Patents by Inventor Wan Woo JUNG

Wan Woo JUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11925920
    Abstract: The present invention relates to a catalyst for hydrogenation of an aromatic compound, which is capable of greatly reducing the inactivation of a catalyst by using a support including a magnesium-based spinel structure, and a preparation method therefor.
    Type: Grant
    Filed: October 16, 2018
    Date of Patent: March 12, 2024
    Assignee: HANWHA CHEMICAL CORPORATION
    Inventors: Eung Gyu Kim, Won Yong Kim, Jeong Hwan Chun, Young Jin Cho, Joung Woo Han, Hyo Suk Kim, Wan Jae Myeong, Ki Taeg Jung
  • Patent number: 9835883
    Abstract: Disclosed is an automatic bonding system for an LCD device. The automatic bonding system includes a bonding unit configured to perform a process of bonding a first substrate to a second substrate, a first substrate supply unit configured to include an inverting arm and supply the first substrate to the bonding unit, a second substrate supply unit configured to include an adhesive resin coating unit and supply the second substrate to the bonding unit, a pre-hardening unit configured to perform a process of pre-hardening an adhesive resin that adheres the first and second substrates, and a hardening unit configured to perform a process of hardening the adhesive resin that adheres the first and second substrates. A gap between the first and second substrates bonded to each other by the bonding unit is a bonding gap controlled by a gap variable control stage.
    Type: Grant
    Filed: December 19, 2013
    Date of Patent: December 5, 2017
    Assignee: LG DISPLAY CO., LTD.
    Inventors: Wan Woo Jung, Seung Lyul Lee, Chun Il Kim, Chang Yeol Park, Seung kil Lee
  • Publication number: 20140182780
    Abstract: Disclosed is an automatic bonding system for an LCD device. The automatic bonding system includes a bonding unit configured to perform a process of bonding a first substrate to a second substrate, a first substrate supply unit configured to include an inverting arm and supply the first substrate to the bonding unit, a second substrate supply unit configured to include an adhesive resin coating unit and supply the second substrate to the bonding unit, a pre-hardening unit configured to perform a process of pre-hardening an adhesive resin that adheres the first and second substrates, and a hardening unit configured to perform a process of hardening the adhesive resin that adheres the first and second substrates. A gap between the first and second substrates bonded to each other by the bonding unit is a bonding gap controlled by a gap variable control stage.
    Type: Application
    Filed: December 19, 2013
    Publication date: July 3, 2014
    Applicant: LG DISPLAY CO., LTD.
    Inventors: Wan Woo JUNG, Seung Lyul LEE, Chun Il KIM, Chang Yeol PARK, Seung kil LEE