Abstract: Provided is an anesthetic composition for locally administering a local anesthetic agent to a subject in need thereof. The anesthetic composition has a lipid based complex prepared by hydrating a lipid cake containing a local anesthetic agent and a lipid mixture with an aqueous buffer solution at a pH higher than 5.5. Also provided is a method to prepare an anesthetic composition using a simpler and more robust for large-scale manufacture and for providing a high molar ratio of local anesthetic agent to phospholipid content as compared to the prior art. This anesthetic composition has a prolonged duration of efficacy adapted to drug delivery.

Abstract: Provided is a liposomal sustained-release composition for use in treatment of pulmonary disease. The liposomal sustained release composition comprises a liposome that includes a polyethylene glycol (PEG)-modified lipid and encapsulates a tyrosine kinase inhibitor. Tyrosine kinase inhibitor is stably entrapped in the liposome, and the resulting liposomal drug formulation can be aerosolized or nebulized for administration via inhalation. This aerosolized liposomal drug formulation yields consistent pharmacokinetic and pharmacodynamic profiles while achieving desired efficacy and safety.

Abstract: Provided is a liposomal sustained-release composition for use in treatment of pulmonary disease. The liposomal sustained release composition comprises a liposome that includes a polyethylene glycol (PEG)-modified lipid and encapsulates a tyrosine kinase inhibitor. Tyrosine kinase inhibitor is stably entrapped in the liposome, and the resulting liposomal drug formulation can be aerosolized or nebulized for administration via inhalation. This aerosolized liposomal drug formulation yields consistent pharmacokinetic and pharmacodynamic profiles while achieving desired efficacy and safety.

Abstract: Provided is a liposomal sustained release composition of bronchodilator for use in treatment of pulmonary disease. The liposomal bronchodilator has a liposome containing a bronchodilator entrapped in the liposome. The bronchodilator has been stably encapsulated in the liposome, and the resulting liposomal bronchodilator is proven to be stably aerosolized or nebulized for administration via the inhalation route to treat a subject in need thereof.

Abstract: Provided is a pharmaceutical composition for use in treating postsurgical pain. The pharmaceutical composition comprises a lipid-based complex. The lipid-based complex comprises an amide-type anesthetic and at least one lipid, wherein a molar ratio of the amide-type anesthetic to the at least one lipid of the lipid-based complex is at least 0.5:1. The total amount of the amide-type anesthetic is at least 1.5 to 5 times of a standard therapeutic dose for treating postsurgical pain with the amide-type anesthetic to achieve an improved pain control with desired prolonged analgesic effect.

Abstract: Provided is a liposomal sustained-release composition for use in treatment of pulmonary disease. The liposomal sustained release composition comprises a liposome that includes a polyethylene glycol (PEG)-modified lipid and encapsulates a tyrosine kinase inhibitor. Tyrosine kinase inhibitor is stably entrapped in the liposome, and the resulting liposomal drug formulation can be aerosolized or nebulized for administration via inhalation. This aerosolized liposomal drug formulation yields consistent pharmacokinetic and pharmacodynamic profiles while achieving desired efficacy and safety.

Abstract: Provided is an anesthetic composition for locally administering a local anesthetic agent to a subject in need thereof. The anesthetic composition has a lipid based complex prepared by hydrating a lipid cake containing a local anesthetic agent and a lipid mixture with an aqueous buffer solution at a pH higher than 5.5. Also provided is a method to prepare an anesthetic composition using a simpler and more robust for large-scale manufacture and for providing a high molar ratio of local anesthetic agent to phospholipid content as compared to the prior art. This anesthetic composition has a prolonged duration of efficacy adapted to drug delivery.

Abstract: The present disclosure provides a method for ripening a resistive random access memory (RRAM). The method includes: obtaining a first RRAM, wherein the first RRAM includes a plurality of memory cells; performing a forming operation and an initial reset operation on the first RRAM to form a plurality of specific memory cells in the memory cells; reading a specific number of the specific cells, and determining a ripening cycle parameter according to the specific number; and performing a ripening operation on the first RRAM based on the ripening cycle parameter to ripen the first RRAM as a second RRAM.

Abstract: Some examples describe a first helical structure of an electromagnetic inductor coil. In some examples, at least a portion of the first helical structure of the electromagnetic inductor coil is inside a first substrate. Further, some examples describe a second helical structure of the electromagnetic inductor coil. In some instances, at least a portion of the second helical structure is nested within the first helical structure of the electromagnetic inductor coil. Further, in some examples, the at least the portion of the second helical structure is inside the first substrate.

Abstract: Some examples describe a first helical electromagnetic coil of a transformer. In some instances, at least a portion of the first helical electromagnetic coil is inside a first semi-conductive substrate. Further, in some examples, the first helical electromagnetic coil has a shape with an internal space. Further, some examples describe a second helical electromagnetic coil of the transformer. In some instances, at least a portion of the second helical electromagnetic coil is nested within the internal space of the first helical electromagnetic coil. Further, in some examples, the at least the portion of the second electromagnetic coil is inside the first semi-conductive substrate.

Abstract: Systems and methods are provided for capturing mutual coupling effects between an integrated circuit chip and chip package using electronic design automation (EDA) tools. Specifically, a method is provided that is implemented in a computer infrastructure for designing an integrated circuit chip. The method includes compiling process technology parameters that describe electrical behavior for a chip-package coupling and a package of the integrated circuit chip. The method also includes generating a parasitic technology file to include the compiled process technology parameters.

Abstract: Systems and methods are provided for capturing mutual coupling effects between an integrated circuit chip and chip package using electronic design automation (EDA) tools. Specifically, a method is provided that is implemented in a computer infrastructure for designing an integrated circuit chip. The method includes compiling process technology parameters that describe electrical behavior for a chip-package coupling and a package of the integrated circuit chip. The method also includes generating a parasitic technology file to include the compiled process technology parameters.

Abstract: At least one through-substrate via is formed around the periphery of a semiconductor chip or a semiconductor chiplet included in a semiconductor chip. The at least one through-substrate via may be a single through-substrate via that laterally surrounds the semiconductor chip or the semiconductor chiplet, or may comprise a plurality of through-substrate vias that surrounds the periphery with at least one gap among the through-substrate vias. A stack of back-end-of-line (BEOL) metal structures that laterally surrounds the semiconductor chip or the semiconductor chiplet are formed directly on the substrate contact vias and electrically connected to the at least one through-substrate via. A metallic layer is formed on the backside of the semiconductor substrate including the at least one through-substrate via. The conductive structure including the metallic layer, the at least one through-substrate via, and the stack of the BEOL metal structures function as an electrical ground built into the semiconductor chip.

Abstract: At least one through-substrate via is formed around the periphery of a semiconductor chip or a semiconductor chiplet included in a semiconductor chip. The at least one through-substrate via may be a single through-substrate via that laterally surrounds the semiconductor chip or the semiconductor chiplet, or may comprise a plurality of through-substrate vias that surrounds the periphery with at least one gap among the through-substrate vias. A stack of back-end-of-line (BEOL) metal structures that laterally surrounds the semiconductor chip or the semiconductor chiplet are formed directly on the substrate contact vias and electrically connected to the at least one through-substrate via. A metallic layer is formed on the backside of the semiconductor substrate including the at least one through-substrate via. The conductive structure including the metallic layer, the at least one through-substrate via, and the stack of the BEOL metal structures function as an electrical ground built into the semiconductor chip.