Patents by Inventor Wan-Chen HUANG

Wan-Chen HUANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230246047
    Abstract: An image sensor includes a substrate, a first photosensitive unit, a second photosensitive unit, a buffer layer, a dielectric grid, a first color filter, and a second color filter. The first photosensitive unit and the second photosensitive unit are in the substrate. The buffer layer covers the substrate, the first photosensitive unit and the second photosensitive unit. The dielectric grid is over the buffer layer and between the first photosensitive unit and the second photosensitive unit. The dielectric grid has a round top surface. The first color filter is over the first photosensitive unit. The first color filter is in contact with the round top surface and the buffer layer. The second color filter is over the second photosensitive unit.
    Type: Application
    Filed: April 10, 2023
    Publication date: August 3, 2023
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yun-Wei CHENG, Chun-Hao CHOU, Yin-Chieh HUANG, Wan-Chen HUANG, Zhe-Ju LIU, Kuo-Cheng LEE, Chi-Cherng JENG
  • Patent number: 11626435
    Abstract: An image sensor includes a substrate, a photosensitive unit in the substrate, a dielectric grid over the substrate, and a color filter over the photosensitive unit and surrounded by the dielectric grid. The dielectric grid has a first portion and a second portion over the first portion, and the second portion of the dielectric grid has a rounded top surface extending upwards from a sidewall of the first portion of the dielectric grid. The color filter has a first portion lower than a lowermost portion of the rounded top surface of the second portion of the dielectric grid and a second portion higher than the lowermost portion of the rounded top surface of the second portion of the dielectric grid.
    Type: Grant
    Filed: September 11, 2020
    Date of Patent: April 11, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yun-Wei Cheng, Chun-Hao Chou, Yin-Chieh Huang, Wan-Chen Huang, Zhe-Ju Liu, Kuo-Cheng Lee, Chi-Cherng Jeng
  • Patent number: 11447751
    Abstract: A method of circulating tumor cells isolation, using an isolating cultural system of circulating tumor cells, comprises the following steps: (1) providing a sample; (2) adding a cell culture medium to the isolating cultural system of circulating tumor cells; (3) adding the sample to the isolating cultural system of circulating tumor cells to cultivate; and (4) collecting the suspended circulating tumor cells in the cell culture medium; wherein the isolating cultural system of circulating tumor cells comprises a container including a cell adhesion portion, and cellulose coated on the cell adhesion portion.
    Type: Grant
    Filed: September 4, 2019
    Date of Patent: September 20, 2022
    Assignee: NATIONAL TAIWAN UNIVERSITY
    Inventors: Tai-Horng Young, Wan-Chen Huang, Hao-Ying Hsieh, Shyh-Chyi Lo, Ke-Cheng Chen, Jin-Shing Chen, Yin-Tzu Chen
  • Publication number: 20200411575
    Abstract: An image sensor includes a substrate, a photosensitive unit in the substrate, a dielectric grid over the substrate, and a color filter over the photosensitive unit and surrounded by the dielectric grid. The dielectric grid has a first portion and a second portion over the first portion, and the second portion of the dielectric grid has a rounded top surface extending upwards from a sidewall of the first portion of the dielectric grid. The color filter has a first portion lower than a lowermost portion of the rounded top surface of the second portion of the dielectric grid and a second portion higher than the lowermost portion of the rounded top surface of the second portion of the dielectric grid.
    Type: Application
    Filed: September 11, 2020
    Publication date: December 31, 2020
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yun-Wei CHENG, Chun-Hao CHOU, Yin-Chieh HUANG, Wan-Chen HUANG, Zhe-Ju LIU, Kuo-Cheng LEE, Chi-Cherng JENG
  • Patent number: 10777592
    Abstract: An image sensor includes a substrate, a photosensitive unit, a first grid and a color filter. The photosensitive unit is located within the substrate. The first grid is located above the substrate, and the first grid has a first portion and a second portion above the first portion, wherein the second portion has a rounded top surface extending from a sidewall of the first portion of the first grid. The color filter is located above the photosensitive unit and in contact with the rounded top surface of the second portion of the first grid.
