Patents by Inventor Wan Ti Lin

Wan Ti Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240408708
    Abstract: An ingot edge-polishing machine tool includes a case body, a support base, a first limiting assembly, a second limiting assembly, a polishing assembly, and an ingot fixing assembly. The support base is movably disposed on the case body along a first axis. The first limiting assembly is detachably disposed on the case body. The first limiting assembly is configured to limit a position of the support base on the first axis. The polishing assembly is movably disposed above the support base along the first axis. The second limiting assembly is detachably disposed on the case body. The second limiting assembly is configured to limit a position of the polishing assembly on the first axis. The ingot fixing assembly is rotatably disposed around a second axis and located between the support base and the polishing assembly. The support base is adapted to support an ingot.
    Type: Application
    Filed: August 19, 2024
    Publication date: December 12, 2024
    Applicant: GlobalWafers Co., Ltd.
    Inventors: Wan Ti Lin, Tang-Chi Lin
  • Publication number: 20230038035
    Abstract: An ingot jig assembly is provided, including an end surface clamping jig and an ingot positioning jig. The end surface clamping jig includes two opposite clamping parts. The ingot positioning jig is located below the end surface clamping jig and includes a first base, an adjusting base, and two rollers. The adjusting base is located between the first base and the end surface clamping jig and is movably disposed on the first base along a first axis to be close to or away from the end surface clamping jig. The two rollers are rotatably disposed on the adjusting base. An ingot edge-polishing machine tool is also provided.
    Type: Application
    Filed: July 8, 2022
    Publication date: February 9, 2023
    Applicant: GlobalWafers Co., Ltd.
    Inventors: Wan Ti Lin, Tang-Chi Lin