Abstract: A circuit board having a substrate, a first metal layer, a second metal layer and a solder mask layer. The first metal layer and the second metal layer with unequal surface areas spacedly arranged on the substrate and respectively providing a first solderable region and a second solderable region with equal surface areas. The solder mask layer having an opening and covered on the substrate, the first metal layer and the second metal layer to expose the first solderable region and the second solderable region. Besides, the first metal layer further provides a window abutted to the first solderable region, and the opening exposes a first blank region and a second blank region. Thus, the problem of unequal solder regions due to offset of the solder mask layer can be avoided, and improving the yield rate of the fabrication process.

Abstract: A circuit board having a substrate, a first metal layer, a second metal layer and a solder mask layer. The first metal layer and the second metal layer with unequal surface areas spacedly arranged on the substrate and respectively providing a first solderable region and a second solderable region with equal surface areas. The solder mask layer having an opening and covered on the substrate, the first metal layer and the second metal layer to expose the first solderable region and the second solderable region. Besides, the first metal layer further provides a window abutted to the first solderable region, and the opening exposes a first blank region and a second blank region. Thus, the problem of unequal solder regions due to offset of the solder mask layer can be avoided, and improving the yield rate of the fabrication process.

Abstract: A method for forming solder bodies on a substrate includes: positioning a first mask plate, which is formed with at least one first through-hole, on the substrate; filling the first through-hole with a first solder paste so as to form a first solder body on the substrate; positioning a second mask plate, which is formed with at least one second through-hole and at least one recess spaced apart from the second through-hole, on the substrate in such a manner that the first solder body is received in the recess; and filling the second through-hole with a second solder paste so as to form a second solder body on the substrate.

Abstract: A method for forming solder bodies on a substrate includes: positioning a first mask plate, which is formed with at least one first through-hole, on the substrate; filling the first through-hole with a first solder paste so as to form a first solder body on the substrate; positioning a second mask plate, which is formed with at least one second through-hole and at least one recess spaced apart from the second through-hole, on the substrate in such a manner that the first solder body is received in the recess; and filling the second through-hole with a second solder paste so as to form a second solder body on the substrate.