Abstract: An electronic package is provided, in which an electronic element and a heat dissipation member are disposed on different areas of a carrier structure having a heat dissipation layer, where the electronic element is covered by an encapsulation layer, and the heat dissipation member is thermally connected to the electronic element via the heat dissipation layer, so that the heat energy generated by the electronic element can be prevented from conducting into the encapsulation layer during the heat dissipation process, such that the problem of overheating around the electronic element can be avoided.

Abstract: An electronic package and a manufacturing method thereof are provided, in which a plurality of electronic components and a shielding part are disposed on a carrier structure, the shielding part is located between two of the electronic components, and the plurality of electronic components and the shielding part are covered by an encapsulating layer, where a surface of the shielding part has a protruding portion. Therefore, a periphery surface of the shielding part is a non-straight surface, so as to prevent the reflection of electromagnetic waves in the encapsulating layer from interfering with the signal transmission of the electronic components.