Hsiu-Fa Yeh, Hang-Chun Lu, Ya-Wan Yang, Yu-Ting Hsu
  • Publication number: 20230131138
    Abstract: A multi-phase inductor structure is provided. The multi-phase inductor structure includes a first magnetic core, two second magnetic cores, and two first electrical conductors. The two second magnetic cores are respectively arranged on opposite sides of the first magnetic core, and each have a first engagement surface. A first annular convex wall and a first upright convex wall are formed on the first engagement surface, and a first recess is formed therebetween. The two first electrical conductors are respectively arranged in two of the first recesses of the first engagement surface, and each have has a first body and two first pins that are respectively connected to two ends of the first body. The two first pins extend in opposite directions. A magnetic permeability of the first magnetic core is different from a magnetic permeability of each of the two second magnetic cores.
    Type: Application
    Filed: March 14, 2022
    Publication date: April 27, 2023
    Inventors: HUNG-CHIH LIANG, PIN-YU CHEN, HSIU-FA YEH, HANG-CHUN LU, YA-WAN YANG, YU-TING HSU, WEI-ZHI HUANG
  • Publication number: 20220183142
    Abstract: An inductor and a power module are respectively provided. The inductor includes an insulating body and a conductive body. The insulating body has a top surface and a bottom surface. The conductive body includes two pin parts and a heat dissipation part. A portion of each of the pin parts is exposed outside the bottom surface. The portions of the two pin parts exposed outside the insulating body are configured to fix to a circuit board. The heat dissipation part is connected to the two pin parts, the heat dissipation part is exposed outside the top surface, and the heat dissipation part is configured to connect to an external heat dissipation member. When the inductor is fixed to the circuit board through the two pin parts exposed outside the bottom surface, the two pin parts and the bottom surface jointly define an accommodating space for accommodating a chip.
    Type: Application
    Filed: November 10, 2021
    Publication date: June 9, 2022
    Inventors: HUNG-CHIH LIANG, PIN-YU CHEN, HSIU-FA YEH, HANG-CHUN LU, YA-WAN YANG, YU-TING HSU
  • Publication number: 20220141617
    Abstract: An electronic device includes an indoor positioner and a positioning engine server. The indoor positioner has an antenna array including a plurality of antenna units. The indoor positioner divides the antenna units into multiple antenna unit groups, receives a wireless signal from user equipment at each time point via the antenna unit groups, and calculates a plurality of angles of arrival (AOA) corresponding to the antenna unit groups at each time point. The positioning engine server receives and stores the angles of arrival corresponding to the antenna unit groups at each time point, and filters the angles of arrival according to the angle sizes of the angles of arrival corresponding to the antenna unit groups at each time point stored in an observation period.
    Type: Application
    Filed: March 17, 2021
    Publication date: May 5, 2022
    Inventors: Po-Shan KAO, Cheng-Yang TSENG, Wan-An YANG, Yan-Cheng CHANG
  • Patent number: 11290847
    Abstract: An electronic device includes an indoor positioner and a positioning engine server. The indoor positioner has an array antenna to receive a wireless signal from user equipment, and to calculate the angle of arrival (AOA) of the wireless signal according to the phase difference and the time difference. The wireless signal includes status data of the user equipment. The positioning engine server converts the angle of arrival into a set of coordinates that correspond to a position of the user equipment, and inputs the set of coordinates to an IMM module. The IMM module includes a first state module and a second state module. The IMM module calculates weighting values for the first state module and the second state module according to the status data of the user equipment, and outputs an estimated set of coordinates according to the set of coordinates and the weighting values.
    Type: Grant
    Filed: September 8, 2020
    Date of Patent: March 29, 2022
    Assignee: QUANTA COMPUTER INC.
    Inventors: Shu-Wei Yeh, Po-Shan Kao, Chiao-Wei Lu, Wan-An Yang
  • Publication number: 20210400435
    Abstract: An electronic device includes an indoor positioner and a positioning engine server. The indoor positioner has an array antenna to receive a wireless signal from user equipment, and to calculate the angle of arrival (AOA) of the wireless signal according to the phase difference and the time difference. The wireless signal includes status data of the user equipment. The positioning engine server converts the angle of arrival into a set of coordinates that correspond to a position of the user equipment, and inputs the set of coordinates to an IMM module. The IMM module includes a first state module and a second state module. The IMM module calculates weighting values for the first state module and the second state module according to the status data of the user equipment, and outputs an estimated set of coordinates according to the set of coordinates and the weighting values.
