Abstract: A semiconductor device having a tubular part is able to prevent the solder from spattering when soldering the tubular part. The semiconductor device has a insulated substrate that has a circuit layer on a front surface thereof, a tubular part that is soldered to the circuit layer, and an external terminal that is inserted into the tubular part and connected electrically to the tubular part. The tubular part has a cylinder portion and a flange portion that is connected to one longitudinal end of the cylinder portion. The flange portion has a first projection, a second projection and a third projection that face the circuit layer. The distance between the first projection and the second projection, the distance between the second projection and the third projection, and the distance between the third projection and the first projection each are greater than the inner diameter of the cylinder portion.

Abstract: A semiconductor device having a tubular part is able to prevent the solder from spattering when soldering the tubular part. The semiconductor device has a insulated substrate that has a circuit layer on a front surface thereof, a tubular part that is soldered to the circuit layer, and an external terminal that is inserted into the tubular part and connected electrically to the tubular part. The tubular part has a cylinder portion and a flange portion that is connected to one longitudinal end of the cylinder portion. The flange portion has a first projection, a second projection and a third projection that face the circuit layer. The distance between the first projection and the second projection, the distance between the second projection and the third projection, and the distance between the third projection and the first projection each are greater than the inner diameter of the cylinder portion.