Abstract: A mounting device, for mounting a plurality of fans (50) to a server chassis (70), includes a tray (20), a plurality of brackets (30), and a plurality of fasteners (40). The tray includes a plurality of pairs of mounting sections each pair fixed with a corresponding bracket. Each bracket is U-shaped and includes a pair of side plates (32) for sandwiching a corresponding fan therebetween. Each bracket defines a pair of coaxial locking holes (35?) in the side plates. Each fastener includes a pair of locking ends (42) received in the locking holes of a corresponding bracket to thereby sandwich the corresponding fan in the bracket. Each side plate defines an outlet (34) having a contour corresponding to a contour of an outlet of a corresponding fan, and each mounting section of the tray has a contour corresponding to a contour of the outlet of a corresponding fan.

Abstract: A heat sink assembly of the present invention includes a printed circuit board (10), a retention module (20), four pins (30), a heat sink (40) and a clip (50). The printed circuit board (10) has an electronic package (100) mounted thereon. The retention module (20) is integrally formed, substantially rectangular, and has a symmetrical configuration. The retention module (20) defines an opening (26) therein for surrounding the electronic package (100). Four positioning holes (28) are defined in four corners of the retention module (20). In assembly of the heat sink assembly, the pins (30) are interferentially positioned in the positioning holes (28) of the retention module (20). Portions of the pins (30) extending out beyond the retention module (20) are welded to the printed circuit board (10). The clip (50) cooperates with the retention module (20) to press the heat sink (40) against the electronic package (100).

Abstract: A heat dissipation device assembly includes a heat sink (20) placed on an electronic component (52) which is mounted on a printed circuit board (PCB) (50) and including a pair of shoulders (23) on opposite sides thereof, a pressing part (30) including a pair of pressing portions (36) supported on the shoulders and a pair of locking portions (34) spaced from the shoulders, a sliding part (40) slidably attached to the pressing part and including a pair of locking portions (41) spaced from the shoulder, and a back plate (60) mounted below the PCB and including four posts (61) extending through the PCB and the heat sink to resilently engage with the locking portions. Each locking portion defines a locking opening (33, 43) including an entrance (33a, 43a) and a locking slot (33b, 43b), the post being capable of extending through the entrance to engage in the locking slot.

Abstract: A heat sink (1) includes a heat-conductive base (20), and a plurality of combined fins (10) uprightly attached onto the base. Each fin includes a main body (12), and a flange (14) extending perpendicularly from the main body. A pair of locking plates (16) is bent downwardly from an upper edge of the main body. A pair of blocking tabs (18) is stamped from the main body, corresponding to a middle portion of each locking plate. A receiving space is defined between said pair of blocking tabs and the main body. The locking plates and the blocking tabs are respectively located at opposite main faces of the main body. The locking plates of each fin are inserted in the receiving spaces of an adjacent fin, whereby the fins are firmly combined together.

Abstract: A heat sink mounting assembly includes a socket (90) having first and second side, a retaining clip (10) cooperating with the socket to sandwich a heat sink (70) therebetween. A pair of ears (92) is formed at the first and second sides of the socket. The retaining clip includes a pressing body (11) having first and second ends, a first leg (14) extending from the first end thereof and engaging with one ear, a spring (50) attached to the pressing body, and a second leg (30) attached to the second end thereof and biased by the spring. When the second leg is pressed down toward the socket, the spring biases the second leg upwardly, so that the second leg is resiliently engaged with the other ear. Thus, the heat sink is secured between the socket and the retaining clip.

Abstract: A heat sink mounting assembly includes a retention module (80) accommodating a heat sink (50) therein, and two retaining units (10) cooperating with the retention module to secure the heat sink therein. Each retaining unit includes a retaining clip (20) engaging with the retention module, and a pressing body (40) attached to the retaining clip. The pressing body includes a pressing portion (42) urging against the heat sink, and two releasing arms (46) each having a spring finger (48) snappingly engaging with the retaining clip when the pressing body is pressed toward the heat sink. When the releasing arms are squeezed, the spring fingers disengage from the retaining clip, and the pressing portion is released from the heat sink.

Abstract: A heat sink assembly (20) includes a number of parallel first fins (40) and a number of parallel second fins (60) each having a main body (44, 64). A number of latch slots (46) is defined in the main body of each first fin. A number of latches (66) extends from the main body of each second fin in opposite directions. The first fins and the second fins are assembled together in interleaved fashion, so that the latches of each second fin engage in the latch slots of two adjacent first fins respectively.

Abstract: A heat dissipation device assembly includes a heat sink (20) placed on an electronic component (52) which is mounted on a printed circuit board (PCB) (50) and including a pair of shoulders (23) on opposite sides thereof, a pressing part (30) including a pair of pressing portions (36) supported on the shoulders and a pair of locking portions (34) spaced from the shoulders, a sliding part (40) slidably attached to the pressing part and including a pair of locking portions (41) spaced from the shoulder, and a back plate (60) mounted below the PCB and including four posts (61) extending through the PCB and the heat sink to resilently engage with the locking portions. Each locking portion defines a locking opening (33, 43) including an entrance (33a, 43a) and a locking slot (33b, 43b), the post being capable of extending through the entrance to engage in the locking slot.

Abstract: A heat dissipation device (30) includes a base (50) and a plurality of individual fin plates (40) standing side by side on the base. Each fin plate includes a main body (41), a flange (43) and a pair of tabs (45) distal from the flange. Each tab defines a split (46) in a middle thereof where it adjoins the corresponding main body and thereby forms a tongue (47) surrounded on three sides by the split. The tongue is coplanar with the main body while the flange and the tabs are perpendicular to the main body. A slot (49) is defined in a distal end of each tab. The flanges of the fin plates are in alignment with each other and attached on the base. The slots of each fin plate receive the tongues of an adjoining preceding fin plate.

