Patents by Inventor WAN-CHUN PENG

WAN-CHUN PENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • NONCONDUCTIVE SURFACE METALLIZATION METHOD AND PLASTIC ARTICLE MANUFACTURED BY THE SAME
    Publication number: 20100183871
    Abstract: A nonconductive surface metallization method of plastic substrate comprising: providing a plastic substrate; and forming a black-colored and nonconductive alloy coating on the plastic substrate surface by a vacuum evaporating process, the alloy coating being formed by a target comprising a first material and a second material, the first material being a steel, the second material being selected from a group consisting of indium, tin, aluminium and silicon dioxide. A plastic article has a black-colored and nonconductive alloy coating is provided in the present disclosure.
    Type: Application
    Filed: September 17, 2009
    Publication date: July 22, 2010
    Applicants: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (HONG KONG) LIMITED
    Inventors: WAN-CHUN PENG, GANG XIONG, CHWAN-HWA CHIANG, CHUN-MAN HON, FENG-YUEN DAI