    Type: Grant
    Filed: May 21, 2018
    Date of Patent: September 15, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yun-Wei Cheng, Chun-Hao Chou, Yin-Chieh Huang, Wan-Chen Huang, Zhe-Ju Liu, Kuo-Cheng Lee, Chi-Cherng Jeng
  • Publication number: 20200095555
    Abstract: A method of circulating tumor cells isolation, using an isolating cultural system of circulating tumor cells, comprises the following steps: (1) providing a sample; (2) adding a cell culture medium to the isolating cultural system of circulating tumor cells; (3) adding the sample to the isolating cultural system of circulating tumor cells to cultivate; and (4) collecting the suspended circulating tumor cells in the cell culture medium; wherein the isolating cultural system of circulating tumor cells comprises a container including a cell adhesion portion, and cellulose coated on the cell adhesion portion.
    Type: Application
    Filed: September 4, 2019
    Publication date: March 26, 2020
    Inventors: TAI-HORNG YOUNG, WAN-CHEN HUANG, HAO-YING HSIEH, SHYH-CHYI LO, KE-CHENG CHEN, Jin-Shing Chen, YIN-TZU CHEN
  • Patent number: 10475826
    Abstract: A thin film transistor includes a gate electrode, a semiconductor layer, a gate dielectric layer, a first dielectric layer, a source electrode, and a drain electrode. The gate electrode is disposed on a substrate. The semiconductor layer is disposed on the substrate and overlaps with the gate electrode. The gate dielectric layer is disposed between the gate electrode and the semiconductor layer. The first dielectric layer is disposed on the substrate and covers two sides of the gate electrode or the semiconductor layer. The dielectric constant of the first dielectric layer is less than the dielectric constant of the gate dielectric layer, and the dielectric constant of the first dielectric layer is less than 4. The source electrode and the drain electrode are disposed on the substrate. The source electrode is separated from the drain electrode, and the source electrode and the drain electrode separately contact the semiconductor layer.
    Type: Grant
    Filed: May 4, 2018
    Date of Patent: November 12, 2019
    Assignee: AU OPTRONICS CORPORATION
    Inventors: Shuo-Yang Sun, Yu-Hsing Liang, Wan-Chen Huang, Chun-Cheng Cheng
  • Publication number: 20180331130
    Abstract: A thin film transistor includes a gate electrode, a semiconductor layer, a gate dielectric layer, a first dielectric layer, a source electrode, and a drain electrode. The gate electrode is disposed on a substrate. The semiconductor layer is disposed on the substrate and overlaps with the gate electrode. The gate dielectric layer is disposed between the gate electrode and the semiconductor layer. The first dielectric layer is disposed on the substrate and covers two sides of the gate electrode or the semiconductor layer. The dielectric constant of the first dielectric layer is less than the dielectric constant of the gate dielectric layer, and the dielectric constant of the first dielectric layer is less than 4. The source electrode and the drain electrode are disposed on the substrate. The source electrode is separated from the drain electrode, and the source electrode and the drain electrode separately contact the semiconductor layer.
    Type: Application
    Filed: May 4, 2018
    Publication date: November 15, 2018
    Inventors: Shuo-Yang SUN, Yu-Hsing LIANG, Wan-Chen HUANG, Chun-Cheng CHENG
  • Publication number: 20180277582
    Abstract: An image sensor includes a substrate, a photosensitive unit, a first grid and a color filter. The photosensitive unit is located within the substrate. The first grid is located above the substrate, and the first grid has a first portion and a second portion above the first portion, wherein the second portion has a rounded top surface extending from a sidewall of the first portion of the first grid. The color filter is located above the photosensitive unit and in contact with the rounded top surface of the second portion of the first grid.
    Type: Application
    Filed: May 21, 2018
    Publication date: September 27, 2018
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yun-Wei CHENG, Chun-Hao CHOU, Yin-Chieh HUANG, Wan-Chen HUANG, Zhe-Ju LIU, Kuo-Cheng LEE, Chi-Cherng JENG
  • Patent number: 9978790
    Abstract: An image sensor is provided including a substrate, an array of photosensitive units, a grid and a plurality of color filters. In the image sensor, the grid has a first portion and a second portion disposed on the first portion. The second portion of the grid can cause reflection or refraction of incident lights targeted for one image sensor element back into the same image sensor element, so as to avoid crosstalk occurred. Further, a method for manufacturing the image sensor also provides herein.
