Patents by Inventor Wan Ji
Wan Ji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20190327095Abstract: An apparatus and method for a reliable quantum signature. The method using the apparatus for a reliable quantum signature includes preparing a quantum signature by sharing a first secret key and a first Bell state with a signer's terminal device and by sharing a second secret key and a second Bell state with a verifier's terminal device; signing, by the signer's terminal device, a message with the quantum signature using a first encoding value, the first secret key, and the first Bell state; verifying, by the apparatus, the quantum signature of the message using the first encoding value, the first secret key, and the first Bell state; and finally verifying, by the apparatus, the quantum signature of the message using the verifier's terminal device, a second encoding value, a third encoding value, the second secret key, and the second Bell state.Type: ApplicationFiled: November 8, 2018Publication date: October 24, 2019Inventors: Changho HONG, Nayoung KIM, Osung KWON, Se Wan JI, Haeng-Seok KO, Jingak JANG, Daesung KWON
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Publication number: 20190238326Abstract: An authentication apparatus and method for quantum cryptography communication. The quantum cryptography communication authentication method is performed using quantum cryptography communication authentication apparatuses, and includes transmitting, by a first quantum cryptography communication authentication apparatus, a quantum state to a second quantum cryptography communication authentication apparatus by selecting a first basis, and measuring, by the second quantum cryptography communication authentication apparatus, the quantum state by selecting a second basis, and performing, by the first quantum cryptography communication authentication apparatus and the second quantum cryptography communication authentication apparatus, authentication by revealing the first basis and the second basis and by comparing sifted keys generated from a common basis between the first basis and the second basis with each other.Type: ApplicationFiled: July 23, 2018Publication date: August 1, 2019Inventors: Se Wan JI, Changho HONG, Younchang JEONG, Osung KWON, Haeng-Seok KO, Jingak JANG, Daesung KWON
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Publication number: 20190123896Abstract: A quantum direct communication with user authentication and an apparatus using the same. The quantum direct communication method includes performing verification of security of a quantum channel using a preset channel verification probability and a quantum state source generated by a receiver of quantum direct communication, performing user authentication using one or more of a preset user authentication probability, the quantum state source, and an authentication key shared between the receiver and a sender, stopping quantum direct communication and resetting the quantum channel when the verification of security of the quantum channel fails, and stopping quantum direct communication when the user authentication fails.Type: ApplicationFiled: May 16, 2018Publication date: April 25, 2019Inventors: Changho HONG, Nayoung KIM, Osung KWON, Se Wan JI, Haeng-Seok KO, Jingak JANG, Daesung KWON
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Patent number: 10021785Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes a first circuit layer disposed on an upper surface of a substrate, an insulating layer disposed on the substrate and the first circuit layer, a second circuit layer disposed on an upper surface of the insulating layer, and a via configured to connect between the first circuit layer and the second circuit layer, and a lower part of the via is in contact with the upper surface of the substrate.Type: GrantFiled: December 11, 2015Date of Patent: July 10, 2018Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Myung-Sam Kang, Young-Gwan Ko, Sang-Hoon Kim, Kang-Wook Bong, Hye-Won Jung, Yong-Wan Ji
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Patent number: 9554466Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes an insulating layer including a first resin layer and a second resin layer, circuit layers disposed on upper and lower surfaces of the insulating layer, and a via configured to connect the circuit layer formed on the upper surface to the circuit layer formed on the lower surface, and the second resin layer extends from an upper surface of the first resin layer to a lower surface of the first resin layer by passing through the first resin layer as to contact a side surface of the via.Type: GrantFiled: December 11, 2015Date of Patent: January 24, 2017Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Myung-Sam Kang, Young-Gwan Ko, Sang-Hoon Kim, Kang-Wook Bong, Hye-Won Jung, Yong-Wan Ji
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Publication number: 20160192490Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes an insulating layer including a first resin layer and a second resin layer, circuit layers disposed on upper and lower surfaces of the insulating layer, and a via configured to connect the circuit layer formed on the upper surface to the circuit layer formed on the lower surface, and the second resin layer extends from an upper surface of the first resin layer to a lower surface of the first resin layer by passing through the first resin layer as to contact a side surface of the via.Type: ApplicationFiled: December 11, 2015Publication date: June 30, 2016Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Myung-Sam KANG, Young-Gwan KO, Sang-Hoon KIM, Kang-Wook BONG, Hye-Won JUNG, Yong-Wan JI
