Abstract: A semiconductor device and method of manufacturing the same are provided. The semiconductor device includes a first active region extending along a first direction. The semiconductor device also includes a second active region extending along the first direction. The semiconductor device further includes a first gate extending along a second direction perpendicular to the first direction. The first gate has a first segment disposed between the first active region and the second active region. In addition, the semiconductor device includes a first electrical conductor extending along the second direction and across the first active region and the second active region, wherein the first segment of the first gate and the first electrical conductor are partially overlapped to form a first capacitor.

Abstract: A container for storing food is provided with a receptacle including a bellows, a top opening, and external threads around the opening; and a lid including a skirt including internal threads secured to the external threads, a top bossed hole communicating with the bellows, and a top frame having an n-shaped section, the frame including an inner slot; an inlet valve in the bossed hole; a trigger assembly including a spring loaded piston in the frame, and a trigger formed with the piston; a sealing ring secured to an end of the piston distal the trigger; a cylinder for receipt of the sealing ring and a portion of the piston, an inlet port fitted on the bossed hole, and an outlet valve at an end distal the sealing ring; and a cover including a peripheral opening for receipt of the trigger.

Abstract: A container for storing food is provided with a receptacle including a bellows, a top opening, and external threads around the opening; and a lid including a skirt including internal threads secured to the external threads, a top bossed hole communicating with the bellows, and a top frame having an n-shaped section, the frame including an inner slot; an inlet valve in the bossed hole; a trigger assembly including a spring loaded piston in the frame, and a trigger formed with the piston; a sealing ring secured to an end of the piston distal the trigger; a cylinder for receipt of the sealing ring and a portion of the piston, an inlet port fitted on the bossed hole, and an outlet valve at an end distal the sealing ring; and a cover including a peripheral opening for receipt of the trigger.

Abstract: Disclosed is an improved tetraethylorthosilicate (TEOS) deposition apparatus for semiconductor manufacture processes, in which the apparatus comprises a furnace chamber for performing TEOS deposition and an exhaust pipe line connected with the furnace chamber for discharging a gas from the furnace chamber, and the exhaust pipe line is connected with a main valve, an automatic pressure control (APC) valve and a pump in sequence. The improvement is characterized in that the exhaust pipe line further connects a disc trap between the main valve and APC valve for filtering the gas in the exhaust pipe line. With the insertion of the disc trap in the exhaust pipe line to collect and filter TEOS deposition from the gas in the exhaust pipe line, failure and wearing of the APC valve caused by TEOS due to temperature variations are prevented, thereby increasing the lifetime of the APC valve and reducing the failure possibility.