Patents by Inventor Wan Hsueh Lai

Wan Hsueh Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11901203
    Abstract: Methods and systems for detection of an endpoint of a substrate process are provided. A set of machine learning models are trained to provide a metrology measurement value associated with a particular type of metrology measurement for a substrate based on spectral data collected for the substrate. A respective machine learning model is selected to be applied to future spectral data collected during a future substrate process for a future substrate in view of a performance rating associated with the particular type of metrology measurement. Current spectral data is collected during a current process for a current substrate and provided as input to the respective machine learning model. An indication of a respective metrology measurement value corresponding to the current substrate is extracted from one or more outputs of the trained machine learning model.
    Type: Grant
    Filed: June 10, 2021
    Date of Patent: February 13, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Pengyu Han, Lei Lian, Shu Yu Chen, Todd Egan, Wan Hsueh Lai, Chao-Hsien Lee, Pin Ham Lu, Zhengping Yao, Barry Craver
  • Publication number: 20230306281
    Abstract: A method includes determining that conditions of a processing chamber have changed since a trained machine learning model associated with the processing chamber was trained. The method further includes determining whether a change in the conditions of the processing chamber is a gradual change or a sudden change. Responsive to determining that the change in the conditions of the processing chamber is a gradual change, the method further includes performing a first training process to generate a new machine learning model. Responsive to determining that the change in the conditions of the processing chamber is a sudden change, the method further includes performing a second training process to generate the new machine learning model. The first training process is different from the second training process.
    Type: Application
    Filed: February 9, 2022
    Publication date: September 28, 2023
    Inventors: Pengyu Han, Hong-Rui Chen, Shu-Yu Chen, Wan-Hsueh Lai, Pin Ham Lu, Zhengping Yao
  • Publication number: 20220399215
    Abstract: Methods and systems for detection of an endpoint of a substrate process are provided. A set of machine learning models are trained to provide a metrology measurement value associated with a particular type of metrology measurement for a substrate based on spectral data collected for the substrate. A respective machine learning model is selected to be applied to future spectral data collected during a future substrate process for a future substrate in view of a performance rating associated with the particular type of metrology measurement. Current spectral data is collected during a current process for a current substrate and provided as input to the respective machine learning model. An indication of a respective metrology measurement value corresponding to the current substrate is extracted from one or more outputs of the trained machine learning model.
    Type: Application
    Filed: June 10, 2021
    Publication date: December 15, 2022
    Inventors: Pengyu Han, Lei Lian, Shu Yu Chen, Todd Egan, Wan Hsueh Lai, Chao-Hsien Lee, Pin Ham Lu, Zhengping Yao, Barry Craver
  • Publication number: 20220397515
    Abstract: A machine learning model trained to provide metrology measurements for a substrate is provided. Training data generated for a prior substrate processed according to a prior process is provided to train the model. The training data includes a training input including a subset of historical spectral data extracted from a normalized set of historical spectral data collected for the prior substrate during the prior process. The subset of historical spectral data includes an indication of historical spectral features associated with a particular type of metrology measurement. The training data also includes a training output including a historical metrology measurement obtained for the prior substrate, the historical metrology measurement associated with the particular type of metrology measurement. Spectral data is collected for a current substrate processed according to a current process.
    Type: Application
    Filed: June 10, 2021
    Publication date: December 15, 2022
    Inventors: Pengyu Han, Lei Lian, Shu Yu Chen, Todd Egan, Wan Hsueh Lai, Chao-Hsien Lee, Pin Ham Lu, Zhengping Yao, Barry Craver