Patents by Inventor Wan-Chun Tsai

Wan-Chun Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11969448
    Abstract: A probiotic composition for improving an effect of a chemotherapeutic drug of Gemcitabine on inhibiting pancreatic cancer is disclosed in the present disclosure. The probiotic composition comprises an effective amount of Lactobacillus paracasei GMNL-133, an effective amount of Lactobacillus reuteri GMNL-89, and a pharmaceutically acceptable carrier, wherein the Lactobacillus paracasei GMNL-133 was deposited in the China Center for Type Culture Collection on Sep. 26, 2011 under an accession number CCTCC NO. M 2011331, and the Lactobacillus reuteri GMNL-89 was deposited in the China Center for Type Culture Collection on Nov. 19, 2007 under an accession number CCTCC NO. M 207154. A method for improving the effect of the chemotherapeutic drug of Gemcitabine on inhibiting pancreatic cancer is further disclosed in the present disclosure.
    Type: Grant
    Filed: May 12, 2021
    Date of Patent: April 30, 2024
    Assignee: GENMONT BIOTECH INC.
    Inventors: Wan-Hua Tsai, I-ling Hsu, Shan-ju Hsu, Wen-ling Yeh, Ming-shiou Jan, Wee-wei Chieng, Li-jin Hsu, Ying-chun Lai
  • Patent number: 11974302
    Abstract: A method and a User Equipment (UE) for beam operations are provided. The method includes monitoring at least one of a plurality of Control Resource Sets (CORESETs) configured for the UE within an active Bandwidth Part (BWP) of a serving cell in a time slot; and applying a first Quasi Co-Location (QCL) assumption of a first CORESET of a set of one or more of the monitored at least one of the plurality of CORESETs to receive a Downlink (DL) Reference Signal (RS), wherein the first CORESET is associated with a monitored search space configured with a lowest CORESET Identity (ID) among the set of one or more of the monitored at least one of the plurality of CORESETs.
    Type: Grant
    Filed: April 6, 2023
    Date of Patent: April 30, 2024
    Assignee: Hannibal IP LLC
    Inventors: Chien-Chun Cheng, Tsung-Hua Tsai, Yu-Hsin Cheng, Wan-Chen Lin
  • Patent number: 11890411
    Abstract: Present invention is related to a ventilator adapter and auxiliary chamber thereof. The ventilator adapter of the present invention comprises a T-shaped flow guiding adapter and an auxiliary chamber detachably connected thereto. The T-shaped flow guiding adapter contains a guiding valve that can retractably close or open its opening. The auxiliary chamber is a cylindrical hollow tubing with open ends at both sides, and a chamber partition extended into the interior of the auxiliary chamber, separating the chamber at least partially into two chambers. The present invention is able to be adapted with the conventional ventilator pipeline by using the T-shaped flow guiding adapter for connecting any suitable ventilatory medicine with the auxiliary cavity.
    Type: Grant
    Filed: December 19, 2022
    Date of Patent: February 6, 2024
    Inventor: Wan-Chun Tsai
  • Publication number: 20230191046
    Abstract: Present invention is related to a ventilator adapter and auxiliary chamber thereof. The ventilator adapter of the present invention comprises a T-shaped flow guiding adapter and an auxiliary chamber detachably connected thereto. The T-shaped flow guiding adapter contains a guiding valve that can retractably close or open its opening. The auxiliary chamber is a cylindrical hollow tubing with open ends at both sides, and a chamber partition extended into the interior of the auxiliary chamber, separating the chamber at least partially into two chambers. The present invention is able to be adapted with the conventional ventilator pipeline by using the T-shaped flow guiding adapter for connecting any suitable ventilatory medicine with the auxiliary cavity.
    Type: Application
    Filed: December 19, 2022
    Publication date: June 22, 2023
    Inventor: Wan-Chun Tsai
  • Publication number: 20230178534
    Abstract: This disclosure provides a communication device and a manufacturing method thereof. The manufacturing method of the communication device includes the following steps: providing a first dielectric layer, wherein the first dielectric layer includes a first region and a second region, and the first dielectric layer has a first surface and a second surface opposite to the first surface; providing a second dielectric layer; combining the first dielectric layer and the second dielectric layer with a sealing element, so that the sealing element is disposed between the first surface of the first dielectric layer and a third surface of the second dielectric layer; after combining the first dielectric layer and the second dielectric layer, thinning the second surface of the first dielectric layer; and disposing a first communication element on the first surface of the first dielectric layer in the first region.
    Type: Application
    Filed: November 18, 2022
    Publication date: June 8, 2023
    Applicant: Innolux Corporation
    Inventors: Jia-Sin Lin, Wen-Chi Fang, Jen-Hai Chi, Zhi-Fu Huang, Pei-Chi Chen, Wan-Chun Tsai
  • Publication number: 20230171896
    Abstract: A manufacturing method of an electronic device including following steps is provided. A first substrate is provided. A thermal release adhesive layer is provided on the first substrate. A thinning process is performed on the first substrate to form a first thinned substrate. A cutting process is performed on the first thinned substrate to form a first sub-substrate. The thermal release adhesive layer is separated from the first thinned substrate or the first sub-substrate. In the manufacturing method of the electronic device provided in one or more embodiments of the disclosure, the manufacturing process of the electronic device may be simplified, and/or defects of the resultant electronic device may be reduced.
    Type: Application
    Filed: October 30, 2022
    Publication date: June 1, 2023
    Applicant: Innolux Corporation
    Inventors: Pei-Chi Chen, Wen-Chi Fang, Jen-Hai Chi, Zhi-Fu Huang, Jia-Sin Lin, Wan-Chun Tsai