Abstract: Methods for repacking copper wire bonded microelectronic die (that is, die having bond pads bonded to copper wire bonds) are provided. In one embodiment, the repackaging method includes the step or process of obtaining a microelectronic package containing copper wire bonds and a microelectronic die, which includes bond pads to which the copper wire bonds are bonded. The microelectronic die is extracted from the microelectronic package in a manner separating the copper wire bonds from the bond pads. The microelectronic die is then attached or mounted to a Failure Analysis (FA) package having electrical contact points thereon. Electrical connections are then formed between the bond pads of the microelectronic die and the electrical contact points of the FA package at least in part by printing an electrically-conductive material onto the bond pads.

Abstract: A process for preparing an organic hydroperoxide, which process comprises: (a) oxidizing an organic compound to obtain an organic reaction product containing organic hydroperoxide; (b) mixing at least part of the organic reaction product of step (a) with a basic aqueous solution to obtain a mixture of basic aqueous solution and the organic reaction product; (c) separating the mixture of step (b) to obtain a separated organic phase containing organic hydroperoxide, and a separated aqueous phase; (d) mixing at least part of the separated organic phase of step (c) with water to obtain a mixture of an aqueous phase and the organic phase; and (e) separating the mixture of step (d) to obtain a separated organic phase containing organic hydroperoxide, and a separated aqueous phase; in which process the separation to a separated organic phase and a separated aqueous phase in step (e) is carried out with the help of a coalescer containing glass fibers.