Abstract: A method performed by a User Equipment (UE) for applying a Transmission Configuration Indicator (TCI) state is provided. The method receives a Radio Resource Control (RRC) configuration. The method receives a first Medium Access Control (MAC) Control Element (CE) for activating at least one TCI state configured by the RRC configuration. The method receives Downlink Control Information (DCI) for indicating a first TCI state among the at least one TCI state activated by the first MAC CE. The method receives a second MAC CE for indicating a second TCI state after receiving the DCI. The method then applies the first TCI state or the second TCI state for a target cell.

Abstract: Methods and apparatuses for Downlink (DL) signaling reception are provided. The method receives a configuration of multiple Control Resource Sets (CORESETs) overlapping in time domain. The method selects a first CORESET, and then selects a second CORESET by performing a set of operations including: in response to determining that the first CORESET is associated with only one Quasi-Co-Location (QCL) type D property, selecting a CORESET that is associated with two QCL type D properties, one of which being the only one QCL type D property, as the second CORESET, and in response to determining that the first CORESET is associated with two QCL type D properties, selecting a CORESET that is associated with only one QCL type D property, which is one of the two QCL type D properties, as the second CORESET. The method monitors, at least, the first CORESET and the second CORESET to receive the DL signaling.

Abstract: An optoelectronic semiconductor package for packaging a heat source capable of emitting light includes a base, a seal member, and a plurality of heat-dissipation elements. The base carries and touches the heat source and has a plurality of openings formed thereon, and the seal member is used to seal the heat source on the base. Each of the heat-dissipation elements is inserted in one of the corresponding openings, and the heat-dissipation element placed in the corresponding opening is deformed to result in a tight coupling between the heat-dissipation element and the base.

Abstract: A light emitting diode (LED) apparatus includes a heat dissipating component, a flexible circuit board, a slug, a light emitting diode die, and a package material. The flexible circuit board has a hollow-out portion disposed on the heat dissipating component. The slug is thermal conductively connected to the heat dissipating component through the hollow-out portion of the flexible circuit board. The light emitting diode die is disposed on the slug, and electrically connected to the flexible circuit board. The package material covers the light emitting diode die and the slug, and the bottom thereof is connected to the flexible circuit board. The light emitting diode apparatus is applied to an optical engine having a chassis and a top cover. The flexible circuit board of the light emitting diode apparatus is assembled on the chassis, and the heat dissipating component thereof is assembled on the top cover.

Abstract: An optoelectronic semiconductor package for packaging a heat source capable of emitting light includes a base, a seal member, and a plurality of heat-dissipation elements. The base carries and touches the heat source and has a plurality of openings formed thereon, and the seal member is used to seal the heat source on the base. Each of the heat-dissipation elements is inserted in one of the corresponding openings, and the heat-dissipation element placed in the corresponding opening is deformed to result in a tight coupling between the heat-dissipation element and the base.