Patents by Inventor Wan Looi

Wan Looi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD OF MANUFACTURING DIFFERENT BOND PADS ON THE SAME SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE
    Publication number: 20050253262
    Abstract: A method for manufacturng an integrated circuit package is provided with a substrate having first and second contact pads exposed through a passivation layer on the substrate. A first metallurgy layer is formed over the substrate. A second metallurgy layer is formed over the first metallurgy layer. The first metallurgy layer is removed while leaving a portion thereof over the second contact pad. The second metallurgy layer is removed while leaving a portion thereof over the second contact pad. A protective layer is formed over the first contact pad while removing the first metallurgy layer.
    Type: Application
    Filed: May 13, 2004
    Publication date: November 17, 2005
    Applicant: ST ASSEMBLY TEST SERVICES LTD.
    Inventors: Lun Zhao, Wan Looi, Kyaw Aung, Yonggang Jin, Jae-Yong Song, Won Shin