Abstract: A heat sink mounting assembly includes a socket (90) having first and second side, a retaining clip (10) cooperating with the socket to sandwich a heat sink (70) therebetween. A pair of ears (92) is formed at the first and second sides of the socket. The retaining clip includes a pressing body (11) having first and second ends, a first leg (14) extending from the first end thereof and engaging with one ear, a spring (50) attached to the pressing body, and a second leg (30) attached to the second end thereof and biased by the spring. When the second leg is pressed down toward the socket, the spring biases the second leg upwardly, so that the second leg is resiliently engaged with the other ear. Thus, the heat sink is secured between the socket and the retaining clip.

Abstract: A heat sink assembly (20) includes a number of parallel first fins (40) and a number of parallel second fins (60) each having a main body (44, 64). A number of latch slots (46) is defined in the main body of each first fin. A number of latches (66) extends from the main body of each second fin in opposite directions. The first fins and the second fins are assembled together in interleaved fashion, so that the latches of each second fin engage in the latch slots of two adjacent first fins respectively.

Abstract: A heat dissipation device (30) includes a base (50) and a plurality of individual fin plates (40) standing side by side on the base. Each fin plate includes a main body (41), a flange (43) and a pair of tabs (45) distal from the flange. Each tab defines a split (46) in a middle thereof where it adjoins the corresponding main body and thereby forms a tongue (47) surrounded on three sides by the split. The tongue is coplanar with the main body while the flange and the tabs are perpendicular to the main body. A slot (49) is defined in a distal end of each tab. The flanges of the fin plates are in alignment with each other and attached on the base. The slots of each fin plate receive the tongues of an adjoining preceding fin plate.

Abstract: A heat sink (1) includes a heat-conductive base (20), and a plurality of combined fins (10) uprightly attached onto the base. Each fin includes a main body (12), and a flange (14) extending perpendicularly from the main body. A pair of locking plates (16) is bent downwardly from an upper edge of the main body. A pair of blocking tabs (18) is stamped from the main body, corresponding to a middle portion of each locking plate. A receiving space is defined between said pair of blocking tabs and the main body. The locking plates and the blocking tabs are respectively located at opposite main faces of the main body. The locking plates of each fin are inserted in the receiving spaces of an adjacent fin, whereby the fins are firmly combined together.

Abstract: A heat sink mounting assembly includes a retention module (80) accommodating a heat sink (50) therein, and two retaining units (10) cooperating with the retention module to secure the heat sink therein. Each retaining unit includes a retaining clip (20) engaging with the retention module, and a pressing body (40) attached to the retaining clip. The pressing body includes a pressing portion (42) urging against the heat sink, and two releasing arms (46) each having a spring finger (48) snappingly engaging with the retaining clip when the pressing body is pressed toward the heat sink. When the releasing arms are squeezed, the spring fingers disengage from the retaining clip, and the pressing portion is released from the heat sink.

Abstract: A mounting device, for mounting a plurality of fans (50) to a server chassis (70), includes a tray (20), a plurality of brackets (30), and a plurality of fasteners (40). The tray includes a plurality of pairs of mounting sections each pair fixed with a corresponding bracket. Each bracket is U-shaped and includes a pair of side plates (32) for sandwiching a corresponding fan therebetween. Each bracket defines a pair of coaxial locking holes (35′) in the side plates. Each fastener includes a pair of locking ends (42) received in the locking holes of a corresponding bracket to thereby sandwich the corresponding fan in the bracket. Each side plate defines an outlet (34) having a contour corresponding to a contour of an outlet of a corresponding fan, and each mounting section of the tray has a contour corresponding to a contour of the outlet of a corresponding fan.

Abstract: A clip (10) for securing a heat sink (20) to an electronic chip (40) mounted on a socket (30) includes a substantially V-shaped body (11), first and a second legs (14,15) depending from respective opposite ends of the body, and a handle (17) formed at the second leg for facilitating manual operation. The body has a horizontal pressing section (12). Each leg defines a first opening (16) for engagingly receiving a respective projection (32) of the socket. The handle is integrally formed by cutting and bending material from the body and the second leg, and comprises a generally V-shaped body (171) and an operating section (172). The operating section projects out from second leg. Pressing the handle enables the second leg to be resiliently engaged with the corresponding projection of the socket.

Abstract: A heat sink assembly of the present invention includes a printed circuit board (10), a retention module (20), four pins (30), a heat sink (40) and a clip (50). The printed circuit board has an electronic package (100) mounted thereon. The retention module is integrally formed, substantially rectangular, and has a symmetrical configuration. The retention module defines an openings (26) therein for surrounding the electronic package. Four positioning holes (28) are defined in four corners of the retention module. In assembly of the heat sink assembly, the pins are interferentially positioned in the positioning holes of the retention module. Portions of the pins extending out beyond the retention module are welded to the printed circuit board. The clip cooperates with the retention module to press the heat sink against the electronic package.

Abstract: A clip (10) for securing a heat sink (20) to an electronic chip (40) mounted on a socket (30) includes a substantially V-shaped body (11), first and a second legs (14, 15) depending from respective opposite ends of the body, and a handle (17) formed at the second leg for facilitating manual operation. The body has a horizontal pressing section (12). Each leg defines a first opening (16) for engagingly receiving a respective projection (32) of the socket. The handle is integrally formed by cutting and bending material from the body and the second leg, and comprises a generally V-shaped body (171) and an operating section (172). The operating section projects out from the second leg. Pressing the handle enables the second leg to be resiliently engaged with the corresponding projection of the socket.