Abstract: A display device may include these elements: a first data line; a second data line; a first subpixel electrode positioned at a first half of the display device, connected to the first data line, and comprising a first member and a second member, the first member extending parallel to the first data line, the second member connecting directly to and extending perpendicular to the first member; and a second subpixel electrode positioned at a second half of the display device, connected to the second data line, and comprising a third member and a fourth member, the third member extending parallel to the second data line, the fourth member connecting directly to and extending perpendicular to the third member, wherein the second member and the fourth member are aligned and are positioned between the first member and the third member in a layout view of the display device.

Abstract: A liquid crystal display includes a first substrate, a gate line disposed on the first substrate, an insulating layer disposed on the gate line, and a pixel electrode disposed on the insulating layer, the pixel electrode including diagonal stems forming a cross shape with each other, and minute branches extending in four different directions from the diagonal stems, in which the minute branches extend in first and second directions to form an angle of 80 degrees to 100 degrees with respect to an extension direction of the gate line, and the minute branches extend in third and fourth directions to form an angle of ?10 degrees to 10 degrees with respect to the extension direction of the gate line.

Abstract: A method of manufacturing an array substrate includes applying a first color filter and a second color filter over a first and second pixel regions respectively and the color filters have an overlapped portion in wiring region; and forming a contact hole, which partially exposes the drain electrode therethrough, by etching at least one of the overlapping first and the second color filters, and the forming the contact hole includes selectively etching an upper part of the overlapped portion during etching a photoresist layer covering the overlapped portion, the overlapped portion of first and second color filters is etched without requiring an additional masking process, preventing a decrease of liquid crystal margin due to large height difference of the overlapped color filters, preventing misalignment of color filters and mixing of colors.

Abstract: A display device includes: a first substrate; a second substrate disposed to face the first substrate; a liquid crystal layer disposed between the first and second substrates; and a pixel electrode disposed on the first substrate and including a plurality of sub-pixel electrodes, wherein the sub-pixel electrode may include an outer electrode, a stem electrode extending in a direction substantially perpendicular to the outer electrode, and a plurality of branch electrodes extending in a predetermined direction from the outer electrode or the stem electrode, and wherein the sub-pixel electrode may be partitioned into first and second areas by the outer and stem electrodes and may include at least one slit disposed at a predetermined angle with respect to the branch electrode in the first area or the second area.

Abstract: A display device may include a first substrate, a second substrate opposite the first substrate, a liquid crystal layer between the first substrate and the second substrate, and a pixel electrode disposed on the first substrate and including a plurality of subpixel electrodes. The subpixel electrode may include a horizontal stem electrode, a plurality of vertical stem electrodes, and a plurality of branch electrodes extending from at least one of the horizontal stem electrode and the vertical stem electrodes.

Abstract: Disclosed herein is a method for manufacturing a semiconductor package. According to a preferred embodiment of the present invention, a method for manufacturing a semiconductor package includes: preparing a rectangular frame having a plurality of quadrangular holes; attaching a plurality of semiconductor chips and the frame on one surface of a tape; forming a molding part on the tape to cover the semiconductor chip and the frame; peeling the tape; forming a resin layer at a portion at which the tape is peeled; and forming a wiring on the resin layer to be connected to the semiconductor chip.

Abstract: The present invention relates to norbornene-ester-based derivatives, to a method for preparing same, and to the uses thereof. This compound may be used as a plasticizer which can replace a phthalate-based plasticizer.

Abstract: Disclosed herein is a method for manufacturing a semiconductor package. According to a preferred embodiment of the present invention, a method for manufacturing a semiconductor package includes: preparing a rectangular frame having a plurality of quadrangular holes; attaching a plurality of semiconductor chips and the frame on one surface of a tape; forming a molding part on the tape to cover the semiconductor chip and the frame; peeling the tape; forming a resin layer at a portion at which the tape is peeled; and forming a wiring on the resin layer to be connected to the semiconductor chip.

Abstract: Disclosed herein is an electronic component package including: a connection member provided on at least one surface of a substrate; an active element coupled to the substrate by the connection member; a molding part covering an exposed surface of the active element; and an additional layer formed on an exposed surface of the molding part to decrease a warpage phenomenon. In the electronic component package, the warpage phenomenon may be decreased as compared with the related art.

