Abstract: A semiconductor device package contains column leads which are electrically connected to a chip. The column leads, chip and electrical connection means are encapsulated to form a package body, from which the column leads extend for connection to a substrate such as a printed circuit board. A lead frame for the column leads can be formed by etching the column leads and a die pad out of a section of column lead material with a polyimide layer backing. Alternatively, a lead frame having parallel side rails on either side of a die pad can be used as an assembly frame for rows of column leads. Mass production of this package body using either type of lead frame produces high reliability packages in a simple and cost-effective way.

Abstract: A method for manufacturing a chip-size package and the chip-size package produced by the method uses first and second lead frames which are prepared by a stamping process. The first lead frame has leads with receiving parts, and the leads are integrally formed with lengthwise side rails of the lead frame. The second lead frame has external connections which align with the receiving parts of the leads when the second lead frame is positioned on top of the first lead frame and attached thereto. Guide holes located on the crosswise side rails of both lead frames can be used to easily align the two lead frames. A semiconductor chip is then adhered to the underside of the first lead frame, and the bonding pads of the semiconductor chip are electrically connected to the leads of the first lead frame. Then the two lead frames and the chip are encapsulated, with only the external connections of the second lead frame remaining exposed to the outside.