Abstract: A testing device for testing adhesion force includes a thermal insulated glove box, an atomic force microscope, a cryogenic sample stage, a high pressure gas source and a circulating chiller. The atomic force microscope includes a probe for adhering mineral particles. The cryogenic sample stage is configured for preparing gas hydrate sample. The cryogenic sample stage is arranged below the probe. The atomic force microscope and the cryogenic sample stage are placed in the thermal insulated glove box. The high pressure gas source provides pressure required for synthesis of gas hydrates, the high pressure gas source comprises a high pressure chamber covered on the cryogenic sample stage and a high pressure gas cylinder connected with the high pressure chamber. The circulating chiller, an outlet of the circulating chiller is connected with the thermal insulated glove box to control humidity and temperature inside the thermal insulated glove box.

Abstract: A testing device for testing adhesion force includes a thermal insulated glove box, an atomic force microscope, a cryogenic sample stage, a high pressure gas source and a circulating chiller. The atomic force microscope includes a probe for adhering mineral particles. The cryogenic sample stage is configured for preparing gas hydrate sample. The cryogenic sample stage is arranged below the probe. The atomic force microscope and the cryogenic sample stage are placed in the thermal insulated glove box. The high pressure gas source provides pressure required for synthesis of gas hydrates, the high pressure gas source comprises a high pressure chamber covered on the cryogenic sample stage and a high pressure gas cylinder connected with the high pressure chamber. The circulating chiller, an outlet of the circulating chiller is connected with the thermal insulated glove box to control humidity and temperature inside the thermal insulated glove box.

Abstract: A conductive heat dissipating device for microcomputers includes a motherboard having an opening and a first electric connector installed adjacent to the front side of the opening, an adapter board having a second electric connector connected to the first electric connector on the front side of the opening, a processor soldered at the back of the adapter board or a third electric connector for inserting a processor, such that the processor is placed upside down into the opening, and a heat dissipating board connected to the back of the motherboard and in contact with the surface of the processor, and the heat dissipating board is in contact with a special heat dissipating structure in a chassis to define an external conductive heat dissipating device capable of dissipating the heat to the outside, reducing the size of the microcomputer, shortening the distance of thermal conduction, and improving the heat dissipation.