Patents by Inventor Wan-Hsuan Weng

Wan-Hsuan Weng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Earphone module
    Patent number: 11736844
    Abstract: An earphone module includes a first circuit board. The first circuit board includes a touch panel layer, a grounding layer, an antenna layer and a touch circuit layer assembly. The grounding layer is disposed apart from and below the touch panel layer. The antenna layer includes an antenna flat portion, an antenna feed wire and an antenna short-circuit wire. The antenna flat portion is disposed apart from and below the grounding layer, and the antenna feed wire and the antenna short-circuit wire are connected to the antenna flat portion. The touch circuit layer assembly is disposed apart from and below the antenna flat portion and includes a touch chip. The touch panel layer is electrically connected to the touch chip.
    Type: Grant
    Filed: February 15, 2022
    Date of Patent: August 22, 2023
    Assignee: Merry Electronics Co., Ltd.
    Inventors: Jui-Hsien Chien, Wan-Hsuan Weng, Ying-Ying Peng
  • EARPHONE MODULE
    Publication number: 20230232142
    Abstract: An earphone module includes a first circuit board. The first circuit board includes a touch panel layer, a grounding layer, an antenna layer and a touch circuit layer assembly. The grounding layer is disposed apart from and below the touch panel layer. The antenna layer includes an antenna flat portion, an antenna feed wire and an antenna short-circuit wire. The antenna flat portion is disposed apart from and below the grounding layer, and the antenna feed wire and the antenna short-circuit wire are connected to the antenna flat portion. The touch circuit layer assembly is disposed apart from and below the antenna flat portion and includes a touch chip. The touch panel layer is electrically connected to the touch chip.
    Type: Application
    Filed: February 15, 2022
    Publication date: July 20, 2023
    Applicant: Merry Electronics Co., Ltd.
    Inventors: Jui-Hsien Chien, Wan-Hsuan Weng, Ying-Ying Peng