Abstract: A rehabilitation pedal structure for a hospital bed includes a footboard, a bottom plate pivotally mounted on two sides of the footboard, and two pedals elastically and pivotally mounted on the bottom plate. The footboard is provided with a slot. The bottom plate is pivotally mounted in the slot. The two pedals can be received in the slot. Each of the pedals is electrically connected with one of two monitors, a counter, and a microcontroller. The counter performs a counting action. When the two pedals are respectively stepped or pressed by a user's two feet or hands, the two pedals swing relative to the bottom plate respectively, and the two monitors indicate a swinging number of the two pedals respectively, to facilitate detection of exercise capacity and rehabilitation times of the user's two feet or hands.

Abstract: A heat dissipation device includes a main fixed base plate, a main heat pipe set, a lower heat dissipation fin set and an upper heat dissipation module. The main heat pipe set is fixed on the main fixed base plate, and the lower heat dissipation fin set is also fixed on the main fixed base plate, and the main heat pipe set passes through the lower heat dissipation fin set, and is exposed on the lower heat dissipation fin set. In addition, the upper heat dissipation module is detachably installed on the lower heat dissipation fin set and contacts the main heat pipe set.

Abstract: An anti-wear screw includes a U-shaped anti-wear clip and a locking screw. The U-shaped anti-wear clip is used to clamp on a heat dissipation substrate, and the locking screw is passed through the U-shaped anti-wear clip to fix the heat dissipation substrate. In addition, the anti-wear screw further includes a pressure spring installed between the locking screw and the U-shaped anti-wear clip to exert pressure on the U-shaped anti-wear clip and the heat dissipation substrate.

Abstract: A heat dissipation device includes a main fixed base plate, a main heat pipe set, a lower heat dissipation fin set and an upper heat dissipation module. The main heat pipe set is fixed on the main fixed base plate, and the lower heat dissipation fin set is also fixed on the main fixed base plate, and the main heat pipe set passes through the lower heat dissipation fin set, and is exposed on the lower heat dissipation fin set. In addition, the upper heat dissipation module is detachably installed on the lower heat dissipation fin set and contacts the main heat pipe set.

Abstract: An embodiment of this invention A NiO chip is provided. The NiO chip includes a substrate, a nickel oxide thin film on the substrate, and a bioprobe layer on the nickel oxide thin film. The nickel oxide thin film has a light transmittance of more than 60% and a nanostructure. The bioprobe layer includes a plurality of bioprobes modified by Histidine (His) or a His-tagged protein.