Abstract: Provided are integral probe and method of transmitting signal therethrough. The probe is formed of an elongate coil spring including an intermediate portion and two end portions either connected to a signal transmission starting terminal or a signal transmission ending terminal. The number of the coils of the spring in a predetermined portion thereof is larger than that of the remaining portions. A signal transmission method comprises compressing the spring and passing a signal through the spring. The invention can cause signal to pass quickly with decreased resistance and substantially no inductance.

Abstract: Provided is a pad type wafer test apparatus comprises a disk-shaped substrate, a buffer assembly comprising a cross-shaped seat, a body, a buffer pad, and a rectangular frame element, a conductive assembly, and a rectangular test probe mechanism provided between the body and the conductive member and electrically coupled thereto. In a conductivity test for finding any defect in wafer a wafer is placed on a machine, the test probe mechanism is placed on the wafer with test probes of the test probe mechanism being in contact with the wafer by inserting into an oxidized film on the wafer, and test result is transmitted to a display via the test probes and the substrate. The invention can accurately find any wafer defect, protect test probes, and effect a dense configuration of test probes.

Abstract: An adaptable pin assembly for a BGA based IC encapsulation is disclosed. The pin assembly comprises has an upper cover including a plurality of longitudinal channels arranged in rows and columns for anchoring portions of a plurality of longitudinal, conductive, detachable, and resilient pins; and a lower cover coupled to the upper cover. The lower cover includes a plurality of longitudinal channels arranged in rows and columns for anchoring the remaining portions of the pins. In testing an encapsulated IC chip the pin assembly is sandwiched between the IC chip having a plurality of bottom tin balls and a circuit board of an IC test device, the tin balls are rested on the upper pins, and the circuit board is connected to the lower pins so as to form an electrical connection between the tin balls and the circuit board.

Abstract: An adaptable pin assembly for a BGA based IC encapsulation is disclosed. The pin assembly comprises has an upper cover including a plurality of longitudinal channels arranged in rows and columns for anchoring portions of a plurality of longitudinal, conductive, detachable, and resilient pins; and a lower cover coupled to the upper cover, The lower cover includes a plurality of longitudinal channels arranged in rows and columns for anchoring the remaining portions of the pins. In testing an encapsulated IC chip the pin assembly is sandwiched between the IC chip having a plurality of bottom tin balls and a circuit board of an IC test device, the tin balls are rested on the upper pins, and the circuit board is connected to the lower pins so as to form an electrical connection between the tin balls and the circuit board.