Abstract: A controlling method for a wireless communication device is provided. The controlling method for the wireless communication device includes: attaching a first Universal Subscriber Identity Module (USIM) to a Long-Term Evolution (LTE) network; determining whether a second USIM is camped on the LTE network; detecting whether a paging collision is happened, if the second USIM is camped on the LTE network; generating a requested International Mobile Subscriber Identity (IMSI) offset for the second USIM, if the paging collision is happened, wherein the requested IMSI offset is 1 or min(T, nB)?1, T is a default paging period and nB is a number of paging occurrences within the default paging period; transmitting an attach request with the requested IMSI offset to the LTE network for the second USIM; receiving a negotiated IMSI offset from the LTE network; and attaching the second USIM to the LTE network with the negotiated IMSI offset.

Abstract: A buffer circuit includes an input terminal configured to receive an input signal, an output terminal, an inverter, and a resistor-capacitor (RC) circuit coupled in series with the inverter between the input terminal and the output terminal. The RC circuit includes an NMOS transistor coupled between an RC circuit output terminal and a reference node, a resistor coupled between the RC circuit output terminal and a power supply node, and a capacitor coupled between the RC circuit output terminal and one of the power supply node or the reference node, and the inverter and the RC circuit are configured to generate an output signal at the output terminal based on the input signal.

Abstract: Methods of recovery of pristine polymers and hydrocarbon mixtures from a sorted waste feedstock or mixtures of waste feedstock, which are with or without organic additives are disclosed. The methods include Sequential Selective Extraction and Adsorption (SSEA), Hydrothermal Processing (HTP), and a combination of SSEA and HTP. Exemplarily, SSEA includes selecting a first solvent (S1), inputting the S1 and a sorted feedstock free of organic additives into an extractor, heating, waiting, and separating insolubles forming a pristine polymer solution. Exemplarily, HTP includes inputting a hydrothermal solvent and a sorted feedstock free of organic additives into a reactor, heating to form subcritical or supercritical H2O, waiting, causing thermal depolymerization to produce a slurry, cooling, venting formed gases and separating the hydrocarbon mixture.

Abstract: Methods of recovery of pristine polymers and hydrocarbon mixtures from a sorted waste feedstock or mixtures of waste feedstock, which are with or without organic additives are disclosed. The methods include Sequential Selective Extraction and Adsorption (SSEA), Hydrothermal Processing (HTP), and a combination of SSEA and HTP. Exemplarily, SSEA includes selecting a first solvent (S1), inputting the S1 and a sorted feedstock free of organic additives into an extractor, heating, waiting, and separating insolubles forming a pristine polymer solution. Exemplarily, HTP includes inputting a hydrothermal solvent and a sorted feedstock free of organic additives into a reactor, heating to form subcritical or supercritical H2O, waiting, causing thermal depolymerization to produce a slurry, cooling, venting formed gases and separating the hydrocarbon mixture.

Abstract: A semiconductor package is provided, which includes: a carrier; at least an interposer disposed on the carrier; an encapsulant formed on the carrier for encapsulating the interposer while exposing a top surface of the interposer; a redistribution layer formed on the encapsulant and the top surface of the interposer; and at least a semiconductor element disposed on the redistribution layer. The top surface of the interposer is flush with a surface of the encapsulant so as for the redistribution layer to have a planar surface for disposing the semiconductor element, thereby preventing warpage of the interposer and improving the reliability of electrical connection between the redistribution layer and the semiconductor element.

Abstract: A device for data management, the device is in communication with a memory and includes: a verification module configured to receive a first identity information and a first request and verify the first identity information; a search module configured to search for at least one first data stored in the memory in response to the first request if the first identity information is verified, the at least one first data being assigned a first rating point; and an evaluation module configured to receive a second rating point associated with the first identification information, retrieve the first rating point from the at least one first data and generate a third rating point in accordance with the verified first identity information, the first rating point and the second rating point and store the third rating point in the memory.

Abstract: A semiconductor package is provided, including: a carrier; at least an interposer disposed on the carrier; an encapsulant formed on the carrier for encapsulating the interposer while exposing a top side of the interposer; a semiconductor element disposed on the top side of the interposer; and an adhesive formed between the interposer and the semiconductor element. By encapsulating the interposer with the encapsulant, warpage of the interposer is avoided and a planar surface is provided for the semiconductor element to be disposed thereon, thereby improving the reliability of electrical connection between the interposer and the semiconductor element.

Abstract: A semiconductor package is provided, including: a carrier; at least an interposer disposed on the carrier; an encapsulant formed on the carrier for encapsulating the interposer while exposing a top side of the interposer; a semiconductor element disposed on the top side of the interposer; and an adhesive formed between the interposer and the semiconductor element. By encapsulating the interposer with the encapsulant, warpage of the interposer is avoided and a planar surface is provided for the semiconductor element to be disposed thereon, thereby improving the reliability of electrical connection between the interposer and the semiconductor element.

