Patents by Inventor Wan-Hsuan Lin

Wan-Hsuan Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11934065
    Abstract: A display device includes a substrate, a first light emitting element, a second light emitting element, and an optical film sheet. The first light emitting element and the second light emitting element are disposed on the substrate. The first light emitting element emits a first light, and the first light has a first wavelength range. The second light emitting element emits a second light, and the second light has a second wavelength range. The optical film sheet is disposed above the first light emitting element and the second light emitting element. The optical film sheet includes a first zone and a second zone. The first zone includes a first cholesteric liquid crystal, and the first cholesteric liquid crystal reflects light in at least the first wavelength range. The second zone includes a second cholesteric liquid crystal, and the second cholesteric liquid crystal reflects light in at least the second wavelength range.
    Type: Grant
    Filed: June 8, 2023
    Date of Patent: March 19, 2024
    Assignee: AUO Corporation
    Inventors: Wan Heng Chang, Min-Hsuan Chiu, Syuan-Ying Lin, Wei-Ming Cheng
  • Publication number: 20230307317
    Abstract: A heat dissipation device includes a main fixed base plate, a main heat pipe set, a lower heat dissipation fin set and an upper heat dissipation module. The main heat pipe set is fixed on the main fixed base plate, and the lower heat dissipation fin set is also fixed on the main fixed base plate, and the main heat pipe set passes through the lower heat dissipation fin set, and is exposed on the lower heat dissipation fin set. In addition, the upper heat dissipation module is detachably installed on the lower heat dissipation fin set and contacts the main heat pipe set.
    Type: Application
    Filed: March 20, 2023
    Publication date: September 28, 2023
    Inventors: Cheng-Ju CHANG, Wan-Hsuan LIN, Chung-Chien SU
  • Publication number: 20200400664
    Abstract: An embodiment of this invention A NiO chip is provided. The NiO chip includes a substrate, a nickel oxide thin film on the substrate, and a bioprobe layer on the nickel oxide thin film. The nickel oxide thin film has a light transmittance of more than 60% and a nanostructure. The bioprobe layer includes a plurality of bioprobes modified by Histidine (His) or a His-tagged protein.
    Type: Application
    Filed: March 31, 2020
    Publication date: December 24, 2020
    Inventors: Bor-Ran Li, Yu-Ling Hsieh, Chien-Wei Chen, Wan-Hsuan Lin