Patents by Inventor Wan-Chin Hsiao

Wan-Chin Hsiao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7002804
    Abstract: A heat dissipating apparatus for an electronic device having an integrated heat spreader is disclosed. The integrated heat spreader is disposed on the electronic device. The electronic device is inserted into a socket. The heat dissipating apparatus includes a base and at least one fin. The base is connected to the integrated heat spreader and has a concave area. When the base is connected to the integrated heat spreader, a contact area is thereby formed. The shape and position of the contact area correspond to those of the integrated heat spreader. The concave area is formed on the base and extended from the edge of the base to the contact area. The fin is formed on the base.
    Type: Grant
    Filed: November 4, 2003
    Date of Patent: February 21, 2006
    Assignee: ASUSTek Computer Inc.
    Inventors: Chao-Tsai Chung, Wan-Chin Hsiao
  • Publication number: 20040240181
    Abstract: A heat dissipating apparatus for an electronic device having an integrated heat spreader is disclosed. The integrated heat spreader is disposed on the electronic device. The electronic device is inserted into a socket. The heat dissipating apparatus includes a base and at least one fin. The base is connected to the integrated heat spreader and has a concave area. When the base is connected to the integrated heat spreader, a contact area is thereby formed. The shape and position of the contact area correspond to those of the integrated heat spreader. The concave area is formed on the base and extended from the edge of the base to the contact area. The fin is formed on the base.
    Type: Application
    Filed: November 4, 2003
    Publication date: December 2, 2004
    Inventors: Chao-Tsai Chung, Wan-Chin Hsiao