Patents by Inventor Wan-Chen HUANG
Wan-Chen HUANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230246047Abstract: An image sensor includes a substrate, a first photosensitive unit, a second photosensitive unit, a buffer layer, a dielectric grid, a first color filter, and a second color filter. The first photosensitive unit and the second photosensitive unit are in the substrate. The buffer layer covers the substrate, the first photosensitive unit and the second photosensitive unit. The dielectric grid is over the buffer layer and between the first photosensitive unit and the second photosensitive unit. The dielectric grid has a round top surface. The first color filter is over the first photosensitive unit. The first color filter is in contact with the round top surface and the buffer layer. The second color filter is over the second photosensitive unit.Type: ApplicationFiled: April 10, 2023Publication date: August 3, 2023Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yun-Wei CHENG, Chun-Hao CHOU, Yin-Chieh HUANG, Wan-Chen HUANG, Zhe-Ju LIU, Kuo-Cheng LEE, Chi-Cherng JENG
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Patent number: 11626435Abstract: An image sensor includes a substrate, a photosensitive unit in the substrate, a dielectric grid over the substrate, and a color filter over the photosensitive unit and surrounded by the dielectric grid. The dielectric grid has a first portion and a second portion over the first portion, and the second portion of the dielectric grid has a rounded top surface extending upwards from a sidewall of the first portion of the dielectric grid. The color filter has a first portion lower than a lowermost portion of the rounded top surface of the second portion of the dielectric grid and a second portion higher than the lowermost portion of the rounded top surface of the second portion of the dielectric grid.Type: GrantFiled: September 11, 2020Date of Patent: April 11, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yun-Wei Cheng, Chun-Hao Chou, Yin-Chieh Huang, Wan-Chen Huang, Zhe-Ju Liu, Kuo-Cheng Lee, Chi-Cherng Jeng
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Patent number: 11447751Abstract: A method of circulating tumor cells isolation, using an isolating cultural system of circulating tumor cells, comprises the following steps: (1) providing a sample; (2) adding a cell culture medium to the isolating cultural system of circulating tumor cells; (3) adding the sample to the isolating cultural system of circulating tumor cells to cultivate; and (4) collecting the suspended circulating tumor cells in the cell culture medium; wherein the isolating cultural system of circulating tumor cells comprises a container including a cell adhesion portion, and cellulose coated on the cell adhesion portion.Type: GrantFiled: September 4, 2019Date of Patent: September 20, 2022Assignee: NATIONAL TAIWAN UNIVERSITYInventors: Tai-Horng Young, Wan-Chen Huang, Hao-Ying Hsieh, Shyh-Chyi Lo, Ke-Cheng Chen, Jin-Shing Chen, Yin-Tzu Chen
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Publication number: 20200411575Abstract: An image sensor includes a substrate, a photosensitive unit in the substrate, a dielectric grid over the substrate, and a color filter over the photosensitive unit and surrounded by the dielectric grid. The dielectric grid has a first portion and a second portion over the first portion, and the second portion of the dielectric grid has a rounded top surface extending upwards from a sidewall of the first portion of the dielectric grid. The color filter has a first portion lower than a lowermost portion of the rounded top surface of the second portion of the dielectric grid and a second portion higher than the lowermost portion of the rounded top surface of the second portion of the dielectric grid.Type: ApplicationFiled: September 11, 2020Publication date: December 31, 2020Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yun-Wei CHENG, Chun-Hao CHOU, Yin-Chieh HUANG, Wan-Chen HUANG, Zhe-Ju LIU, Kuo-Cheng LEE, Chi-Cherng JENG
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Patent number: 10777592Abstract: An image sensor includes a substrate, a photosensitive unit, a first grid and a color filter. The photosensitive unit is located within the substrate. The first grid is located above the substrate, and the first grid has a first portion and a second portion above the first portion, wherein the second portion has a rounded top surface extending from a sidewall of the first portion of the first grid. The color filter is located above the photosensitive unit and in contact with the rounded top surface of the second portion of the first grid.Type: GrantFiled: May 21, 2018Date of Patent: September 15, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yun-Wei Cheng, Chun-Hao Chou, Yin-Chieh Huang, Wan-Chen Huang, Zhe-Ju Liu, Kuo-Cheng Lee, Chi-Cherng Jeng