Abstract: A semiconductor package is provided, including: a carrier; at least an interposer disposed on the carrier; an encapsulant formed on the carrier for encapsulating the interposer while exposing a top side of the interposer; a semiconductor element disposed on the top side of the interposer; and an adhesive formed between the interposer and the semiconductor element. By encapsulating the interposer with the encapsulant, warpage of the interposer is avoided and a planar surface is provided for the semiconductor element to be disposed thereon, thereby improving the reliability of electrical connection between the interposer and the semiconductor element.

Abstract: The present invention provides a liquid crystal lenticular lens including a first substrate, a second substrate, a liquid crystal layer, two first electrodes, two second electrodes, and a common electrode. The second substrate and the first substrate are disposed opposite to each other. The liquid crystal layer is disposed between the first substrate and the second substrate, and the liquid crystal layer has an ordinary refractive index and an extraordinary refractive index. The first electrodes and the second electrodes are disposed between the first substrate and the liquid crystal layer, and the second electrodes are disposed between the first electrodes. The common electrode is disposed between the second substrate and the liquid crystal layer.

Abstract: The present invention provides a semiconductor package and a method of fabricating the same. The semiconductor package includes a substrate, a package unit mounted on and electrically connected to the substrate, and a second encapsulant formed on the substrate and encapsulating the package unit. The package unit includes an interposer, a semiconductor chip mounted on the interposer in a flip-chip manner, and a first encapsulant formed on the interposer and encapsulating the semiconductor chip. The present invention reduces the fabricating time and increases the yield of the final product.

Abstract: A semiconductor package is provided, which includes: a semiconductor substrate having opposite first and second surfaces; an adhesive layer formed on the first surface of the semiconductor substrate; at least a semiconductor chip disposed on the adhesive layer; an encapsulant formed on the adhesive layer for encapsulating the semiconductor chip; and a plurality of conductive posts penetrating the first and second surfaces of the semiconductor substrate and the adhesive layer and electrically connected to the semiconductor chip, thereby effectively reducing the fabrication cost, shortening the fabrication time and improving the product reliability.

Abstract: The present invention provides a liquid crystal lenticular lens including a first substrate, a second substrate, a liquid crystal layer, two first electrodes, two second electrodes, and a common electrode. The second substrate and the first substrate are disposed opposite to each other. The liquid crystal layer is disposed between the first substrate and the second substrate, and the liquid crystal layer has an ordinary refractive index and an extraordinary refractive index. The first electrodes and the second electrodes are disposed between the first substrate and the liquid crystal layer, and the second electrodes are disposed between the first electrodes. The common electrode is disposed between the second substrate and the liquid crystal layer.

Abstract: A semiconductor package is provided, which includes: a carrier; at least an interposer disposed on the carrier; an encapsulant formed on the carrier for encapsulating the interposer while exposing a top surface of the interposer; a redistribution layer formed on the encapsulant and the top surface of the interposer; and at least a semiconductor element disposed on the redistribution layer. The top surface of the interposer is flush with a surface of the encapsulant so as for the redistribution layer to have a planar surface for disposing the semiconductor element, thereby preventing warpage of the interposer and improving the reliability of electrical connection between the redistribution layer and the semiconductor element.

Abstract: A semiconductor package is provided, which includes: a semiconductor substrate having opposite first and second surfaces; an adhesive layer formed on the first surface of the semiconductor substrate; at least a semiconductor chip disposed on the adhesive layer; an encapsulant formed on the adhesive layer for encapsulating the semiconductor chip; and a plurality of conductive posts penetrating the first and second surfaces of the semiconductor substrate and the adhesive layer and electrically connected to the semiconductor chip, thereby effectively reducing the fabrication cost, shortening the fabrication time and improving the product reliability.

Abstract: A device for data management, the device is in communication with a memory and includes: a verification module configured to receive a first identity information and a first request and verify the first identity information; a search module configured to search for at least one first data stored in the memory in response to the first request if the first identity information is verified, the at least one first data being assigned a first rating point; and an evaluation module configured to receive a second rating point associated with the first identification information, retrieve the first rating point from the at least one first data and generate a third rating point in accordance with the verified first identity information, the first rating point and the second rating point and store the third rating point in the memory.

Abstract: A video-audio playing system relating to 2-view application and a method thereof are provided. In the present invention, sound signals respectively corresponding to two independent image frames are captured and played in coordinating with the displaying of these two independent image frames. Accordingly, two users can respectively watch two image frames which are different and irrelevant each other in the same display, and further respectively hear sound effects of the respective image frames at the same time.

Abstract: A video-audio playing system relating to 2-view application and a method thereof are provided. In the present invention, sound signals respectively corresponding to two independent image frames are captured and played in coordinating with the displaying of these two independent image frames. Accordingly, two users can respectively watch two image frames which are different and irrelevant each other in the same display, and further respectively hear sound effects of the respective image frames at the same time.