Abstract: A solder mask manufacturing method adapted to apply a solder mask on a surface of a substrate of a circuit board, said surface is provided with a conductor pattern having an unsheltered portion and a sheltered portion which is covered by said solder mask. The method comprises the steps of: a) disposing a layer of semi-solid solder mask material having an expansion coefficient substantially the same as that of the substrate on the surface of said substrate to cover said copper conductor pattern, and a metal foil covering the material layer; b) applying pressure to the metal foil and applying baking treatment to cure the solder mask material in to solid; c) utilizing chemical solution and plasma etching to remove the metal foil and the solid solder mask material above the unsheltered portion of said copper conductor pattern respectively such that the unsheltered portion can be exposed; and d) using chemical solution to remove the residual metal foil.

Abstract: A printed circuit board having a permanent solder mask includes a substrate made of a glassfiber reinforced epoxy resin material. The top and bottom surfaces of the substrate are disposed thereon a conductive pattern respectively. An epoxy resin solder mask is coated on each surface of the substrate in such a way that the conductive pattern is divided into a sheltered portion covered by the solder mask and an unsheltered portion exposed outside. The solder mask also has an even and smooth outer surface with a micro-roughness ranging between 0.5 ?m˜10 ?m and an optimum thickness ranging between 2 ?m˜200 ?m.

Abstract: A solder mask manufacturing method adapted to apply a solder mask on a surface of a substrate of a circuit board, said surface is provided with a conductor pattern having an unsheltered portion and a sheltered portion which is covered by said solder mask. The method comprises the steps of: a) disposing a layer of semi-solid solder mask material having an expansion coefficient substantially the same as that of the substrate on the surface of said substrate to cover said copper conductor pattern, and a metal foil covering the material layer; b) applying pressure to the metal foil and applying baking treatment to cure the solder mask material in to solid; c) utilizing chemical solution and plasma etching to remove the metal foil and the solid solder mask material above the unsheltered portion of said copper conductor pattern respectively such that the unsheltered portion can be exposed; and d) using chemical solution to remove the residual metal foil.

Abstract: A printed circuit board having a permanent solder mask includes a substrate made of a glassfiber reinforced epoxy resin material. The top and bottom surfaces of the substrate are disposed thereon a conductive pattern respectively. An epoxy resin solder mask is coated on each surface of the substrate in such a way that the conductive pattern is divided into a sheltered portion covered by the solder mask and an unsheltered portion exposed outside. The solder mask also has an even and smooth outer surface with a micro-roughness ranging between 0.5 &mgr;m˜10 &mgr;m and an optimum thickness ranging between 2 &mgr;m˜200 &mgr;m.

Abstract: A printed circuit board having a permanent solder mask includes a substrate made of a glassfiber reinforced epoxy resin material. The top and bottom surfaces of the substrate are disposed thereon a conductive pattern respectively. An epoxy resin solder mask is coated on each surface of the substrate in such a way that the conductive pattern is divided into a sheltered portion covered by the solder mask and an unsheltered portion exposed outside. The solder mask also has an even and smooth outer surface with a micro-roughness ranging between 0.5 &mgr;m˜10 &mgr;m and an optimum thickness ranging between 2 &mgr;m˜200 &mgr;m.

Abstract: A printed circuit board comprises a substrate with a conductor pattern thereon. The conductor pattern is composed of a plurality of traces in a specific layout. The conductor pattern has first sections where adapt to let current flowing through and second sections electrically connected with the first sections respectively. The first sections of the conductor pattern have plating portions for providing connecting layers thereon, and a solder mask is provided on the substrate. The solder mask shelters the conductor pattern but exposes the connecting layers on the plating portions of the first sections of the conductor pattern. The solder mask has apertures at where relate to the second sections of the conductor pattern.

Abstract: A method of making connections on a conductor pattern of a PCB comprises the steps of: a) Prepare a substrate with a conductive layer at a side thereof b) Form the conductive layer to a conductor pattern having first portions and second portions, wherein the first portions and a second portions have difference in height, and c) Provide an insulating layer on the substrate for sheltering the second portions of the conductor pattern but exposing the first portions of the conductor pattern. The first portions can plate Ni—Au layers on the exposed parts thereof to form interconnections to electrically connect the conductor pattern with another electronic device. The first portion also can be interfacial connections to connect the conductor patterns at different layers in a multi-layer PCB.