    Type: Grant
    Filed: November 14, 2013
    Date of Patent: May 22, 2018
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yun-Wei Cheng, Chun-Hao Chou, Yin-Chieh Huang, Wan-Chen Huang, Zhe-Ju Liu, Kuo-Cheng Lee, Chi-Cherng Jeng
  • Patent number: 9608021
    Abstract: An image sensor is provided including a substrate, an array of photosensitive units, a grid, a light-tight layer and a plurality of color filters. In the image sensor, the grid has a top surface, and the light-tight layer is disposed on the top surface of the grid. Due to the light-tight layer on the grid, an incident light entering into the grid can be blocked by the light-tight layer, so that the crosstalk effect is reduced significantly. Further, a method for manufacturing the image sensor also provides herein.
    Type: Grant
    Filed: November 14, 2013
    Date of Patent: March 28, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yun-Wei Cheng, Zhe-Ju Liu, Kuo-Cheng Lee, Chi-Cherng Jeng, Chun-Hao Chou, Yin-Chieh Huang, Wan-Chen Huang
  • Patent number: 9278512
    Abstract: A substrate bonding and debonding method includes the steps of: providing a substrate; forming a first silicone glue layer on a peel-off region of the substrate and a second silicone glue layer on a peripheral region of the substrate, in which the first and second silicone glue layers contain the same silicone main agent and silicone curing agent in a different ratio; adhering an opposite substrate to the first and second silicone glue layers; curing the first and second silicone glue layers to bond the substrate to the opposite substrate; and separating a portion of the substrate from the opposite substrate.
    Type: Grant
    Filed: January 29, 2014
    Date of Patent: March 8, 2016
    Assignee: AU OPTRONICS CORPORATION
    Inventors: Shuo-Yang Sun, Wan-Chen Huang, Wei-Ting Lin, Chun-Cheng Cheng
  • Publication number: 20150130002
    Abstract: An image sensor is provided including a substrate, an array of photosensitive units, a grid, a light-tight layer and a plurality of color filters. In the image sensor, the grid has a top surface, and the light-tight layer is disposed on the top surface of the grid. Due to the light-tight layer on the grid, an incident light entering into the grid can be blocked by the light-tight layer, so that the crosstalk effect is reduced significantly. Further, a method for manufacturing the image sensor also provides herein.
    Type: Application
    Filed: November 14, 2013
    Publication date: May 14, 2015
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yun-Wei CHENG, Zhe-Ju LIU, Kuo-Cheng LEE, Chi-Cherng JENG, Chun-Hao CHOU, Yin-Chieh HUANG, Wan-Chen HUANG
  • Publication number: 20150130001
    Abstract: An image sensor is provided including a substrate, an array of photosensitive units, a grid and a plurality of color filters. In the image sensor, the grid has a first portion and a second portion disposed on the first portion. The second portion of the grid can cause reflection or refraction of incident lights targeted for one image sensor element back into the same image sensor element, so as to avoid crosstalk occurred. Further, a method for manufacturing the image sensor also provides herein.
    Type: Application
    Filed: November 14, 2013
    Publication date: May 14, 2015
    Inventors: Yun-Wei CHENG, Chun-Hao CHOU, Yin-Chieh HUANG, Wan-Chen Huang, Zhe-Ju LIU, Kuo-Cheng LEE, Chi-Cherng JENG
  • Publication number: 20150083312
    Abstract: A substrate bonding and debonding method includes the steps of: providing a substrate; forming a first silicone glue layer on a peel-off region of the substrate and a second silicone glue layer on a peripheral region of the substrate, in which the first and second silicone glue layers contain the same silicone main agent and silicone curing agent in a different ratio; adhering an opposite substrate to the first and second silicone glue layers; curing the first and second silicone glue layers to bond the substrate to the opposite substrate; and separating a portion of the substrate from the opposite substrate.
    Type: Application
    Filed: January 29, 2014
    Publication date: March 26, 2015
    Applicant: AU Optronics Corporation
    Inventors: Shuo-Yang SUN, Wan-Chen HUANG, Wei-Ting LIN, Chun-Cheng CHENG