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Publication number: 20200095555Abstract: A method of circulating tumor cells isolation, using an isolating cultural system of circulating tumor cells, comprises the following steps: (1) providing a sample; (2) adding a cell culture medium to the isolating cultural system of circulating tumor cells; (3) adding the sample to the isolating cultural system of circulating tumor cells to cultivate; and (4) collecting the suspended circulating tumor cells in the cell culture medium; wherein the isolating cultural system of circulating tumor cells comprises a container including a cell adhesion portion, and cellulose coated on the cell adhesion portion.Type: ApplicationFiled: September 4, 2019Publication date: March 26, 2020Inventors: TAI-HORNG YOUNG, WAN-CHEN HUANG, HAO-YING HSIEH, SHYH-CHYI LO, KE-CHENG CHEN, Jin-Shing Chen, YIN-TZU CHEN
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Patent number: 10475826Abstract: A thin film transistor includes a gate electrode, a semiconductor layer, a gate dielectric layer, a first dielectric layer, a source electrode, and a drain electrode. The gate electrode is disposed on a substrate. The semiconductor layer is disposed on the substrate and overlaps with the gate electrode. The gate dielectric layer is disposed between the gate electrode and the semiconductor layer. The first dielectric layer is disposed on the substrate and covers two sides of the gate electrode or the semiconductor layer. The dielectric constant of the first dielectric layer is less than the dielectric constant of the gate dielectric layer, and the dielectric constant of the first dielectric layer is less than 4. The source electrode and the drain electrode are disposed on the substrate. The source electrode is separated from the drain electrode, and the source electrode and the drain electrode separately contact the semiconductor layer.Type: GrantFiled: May 4, 2018Date of Patent: November 12, 2019Assignee: AU OPTRONICS CORPORATIONInventors: Shuo-Yang Sun, Yu-Hsing Liang, Wan-Chen Huang, Chun-Cheng Cheng
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Publication number: 20180331130Abstract: A thin film transistor includes a gate electrode, a semiconductor layer, a gate dielectric layer, a first dielectric layer, a source electrode, and a drain electrode. The gate electrode is disposed on a substrate. The semiconductor layer is disposed on the substrate and overlaps with the gate electrode. The gate dielectric layer is disposed between the gate electrode and the semiconductor layer. The first dielectric layer is disposed on the substrate and covers two sides of the gate electrode or the semiconductor layer. The dielectric constant of the first dielectric layer is less than the dielectric constant of the gate dielectric layer, and the dielectric constant of the first dielectric layer is less than 4. The source electrode and the drain electrode are disposed on the substrate. The source electrode is separated from the drain electrode, and the source electrode and the drain electrode separately contact the semiconductor layer.Type: ApplicationFiled: May 4, 2018Publication date: November 15, 2018Inventors: Shuo-Yang SUN, Yu-Hsing LIANG, Wan-Chen HUANG, Chun-Cheng CHENG
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Publication number: 20180277582Abstract: An image sensor includes a substrate, a photosensitive unit, a first grid and a color filter. The photosensitive unit is located within the substrate. The first grid is located above the substrate, and the first grid has a first portion and a second portion above the first portion, wherein the second portion has a rounded top surface extending from a sidewall of the first portion of the first grid. The color filter is located above the photosensitive unit and in contact with the rounded top surface of the second portion of the first grid.Type: ApplicationFiled: May 21, 2018Publication date: September 27, 2018Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yun-Wei CHENG, Chun-Hao CHOU, Yin-Chieh HUANG, Wan-Chen HUANG, Zhe-Ju LIU, Kuo-Cheng LEE, Chi-Cherng JENG