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Publication number: 20160192491Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes a first circuit layer disposed on an upper surface of a substrate, an insulating layer disposed on the substrate and the first circuit layer, a second circuit layer disposed on an upper surface of the insulating layer, and a via configured to connect between the first circuit layer and the second circuit layer, and a lower part of the via is in contact with the upper surface of the substrate.Type: ApplicationFiled: December 11, 2015Publication date: June 30, 2016Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Myung-Sam KANG, Young-Gwan KO, Sang-Hoon KIM, Kang-Wook BONG, Hye-Won JUNG, Yong-Wan JI
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Publication number: 20160100485Abstract: Disclosed are a printed circuit board and a method of manufacturing the printed circuit board, which includes: a first resist layer; a first circuit formed on the first resist layer; an insulation film formed on the first resist layer so as to cover an upper surface and a lateral surface of the first circuit; a ground formed on the insulation film so as to be connected with the first circuit electrically; and an insulation layer formed on the insulation film so as to cover the ground.Type: ApplicationFiled: March 2, 2015Publication date: April 7, 2016Inventors: Hye-Won JUNG, Myung-Sam KANG, Yong-Wan JI, Yong-Jin PARK, Young-Gwan KO, Kang-Wook BONG
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Publication number: 20160021749Abstract: There are provided a package board, a method of manufacturing the same, and a stack type package using the same. The package board according to an exemplary embodiment of the present invention includes a first insulating layer formed with a cavity and an external connection terminal formed to penetrate through the first insulating layer and have one end protruding to an outside of one surface of the first insulating layer.Type: ApplicationFiled: June 10, 2015Publication date: January 21, 2016Inventors: Kang Wook BONG, Myung Sam KANG, Yong Wan JI, Hye Won JUNG, Yong Jin PARK, Young Gwan KO
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Publication number: 20100045793Abstract: Provided is a shock absorbing facility monitoring system and a shock absorbing facility monitoring apparatus for vehicles, where when a vehicle collides with a shock absorbing facility, the situation before and after the collision is photographed, and the photographed signals are transmitted to a main control center in a wireless transmission method. The shock absorbing facility monitoring system for vehicles comprises: shock absorbing facility monitoring apparatuses installed within a certain distance from the shock absorbing facility; an information communication network for transmitting the vehicle approach signal and the video signal transmitted from the plurality of shock absorbing facility monitoring apparatuses to a remote site; and a central control apparatus installed at a main control center.Type: ApplicationFiled: July 30, 2009Publication date: February 25, 2010Inventors: Young Wan JI, Young Ho CHOI
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Publication number: 20080268437Abstract: A method for targeted and comprehensive sequencing using high-density oligonucleotide array, comprising the steps of hybridizing nucleic acid from an investigative species with high-density oligonucleotide arrays of a related species, identifying the oligonucleotide probes that generate high hybridization signals, using the probes sequences to make PCR primers, amplifying heterologous genes by PCR with the gene specific PCR primers and an anchoring primer, and sequencing the PCR products.Type: ApplicationFiled: September 27, 2005Publication date: October 30, 2008Inventors: Wan Ji, Wenli Zhou, Sara F. Davis, Scott K. Davis
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Publication number: 20080131886Abstract: The present disclosure relates to methods of DNA amplification with a first primer that has a random sequence of nucleotides at its 3? end and a generic sequence 5? of the random nucleotides, as well as a second primer with the generic sequence of the first primer. The disclosure further relates to a method of precipitating DNA on a solid medium to improve DNA amplification. In a preferred embodiment, the presently disclosed methods are used for high-throughput genotyping of DNA samples, such as bloodstains or trace amounts of DNA.Type: ApplicationFiled: April 27, 2007Publication date: June 5, 2008Applicant: Invitrogen CorporationInventors: Wan Ji, Keqin Gregg, Bonnie Reus, Jon Kemppainen, Kristen Taylor, Scott Davis
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Publication number: 20060246503Abstract: The present disclosure relates to methods of DNA amplification with a first primer that has a random sequence of nucleotides at its 3? end and a generic sequence 5? of the random nucleotides, as well as a second primer with the generic sequence of the first primer. The disclosure further relates to a method of precipitating DNA on a solid medium to improve DNA amplification. In a preferred embodiment, the presently disclosed methods are used for high-throughput genotyping of DNA samples, such as bloodstains or trace amounts of DNA.Type: ApplicationFiled: July 10, 2006Publication date: November 2, 2006Inventors: Wan Ji, Keqin Gregg, Bonnie Reus, Jon Kemppainen, Kristen Taylor, Scott Davis
