Abstract: A structure for double-sided light box, comprising a frame having a plurality of wiring ducts disposed on its inner surface for placing electric wires, said frame having two trenches correspondingly disposed on an outer rim of said frame, an upper and a lower lid pivotally connected to said trench with a plurality of spring blades disposed among said upper and said lower lid and said frame to fixedly hold said upper and said lower lid to said frame by means of a elastic force of the spring blades; a recess being disposed at a inner rim for holding surrounding edges of a lighting component and a double-sided backlight module; said backlight module having its upper and lower surface attached to one advertising panel respectively, with said upper and said lower lid clasping fixedly advertising panels and said backlight module; when said lighting component generating a first light source, said first light source projecting light on said backlight module to let said upper and lower surface of said backlight module

Abstract: The present invention relates to a process for preparing a precursor solution for polyimide/silica composite material and a process for forming a polyimide/silica composite material film on a substrate, comprising adding a monomer of a silane compound to allow a poly(amic acid) to carry a silica moiety; adding a monomer of formula (R6)xSi(R7)(4-x) to allow the silica moiety to carry a photo-polymerizable unsaturated group; and adding a monomer of formula R8N(R9)2 to allow the poly(amic acid) to carry a photo-polymerizable unsaturated group, where R6, R7, R8, R9, and x are as defined in the specification. The present invention also relates to a precursor solution for polyimide/silica composite material and a polyimide/silica composite material. The composite material of the present invention is useful in microelectronic devices, semiconductor elements, and photoelectric elements.

Abstract: A package structure for a multi-chip integrated circuit (IC) is disclosed and the structure includes substrate having a position for bonding with chips for chip-bonding and having at least a hole for the passage of a gold wire in the course of wire-bonding, a first chip attached to the substrate with a chip bonding agent and being wire-bonded on the substrate and the chip bonding position being opposite to the 2nd chip with the substrate in-between, and the gold wire of the wire-bonding passed through the hole of the substrate from the substrate bonding pad at the substrate and on the same lateral side of the second chip and being connected to the pin pad of the first chip, at least a second chip being flip-chip bonded onto the substrate and the bonding position being at different sides of the bonding between the substrate and the first chip, and a package body including filler of the second chip extended to cover the hole of the substrate and the first chip and the gold wire connected to the substrate and th

Abstract: A signal adapter for memory card serving as a signal bridge for transfer data between a memory card and a computer, etc, mainly comprise a base plate and an upper and a lower board, which enclose a plurality of overlapped slot space for receiving memory cards in different measurements. The signal adapter may be transplanting to a generic card reader to become a low-cost universal card reader for reading various memory cards.

Abstract: A handy encasement for sign or advertisement board is essentially sustained with a couple of transverse skeletons and a couple of longitudinal skeletons. The transverse or longitudinal skeletons are equipped with a base and an upper lid combined together so as to encircle an accommodation space. A spring bow is intercalated between the base and the upper lid of the transverse skeletons such that the upper lid can keep a proper open angle with the base by its one side remains articulated with the base thereby facilitating replacement of inner components of the encasement. Jointing four mating portions between the bases and the upper lids with four corner junctions and patch members configurates a handy encasement without the need of any tools. A rectangular slot formed along inner edges of the encasement makes it possible to glaze a surface board on each surface for signs or advertisements.

Abstract: A fabrication method for solder bump pattern of rear section wafer package is disclosed and the method includes the steps of: (a) pattern-etching the wafer at a passivation layer for the positioning of the solder bump; (b) depositing the entire under bump metal layer,

Abstract: A method of wire bonding of a semiconductor device for resolving oxidation of copper bonding pad is disclosed. The method comprises the steps of exposing the copper bonding pad of a wafer which has been completed with semiconductor circuit fabrication; covering the copper bonding pad of the wafer with a protective anti-oxidization film which will be vaporized when heated; performing wire bonding directly without requiring the removal of the protective film, employing ultrasonic vibration energy, pressurizing deformation energy and heat energy in the course of bonding to vaporize the protective film so that the metal wire and the copper pad form a large area intermetallic compound layer for bonding.

Abstract: A battery unit cell with improved conductive sealing by shielding the positive tablet electrode with a conductive polymeric sheet such as a thermo-plastic rubber sheet dispersed with acetylene black. This improved sealing alleviates the adverse loss of moisture from the battery unit cell and enhances the shelf- or storage-life of batteries with cells with such improved sealing means or methods.

Abstract: The present invention discloses a memory card adapter structure, comprising a main body and a baseboard. The main body is overlapped on the baseboard and has a socket on one end. The socket can host different types of memory cards. There are multi PIN receptacles in the socket. On the baseboard, there is a containing hole against the PIN receptacles on the main body. Furthermore, there is a connector at one side of the baseboard. When the main body is coupled with the baseboard, the PIN receptacles will enter into the containing hole, and then the PINs in the receptacle will contact with the baseboard to form a closed circuit. In this way, different memory cards can be connected to the adapter to transfer signals and data at different times.

Abstract: An open-typed multi-chip stack-packaging is disclosed and the packaging comprises a substrate having a first surface and a second surface, at least a through opening formed on the substrate, and including at least two layers of circuitry to electrically transmit signals; at least a first chip positioned on the upper section of the opening of the first surface and a plurality of protruded blocks being soldered onto the circuitry on the first surface of the substrate at the external region of the substrate for electrically connection; at least a second chip stacked onto the first chip and the second chip being connected electrically to the circuitry of the first surface with gold lines; at least a third chip positioned at the lower section of the opening of the second surface and having a size smaller than the first chip, and a plurality of protruded blocks being used to electrically bond with the center position of the first chip, and adhesive being used to fill the first chip and the third chip, and the regio

Abstract: A coupling assembly for plugging and conductively jointing an interface card with an external circuit board comprises a plastic housing including a ground piece, a plurality of conductive pins, and an adapter circuit board, wherein the ground piece and the plurality of conductive pins are disposed in the adapter circuit board while a plurality of outward connecting pins is disposed under the adapter circuit board for conductively jointing the ground piece and the conductive pins with the outward connecting pins.

Abstract: An electric connector structure is disclosed. The frame body thereof is integrally formed with a vertical plate and a horizontal plate which are connected with each other, and the aforementioned connector with a plurality of terminal inserting holes is formed integrally on the horizontal plate, place of the connection of horizontal plate and the vertical plate is installed with connector mounting hole, the connector mounting hole is used to mount the second connector. A notch for mounting the first connector and cause the terminal pins on the first connector is inserted into these inserting holes. Thus, the error induced from assembly is prevented.

Abstract: A memory card connector in which an axial helical spring returns the actuator rod to its original forward position after the push button has been used to eject the memory card. The push button is also foldable to a transverse position when not in use.

Abstract: A memory card connector which comprises a header (210, 210') and a carrier connected to the header, wherein the header is provided with a plurality of pins extended in both inward and outward directions. The inward pins are used for inserting a memory card to be received in the carrier. A vertical circuit board (214, 214') is electrically and securely connected to the outward pins of the header. The lower end of the vertical circuit board is detachably inserted into a connector (203, 203') securely mounted to the surface of a mainboard for electrical connection. Alternately a horizontal circuit board may be used to which the outward pins are diagonally attached and which is connected to the mainboard by a vertical connector. The height of the circuit board can be set according to the requirement of a specific application of the memory card connector so that the space between the memory card connector and the mainboard can be properly utilized.