Abstract: Integrated circuit device probing, testing and burn-in are performed in parallel before device packaging. A multiple die carrier has insets for holding dies with respect to a probe tip substrate, which has an array of contacts arranged to contact test pads on the dies to be tested within the die carrier. A top cover includes a set of pogo pins or similar pressure devices corresponding in number and position to the dies within the die carrier. When the top cover is positioned over the die carrier, the pressure devices on the top cover individually apply pressure to the corresponding dies within the die carrier, thereby holding each die against the corresponding contacts of the probe tip substrate. The fixture has locking mechanisms to hold the top cover, die carrier and probe tip substrate together so as to be stable during testing and burn-in.

Abstract: An apparatus for probing a semiconductor wafer includes one or more probe tips, the position of each being self-adjustable according to the pressure and direction of the pressure applied to it. In the present invention, elastic probe assemblies (which include the probe tips) independently move to compensate when the wafer expands in size due to thermal expansion and/or changes of probing pressure.