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Publication number: 20050009015Abstract: A method and associated compositions for the relative quantification of nucleic acid on an address-defined surface, involving fitting the nucleic acid with a generic oligonucleotide, and hybridizing the generic oligonucleotide with a directly or indirectly labeled complementary oligonucleotide. The method is applicable, for example, to SNP genotyping and gene expression analysis.Type: ApplicationFiled: June 27, 2002Publication date: January 13, 2005Inventors: Wan Ji, Keqin Gregg, Bonnie Reus, Jon Kemppainen, Scott Davis
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Publication number: 20040043416Abstract: The present disclosure relates to methods of DNA amplification with a first primer that has a random sequence of nucleotides at its 3′ end and a generic sequence 5′ of the random nucleotides, as well as a second primer with the generic sequence of the first primer. The disclosure further relates to a method of precipitating DNA on a solid medium to improve DNA amplification. In a preferred embodiment, the presently disclosed methods are used for high-throughput genotyping of DNA samples, such as bloodstains or trace amounts of DNA.Type: ApplicationFiled: September 26, 2003Publication date: March 4, 2004Applicant: Invitrogen CorporationInventors: Wan Ji, Keqin Gregg, Bonnie Reus, Jon Kemppainen, Kristen Taylor, Scott Davis
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Patent number: 6638722Abstract: The present disclosure relates to methods of DNA amplification with a first primer that has a random sequence of nucleotides at its 3′ end and a generic sequence 5′ of the random nucleotides, as well as a second primer with the generic sequence of the first primer. The disclosure further relates to a method of precipitating DNA on a solid medium to improve DNA amplification. In a preferred embodiment, the presently disclosed methods are used for high-throughput genotyping of DNA samples, such as bloodstains or trace amounts of DNA.Type: GrantFiled: June 13, 2001Date of Patent: October 28, 2003Assignee: Invitrogen CorporationInventors: Wan Ji, Keqin Gregg, Bonnie Reus, Jon Kemppainen, Kristen Taylor, Scott Davis
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Publication number: 20030108870Abstract: The present disclosure relates to methods of DNA amplification with a first primer that has a random sequence of nucleotides at its 3′ end and a generic sequence 5′ of the random nucleotides, as well as a second primer with the generic sequence of the first primer. The disclosure further relates to a method of precipitating DNA on a solid medium to improve DNA amplification. In a preferred embodiment, the presently disclosed methods are used for high-throughput genotyping of DNA samples, such as bloodstains or trace amounts of DNA.Type: ApplicationFiled: June 13, 2001Publication date: June 12, 2003Inventors: Wan Ji, Keqin Gregg, Bonnie Reus, Jon Kemppainen, Kristen Taylor, Scott Davis
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Patent number: 5985650Abstract: The invention relates to the discovery that the rate of reaction of the desulfurization of fossil fuels is enhanced by the addition of a flavoprotein to the biocatalyst. The invention is drawn to a method for enhancing the rate of desulfurizing a fossil fuel containing organic sulfur compounds, comprising the steps of:a) contacting the fossil fuel with an aqueous phase containing a biocatalyst capable of cleaving carbon-sulfur bonds and a rate-enhancing amount of a flavoprotein, thereby forming a fossil fuel and aqueous phase mixture;b) maintaining the mixture of step (a) under conditions sufficient for cleavage of the carbon-sulfur bonds of the organic sulfur molecules by the biocatalyst, thereby resulting in a fossil fuel having a reduced organic sulfur content; andc) separating the fossil fuel having a reduced organic sulfur content from the resulting aqueous phase.Type: GrantFiled: February 18, 1998Date of Patent: November 16, 1999Assignee: Energy BioSystems CorporationInventors: Charles H. Squires, Wan Ji, Lei Xi, Beatrice C. Ortego, Olga S. Pogrebinsky, Kevin A. Gray, John D. Childs
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Patent number: 5733773Abstract: The invention relates to the discovery that the rate of reaction of the desulfurization of fossil fuels is enhanced by the addition of a flavoprotein to the biocatalyst. The invention is drawn to a method for enhancing the rate of desulfurizing a fossil fuel containing organic sulfur compounds, comprising the steps of:a) contacting the fossil fuel with an aqueous phase containing a biocatalyst capable of cleaving carbon-sulfur bonds and a rate-enhancing amount of a flavoprotein, thereby forming a fossil fuel and aqueous phase mixture;b) maintaining the mixture of step (a) under conditions sufficient for cleavage of the carbon-sulfur bonds of the organic sulfur molecules by the biocatalyst, thereby resulting in a fossil fuel having a reduced organic sulfur content; andc) separating the fossil fuel having a reduced organic sulfur content from the resulting aqueous phase.Type: GrantFiled: June 12, 1996Date of Patent: March 31, 1998Assignee: Energy BioSystems CorporationInventors: Charles H. Squires, Wan Ji, Lei Xi, Beatrice C. Ortego, Olga S. Pogrebinsky, Kevin A. Gray, John D. Childs
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Patent number: 5321111Abstract: A method for extracting polyisoprenes from cells, comprising the steps of contacting the cells with an organic protein-denaturing compound, rupturing the cells to release the polyisoprene from the cells and recovering the polyisoprene. The preferred protein denaturing compound comprises an aqueous solution of a guanidine salt.Type: GrantFiled: September 28, 1993Date of Patent: June 14, 1994Inventor: Wan Ji