    Type: Application
    Filed: September 8, 2020
    Publication date: December 23, 2021
    Inventors: Shu-Wei YEH, Po-Shan KAO, Chiao-Wei LU, Wan-An YANG
  • Patent number: 11048286
    Abstract: A clutch pedal effort reduction structure using a detent may include: a pedal arm to rotate with respect to a hinge fixed to a vehicle body; and a spring module to reduce a pedal effort when the pedal arm rotates with respect to the hinge. In particular, the pedal arm includes a pedal arm groove provided with one or more curved portions having a curvature and rotates depending on a rotation of the pedal arm, and the spring module includes a support portion held in close contact with the pedal arm groove so as to be in contact with the one or more curved portions when the pedal arm rotates. And a force by which the spring module presses the pedal arm is changed according to a curvature of the curved portions which the support portion is in contact with when the pedal arm is operated.
    Type: Grant
    Filed: November 15, 2019
    Date of Patent: June 29, 2021
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Chang-Wan Yang, Ju-San Kim
  • Patent number: 10810012
    Abstract: An apparatus includes a memory and a circuit. The memory may be configured to store a first array of data values, a second array of first modification values, and a third array of second modification values. The circuit may be configured to (a) calculate a plurality of window values for each window position of a first sliding window as the first sliding window is stepped by a predetermined step size along a particular axis of the first array of data values, and (b) calculate the first and the second modification values by summing portions of the first array of data values that correspond to the predetermined step size of the first sliding window.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: October 20, 2020
    Assignee: Ambarella International LP
    Inventors: Wen Wan Yang, Peter Verplaetse
  • Publication number: 20200257328
    Abstract: A clutch pedal effort reduction structure using a detent may include: a pedal arm to rotate with respect to a hinge fixed to a vehicle body; and a spring module to reduce a pedal effort when the pedal arm rotates with respect to the hinge. In particular, the pedal arm includes a pedal arm groove provided with one or more curved portions having a curvature and rotates depending on a rotation of the pedal arm, and the spring module includes a support portion held in close contact with the pedal arm groove so as to be in contact with the one or more curved portions when the pedal arm rotates. And a force by which the spring module presses the pedal arm is changed according to a curvature of the curved portions which the support portion is in contact with when the pedal arm is operated.
    Type: Application
    Filed: November 15, 2019
    Publication date: August 13, 2020
    Applicants: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Chang-Wan YANG, Ju-San KIM
  • Patent number: 10608426
    Abstract: High temperature protection system includes a thermal detection and control circuit, a pulse width modulation signal output circuit, a driving circuit, and a coil module. The thermal detection and control circuit is used for detecting a temperature and outputting at least one corresponding control signal. The pulse width modulation signal output circuit is coupled to the thermal detection and control circuit for generating a pulse width modulation signal according to the at least one control signal. The driving circuit is coupled to the pulse width modulation signal for generating at least one driving voltage. The coil module is coupled to the driving circuit and is operated according to the at least one driving voltage.
    Type: Grant
    Filed: November 21, 2016
    Date of Patent: March 31, 2020
    Assignee: Prolific Technology Inc.
    Inventors: Wan-Yang Chen, Chih-Shih Yang, Jia-Jun Liu
  • Patent number: 10552151
    Abstract: An apparatus including a memory and a circuit. The memory may be configured to store a multidimensional array of data values. The circuit may be configured to (i) fetch a plurality of data vectors from the memory, where each of the data vectors comprises a plurality of the data values, (ii) calculate a plurality of modification values based on the data values, (iii) calculate a first value of a first window based on the data values, and (iv) calculate a second value of a second window by adding to the first value of the first window a next one of the modification values and subtracting from the first value of the first window a previous one of the modification values. The second window generally overlaps the first window in the multidimensional array along a particular axis.
    Type: Grant
    Filed: December 8, 2016
    Date of Patent: February 4, 2020
    Assignee: Ambarella, Inc.