Abstract: A wire-bonded chip on board package has a substrate including a first resin. A solder mask made of a second resin having a thermal expansion coefficient identical to that of the first resin of the substrate is disposed on the top surface of the substrate such that it has a smooth outer surface and some openings to expose the respective areas of the conductive patterns on the top surface. An IC chip with an inactive side thereof tightly attaches to the outer surface of the solder mask. Wire bonds electrically connect the contact pads formed on an active side of the IC chip to the conductive patterns of the top surface. A molding material encapsulates the chip, the wire bonds and the substrate top surface.

Abstract: A flip chip package has a substrate made of a material including an epoxy resin. A solder mask is one layer of an epoxy resin disposed on the top surface of the substrate. The solder mask has a smooth outer surface and a plurality of opening to expose the conductive patterns formed on the top surface. An IC chip includes an active side having a plurality of electrical contact pads. A plurality of solder bumps, each bump is formed on a respective one of the plurality of contact pads on the IC chip. The active side of the IC chip is tightly attached to the outer surface of the solder mask such that after a soldering process each said bump has a remainder completely received in a respective one of the opening of the solder mask and connected to the conductive patterns therein.

Abstract: A solder mask manufacturing method adapted to apply a solder mask on a surface of a substrate of a circuit board, said surface is provided with a conductor pattern having an unsheltered portion and a sheltered portion which is covered by said solder mask. The method comprises the steps of: a) disposing a layer of semi-solid solder mask material having an expansion coefficient substantially the same as that of the substrate on the surface of said substrate to cover said copper conductor pattern, and a metal foil covering the material layer; b) applying pressure to the metal foil and applying baking treatment to cure the solder mask material in to solid; c) utilizing chemical solution and plasma etching to remove the metal foil and the solid solder mask material above the unsheltered portion of said copper conductor pattern respectively such that the unsheltered portion can be exposed; and d) using chemical solution to remove the residual metal foil.

Abstract: A printed circuit board having a permanent solder mask includes a substrate made of a glassfiber reinforced epoxy resin material. The top and bottom surfaces of the substrate are disposed thereon a conductive pattern respectively. An epoxy resin solder mask is coated on each surface of the substrate in such a way that the conductive pattern is divided into a sheltered portion covered by the solder mask and an unsheltered portion exposed outside. The solder mask also has an even and smooth outer surface with a micro-roughness ranging between 0.5 &mgr;m˜10 &mgr;m and an optimum thickness ranging between 2 &mgr;m˜200 &mgr;m.

Abstract: A solder mask manufacturing method adapted to apply a solder mask on a surface of a substrate of a circuit board, said surface is provided with a conductor pattern having an unsheltered portion and a sheltered portion which is covered by said solder mask. The method comprises the steps of: a) disposing a layer of semi-solid solder mask material having an expansion coefficient substantially the same as that of the substrate on the surface of said substrate to cover said copper conductor pattern, and a metal foil covering the material layer; b) applying pressure to the metal foil and applying baking treatment to cure the solder mask material in to solid; c) utilizing chemical solution and plasma etching to remove the metal foil and the solid solder mask material above the unsheltered portion of said copper conductor pattern respectively such that the unsheltered portion can be exposed; and d) using chemical solution to remove the residual metal foil.

Abstract: A solder mask manufacturing method adapted to apply a solder mask on a surface of a substrate of a circuit board, said surface is provided with a conductor pattern having an unsheltered portion and a sheltered portion which is covered by said solder mask. The method comprises the steps of: a) disposing a layer of semi-solid solder mask material having an expansion coefficient substantially the same as that of the substrate on the surface of said substrate to cover said copper conductor pattern, and a metal foil covering the material layer; b) applying pressure to the metal foil and applying baking treatment to cure the solder mask material in to solid; c) utilizing chemical solution and plasma etching to remove the metal foil and the solid solder mask material above the unsheltered portion of said copper conductor pattern respectively such that the unsheltered portion can be exposed; and d) using chemical solution to remove the residual metal foil.