Abstract: A semiconductor device includes a substrate, an interconnect structure, and conductive vias. The substrate has a first side, a second side and a sidewall connecting the first side and the second side, wherein the sidewall includes a first planar sidewall of a first portion of the substrate, a second planar sidewall of a second portion of the substrate and a curved sidewall of a third portion of the substrate, where the first planar sidewall is connected to the second planar sidewall through the curved sidewall. The interconnect structure is located on the first side of the substrate, where a sidewall of the interconnect structure is offset from the second planar sidewall. The conductive vias are located on the interconnect structure, where the interconnect structure is located between the conductive vias and the substrate.

Abstract: A carrier structure is provided, in which at least one positioning area is defined on a chip-placement area of a package substrate, and at least one alignment portion is disposed on the positioning area. Therefore, the precision of manufacturing the alignment portion is improved by disposing the positioning area on the chip-placement area, such that the carrier structure can provide a better alignment mechanism for the chip placement operation.

Abstract: A semiconductor die including mechanical-stress-resistant bump structures is provided. The semiconductor die includes dielectric material layers embedding metal interconnect structures, a connection pad-and-via structure, and a bump structure including a bump via portion and a bonding bump portion. The entirety of a bottom surface of the bump via portion is located within an area of a horizontal top surface of a pad portion of the connection pad-and-via structure.

Abstract: A method includes etching a gate stack in a wafer to form a trench, depositing a silicon nitride liner extending into the trench, and depositing a silicon oxide layer. The process of depositing the silicon oxide layer includes performing a treatment process on the wafer using a process gas including nitrogen and hydrogen, and performing a soaking process on the wafer using a silicon precursor.

Abstract: Provided are a package structure and a method of forming the same. The method includes providing a first package having a plurality of first dies and a plurality of second dies therein; performing a first sawing process to cut the first package into a plurality of second packages, wherein one of the plurality of second packages comprises three first dies and one second die; and performing a second sawing process to remove the second die of the one of the plurality of second packages, so that a cut second package is formed into a polygonal structure with the number of nodes greater than or equal to 5.

Abstract: A management system, a smart meter, a server, an operation method and a management method are provided. The management system includes a remote server and at least one smart meter. The smart meter is coupled to the remote server via a communication network. The smart meter measures electrical energy of at least one power line to obtain at least one batch of electricity data. The smart meter detects whether the loading event occurs. If the loading event occurs, the smart meter performs data compression on the electricity data obtained during an event period corresponding to the loading event to obtain compressed data, and uploads the compressed data to the remote server. The remote server performs data decompression on the compressed data to obtain decompressed data. The remote server performs load identification according to the decompressed data.

Abstract: An indoor positioning system comprises at least one signal source disposed in an indoor environment having training points, and storage and positioning devices coupled with each other. The signal source has power levels, based on one of which it transmits a wireless signal. The storage device stores for each training point a first signal strength, and for at least one adaptation point among the training points a second signal strength. The first and second signal strengths are associated respectively with a first and a second power level among the power levels. The positioning device obtains a current signal strength observed at a current location and its associated current power level, calculates a third signal strength for each training point based on the first, second and current power levels and the first and second signal strengths, and compares the current and third signal strengths to estimate the current location.

Abstract: A management system, a smart meter, a server, an operation method and a management method are provided. The management system includes a remote server and at least one smart meter. The smart meter is coupled to the remote server via a communication network. The smart meter measures electrical energy of at least one power line to obtain at least one batch of electricity data. The smart meter detects whether the loading event occurs. If the loading event occurs, the smart meter performs data compression on the electricity data obtained during an event period corresponding to the loading event to obtain compressed data, and uploads the compressed data to the remote server. The remote server performs data decompression on the compressed data to obtain decompressed data. The remote server performs load identification according to the decompressed data.

Abstract: A system for positioning based on magnetic field characteristics includes a system apparatus and a client device. The system apparatus includes a characteristic magnetic field generation device, a magnetic field characteristic database and a processing device. The characteristic magnetic field generation device is used for generating a plurality of characteristic magnetic fields in a predetermined space. The characteristic magnetic fields have at least two magnetic field characteristics. The magnetic field, characteristic database has a plurality of characteristic values and a plurality of positioning values. Each of the characteristic values corresponds to each of the magnetic field characteristics. The characteristic values correspond to the magnetic field characteristics. The client device includes a magnet detecting component and a processor. The magnet detecting component is used for detecting the magnetic field characteristics and for outputting a magnetic field signal.

Abstract: A lighting-dimming device has a dimming module with an encoding function and at least one light module with a decoding function and controlled by the dimming module. The dimming module is designated with a required brightness and address command by a user. A triode AC switch of the dimming module is controlled to chop a power based on the required brightness and address command. The chopped power is transmitted to the light module to control the brightness of the light module. In the chopped power, only a part of cycles of the power is chopped and most of the power waveforms are maintained. Therefore, a high power factor is maintained.

Abstract: Building models having level of detail is generalized. Every single building model is generalized at first. Then, neighboring building models are processed to obtain their geometric relationship. Some of the neighboring building models are combined under specific criteria to further reduce data amount. Thus, the present invention provides smooth building model display and keeps main characteristics of the building models.

Abstract: A brightness adjusting device for a light-emitting diode (LED) display panel has at least one photo sensor, a control circuit, a timing controller and a driving circuit. The LED display panel is composed of multiple LEDs being divided into groups according to color. The photo sensor sequentially senses brightness of the groups of LEDs and generates brightness values. The control circuit compares the brightness values to standard brightness values. Based on the compared results, the driving circuit adjusts the brightness of corresponding LEDs.

Abstract: A digitized FM (frequency modulation) stereo multiplexing circuit for an FM stereo transmitter has a digital audio I/O interface, a digitized FM stereo multiplexing circuit, a low-pass filter and an FM circuit. When a digital audio data is inputted, a digital audio decoder decodes the digital audio data to acquire left and right channel audio signals. The left and right channel audio signals are inputted to an over-sampling unit circuits to process sampling and then to output to an FM stereo multiplexer. The FM stereo multiplexer then generates a master signal and a secondary signal by processing the sampled left and right channel audio signals. In the meanwhile a switch signal and a pilot signal are acquired with an address counter to output from a memory unit. Then the master signal, the secondary signal and the pilot signal are combined as the digital FM stereo data.

Abstract: An enhanced CMOS circuit to drive a DC motor is disclosed, in which a CMOS circuit is used to form a driver circuit of the DC motor, replacing a conventional BiCMOS for the part of the driver circuit, which is used in a portable CD player. Two switching stages are each formed by four CMOS transistors connected in series, with one end of the circuit being connected to a positive power supply with a higher voltage and another end connected to ground or negative power supply terminal. The switching stages are able to produce high output voltages, which are applied on the gates of the CMOS transistors in the driver stage to lower the driving impedance of the conduction channel and to produce sufficient output current to drive a DC motor.

Abstract: An enhanced CMOS circuit to drive a DC motor is disclosed, in which a CMOS circuit is used to form a driver circuit of the DC motor, replacing a conventional BiCMOS for the part of the driver circuit, which is used in a portable CD player. Two switching stages are each formed by four CMOS transistors connected in series, with one end of the circuit being connected to a positive power supply with a higher voltage and another end connected to ground or negative power supply terminal. The switching stages are able to produce high output voltages, which are applied on the gates of the CMOS transistors in the driver stage to lower the driving impedance of the conduction channel and to produce sufficient output current to drive a DC motor.