    Inventors: Wen Wan Yang, Peter Verplaetse
  • Patent number: 10446511
    Abstract: A fan-out structure and its manufacturing method are presented, relating to semiconductor techniques. The fan-out structure includes a welding pad; a welding pad extension member contacting the welding pad; and a fan-out line contacting the welding pad extension member, with an elicitation direction of the fan-out line perpendicular to an extension direction of the welding pad. This fan-out structure allows the fan-out line to be horizontally or vertically elicited from the welding pad, and thus remedies the drawbacks associated with an aslant-elicited fan-out line in conventional fan-out structures.
    Type: Grant
    Filed: May 16, 2018
    Date of Patent: October 15, 2019
    Assignees: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION, SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
    Inventors: Hong Zhang, Hae Wan Yang, Yong Bin Huang, Qian Zhou, Chao Feng Zhou
  • Patent number: 10338652
    Abstract: A high voltage protection system includes a high voltage processing circuit, a pulse width modulation signal outputting circuit, a driving circuit, and a coil module. The high voltage processing circuit is used for receiving and processing a high voltage. The pulse width modulation signal output circuit is coupled to the high voltage processing circuit for generating a pulse width modulation signal. The driving circuit is coupled to the pulse width modulation signal outputting circuit for receiving the pulse width modulation signal and generating a driving voltage accordingly. The coil module is coupled to the driving circuit and is operated according to the driving voltage.
    Type: Grant
    Filed: April 17, 2016
    Date of Patent: July 2, 2019
    Assignee: Prolific Technology Inc.
    Inventors: Wan-Yang Chen, Chih-Shih Yang, Jia-Jun Liu
  • Patent number: 10177162
    Abstract: A method is provided for fabricating a semiconductor memory device. The method includes providing a substrate and forming a stacked layer on the substrate, where the stacked layer includes a tunneling dielectric layer and a floating gate layer sequentially formed on the substrate. The method also includes forming a plurality of stacked structures by etching the stacked layer and the substrate, where the spacing between the adjacent stacked structures forms a plurality of parallel first trenches. In addition, the method includes forming a plurality of second trenches and forming a plurality of third trenches. Moreover, the method includes forming a second dielectric layer on the floating gate layer and the side wall and bottom of the third trenches and forming a control gate layer on the second dielectric layer. Further, the method includes forming a plurality of fourth trenches and removing the sacrificial layer along the fourth trenches.
    Type: Grant
    Filed: February 6, 2018
    Date of Patent: January 8, 2019
    Assignees: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION, SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
    Inventors: Guan Hua Li, Hae Wan Yang, Sheng Fen Chiu
  • Publication number: 20180337152
    Abstract: A fan-out structure and its manufacturing method are presented, relating to semiconductor techniques. The fan-out structure includes a welding pad; a welding pad extension member contacting the welding pad; and a fan-out line contacting the welding pad extension member, with an elicitation direction of the fan-out line perpendicular to an extension direction of the welding pad. This fan-out structure allows the fan-out line to be horizontally or vertically elicited from the welding pad, and thus remedies the drawbacks associated with an aslant-elicited fan-out line in conventional fan-out structures.
    Type: Application
    Filed: May 16, 2018
    Publication date: November 22, 2018
    Inventors: Hong ZHANG, Hae Wan YANG, Yong Bin HUANG, Qian ZHOU, Chao Feng ZHOU
  • Publication number: 20180158832
    Abstract: A method is provided for fabricating a semiconductor memory device. The method includes providing a substrate and forming a stacked layer on the substrate, where the stacked layer includes a tunneling dielectric layer and a floating gate layer sequentially formed on the substrate. The method also includes forming a plurality of stacked structures by etching the stacked layer and the substrate, where the spacing between the adjacent stacked structures forms a plurality of parallel first trenches. In addition, the method includes forming a plurality of second trenches and forming a plurality of third trenches. Moreover, the method includes forming a second dielectric layer on the floating gate layer and the side wall and bottom of the third trenches and forming a control gate layer on the second dielectric layer. Further, the method includes forming a plurality of fourth trenches and removing the sacrificial layer along the fourth trenches.
    Type: Application
    Filed: February 6, 2018
    Publication date: June 7, 2018
    Inventors: Guan Hua LI, Hae Wan YANG, Sheng Fen CHIU
  • Patent number: D991470
    Type: Grant
    Filed: October 3, 2022
    Date of Patent: July 4, 2023
    Inventor: William Wan Yang