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Patent number: 9978790Abstract: An image sensor is provided including a substrate, an array of photosensitive units, a grid and a plurality of color filters. In the image sensor, the grid has a first portion and a second portion disposed on the first portion. The second portion of the grid can cause reflection or refraction of incident lights targeted for one image sensor element back into the same image sensor element, so as to avoid crosstalk occurred. Further, a method for manufacturing the image sensor also provides herein.Type: GrantFiled: November 14, 2013Date of Patent: May 22, 2018Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yun-Wei Cheng, Chun-Hao Chou, Yin-Chieh Huang, Wan-Chen Huang, Zhe-Ju Liu, Kuo-Cheng Lee, Chi-Cherng Jeng
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Patent number: 9608021Abstract: An image sensor is provided including a substrate, an array of photosensitive units, a grid, a light-tight layer and a plurality of color filters. In the image sensor, the grid has a top surface, and the light-tight layer is disposed on the top surface of the grid. Due to the light-tight layer on the grid, an incident light entering into the grid can be blocked by the light-tight layer, so that the crosstalk effect is reduced significantly. Further, a method for manufacturing the image sensor also provides herein.Type: GrantFiled: November 14, 2013Date of Patent: March 28, 2017Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yun-Wei Cheng, Zhe-Ju Liu, Kuo-Cheng Lee, Chi-Cherng Jeng, Chun-Hao Chou, Yin-Chieh Huang, Wan-Chen Huang
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Patent number: 9278512Abstract: A substrate bonding and debonding method includes the steps of: providing a substrate; forming a first silicone glue layer on a peel-off region of the substrate and a second silicone glue layer on a peripheral region of the substrate, in which the first and second silicone glue layers contain the same silicone main agent and silicone curing agent in a different ratio; adhering an opposite substrate to the first and second silicone glue layers; curing the first and second silicone glue layers to bond the substrate to the opposite substrate; and separating a portion of the substrate from the opposite substrate.Type: GrantFiled: January 29, 2014Date of Patent: March 8, 2016Assignee: AU OPTRONICS CORPORATIONInventors: Shuo-Yang Sun, Wan-Chen Huang, Wei-Ting Lin, Chun-Cheng Cheng
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Publication number: 20150130002Abstract: An image sensor is provided including a substrate, an array of photosensitive units, a grid, a light-tight layer and a plurality of color filters. In the image sensor, the grid has a top surface, and the light-tight layer is disposed on the top surface of the grid. Due to the light-tight layer on the grid, an incident light entering into the grid can be blocked by the light-tight layer, so that the crosstalk effect is reduced significantly. Further, a method for manufacturing the image sensor also provides herein.Type: ApplicationFiled: November 14, 2013Publication date: May 14, 2015Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yun-Wei CHENG, Zhe-Ju LIU, Kuo-Cheng LEE, Chi-Cherng JENG, Chun-Hao CHOU, Yin-Chieh HUANG, Wan-Chen HUANG
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Publication number: 20150130001Abstract: An image sensor is provided including a substrate, an array of photosensitive units, a grid and a plurality of color filters. In the image sensor, the grid has a first portion and a second portion disposed on the first portion. The second portion of the grid can cause reflection or refraction of incident lights targeted for one image sensor element back into the same image sensor element, so as to avoid crosstalk occurred. Further, a method for manufacturing the image sensor also provides herein.Type: ApplicationFiled: November 14, 2013Publication date: May 14, 2015Inventors: Yun-Wei CHENG, Chun-Hao CHOU, Yin-Chieh HUANG, Wan-Chen Huang, Zhe-Ju LIU, Kuo-Cheng LEE, Chi-Cherng JENG
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Publication number: 20150083312Abstract: A substrate bonding and debonding method includes the steps of: providing a substrate; forming a first silicone glue layer on a peel-off region of the substrate and a second silicone glue layer on a peripheral region of the substrate, in which the first and second silicone glue layers contain the same silicone main agent and silicone curing agent in a different ratio; adhering an opposite substrate to the first and second silicone glue layers; curing the first and second silicone glue layers to bond the substrate to the opposite substrate; and separating a portion of the substrate from the opposite substrate.Type: ApplicationFiled: January 29, 2014Publication date: March 26, 2015Applicant: AU Optronics CorporationInventors: Shuo-Yang SUN, Wan-Chen HUANG, Wei-Ting LIN, Chun-Cheng CHENG