Abstract: A package stacked semiconductor device includes a plurality of pin linking means for electrically connecting at least one of control signal pins of one package to its neighbor NC pin of the same package. Either of the control signal pin or the neighbor NC pin, which are electrically interconnected, is electrically connected to the corresponding pin of the next package.

Abstract: A package stacked semiconductor device includes a plurality of pin linking means for electrically connecting at least one of control signal pins of one package to its neighbor NC pin of the same package. Either of the control signal pin or the neighbor NC pin, which are electrically interconnected, is electrically connected to the corresponding pin of the next package.

Abstract: An active surface of a semiconductor chip is attached to the bottom surface of a flexible circuit board having a central opening. Input/output pads on the active surface of the chip are electrically connected to a circuit layer on the top surface of the flexible circuit board through the opening. The semiconductor chip package can thus be of a size on the order of that of the chip. The circuit layer on the circuit board includes bonding pads for receipt of metal wires, land pads for receipt of terminals, and circuit traces connecting the pairs of the bonding and land pads, respectively. The input/output pads, the bonding pads, and the wires are encapsulated in an encapsulant formed by dispensing a liquid resin having a certain viscosity into the opening in the flexible circuit board. A dam around the opening prevents the liquid resin from overflowing. The flexible circuit board may further include a protective layer for protecting the circuit traces, a stiffener, or an adhesive layer thereunder.

Abstract: A method for manufacturing of a lead-on-chip type semiconductor chip package is disclosed, which comprises the steps of coating a liquid polyimide coating material on the bonding faces of at least one of the inner leads and the bus bars of the lead frame and the semiconductor chip, attaching the semiconductor chip by using the cured liquid polyimide coating material as an attaching medium, and forming a package body for wrapping and protecting the semiconductor chip and bonding wires. Since the liquid polyimide coating material protects the wafer from which the chips are obtained and also serves as a bonding agent for the semiconductor chip at the same time, the semiconductor chip package according to the present invention can be protected from damage, such as by air bubbles, which are generated at the interface of the conventional polyimide tape, and by separation and expansion of adhesives.

Abstract: A method for manufacturing a semiconductor package, including providing a lead frame in which die pad and side rail areas of the lead frame are mechanically interconnected to, and electrically isolated from each other so that the exposed bottom surface of the die pad does not become coated with a metal plating film during surface treatment for coating outer leads of the lead frame.

Abstract: A method for treating a polyimide surface which includes the steps of amine-treating the polyimide surface and drying the thusly amine-treated polyimide surface. The amine-treating step is preferably carried out by immersing the polyimide in an amine solution which includes an amine and a solvent. The amine is preferably an aliphatic, aromatic, or siloxane amine. The drying step is preferably carried out a temperature of about 50.degree.-200.degree. C. The polyimide is preferably a polyimide having at least one imide functional group in its main chain, and is most preferably a polycondensate of at least one dianhydride and at least one diamine.