Abstract: Disclosed herein is a rotating toothbrush including: a handle provided with a lever; a head part having bristles implanted on a lower surface thereof and a shaft vertically provided on an upper surface thereof; an operating rod provided in the handle and operated in conjunction with the lever to move linearly in a length direction of the handle; a tilting member rotatably supporting the shaft and pressed when the operating rod moves forward, thereby being tilted at a predetermined angle in an upward direction together with the head part based on a tilting axis; and a rotation driving member connected to the operating rod and the shaft to rotate the shaft when the operating rod moves forward, thereby allowing the head part to form a T shape with the handle.

Abstract: Disclosed herein is a rotary toothbrush including: a handle installed with a lever; an operating rod operated together with the lever to linearly move in a length direction of the handle; a tilting member coupled to tilting guide grooves of the operating rod to thereby be tilted when the operating rod moves forward; a head part having a shaft rotatably fixed to the tilting member to thereby be tilted together with the tilting member and having bristles implanted therein; a rotation driving member connected to the operating rod and the shaft and rotating the shaft when the operating rod moves forward, thereby allowing the head part to form a T shape with respect to the handle; and a first fixing part provided between the handle and the lever and fixing the lever in a state in which the lever is rotated forward or rearward.

Abstract: The present invention relates to norbornene-ester-based derivatives, to a method for preparing same, and to the uses thereof. This compound may be used as a plasticizer which can replace a phthalate-based plasticizer.

Abstract: Disclosed herein is a method for manufacturing a semiconductor package. According to a preferred embodiment of the present invention, a method for manufacturing a semiconductor package includes: preparing a rectangular frame having a plurality of quadrangular holes; attaching a plurality of semiconductor chips and the frame on one surface of a tape; forming a molding part on the tape to cover the semiconductor chip and the frame; peeling the tape; forming a resin layer at a portion at which the tape is peeled; and forming a wiring on the resin layer to be connected to the semiconductor chip.

Abstract: The present invention relates to norbornene-ester-based derivatives, to a method for preparing same, and to the uses thereof. This compound may be used as a plasticizer which can replace a phthalate-based plasticizer.

Abstract: A pop-up monitor with an obstacle sensing function is provided. The pop-up monitor includes a body housing and a monitor frame which is installed to move in a vertical direction with respect to the body housing. The pop-up monitor includes a driving unit, a sensor, and a controller. The driving unit includes a motor, a rotational shaft, and a gear set which transfers a rotational motion of the motor to the rotational shaft. The sensor outputs a sensing signal for whether the rotational shaft rotates. The controller outputs a control signal for a rotational direction of the motor according to the sensing signal and state information regarding whether the motor rotates.

Abstract: A thin film transistor array panel includes a substrate. A data line is formed on the substrate. A color filter covers at least a portion of the data line. A shielding electrode is formed on the color filter and is disposed over the data line. A pixel electrode is formed on the color filter and is separated from the shielding electrode. The shielding electrode has a low reflection characteristic.

Abstract: A gear structure is configured to support vertical motion of an electric pop-up monitor. More specifically, a double rack gear structure is configured to support a pop-up monitor. The rack gear structure includes an outer gear and an inner gear. The outer gear is coupled at a side of the monitor frame to operate integrally with the monitor frame, and enables the vertical motion of the monitor frame with an ascending or descending motion. The inner gear is received inside the outer gear. The inner gear performs an ascending or descending motion simultaneously with the outer gear, and supports forward and rearward or right and left shaking, which occurs in the outer gear, by maximizing a portion overlapping with the outer gear when the outer gear has ascended to the maximum.

Abstract: Disclosed herein are a printed circuit board having an embedded electronic device and a method of manufacturing the same. According to a preferred embodiment of the present invention, the printed circuit board having an embedded electronic device includes: a core substrate having circuit layers formed on both surfaces thereof; a taper-shaped cavity formed on the core substrate; and an electronic device embedded in the cavity.

Abstract: Disclosed herein are an image sensor module and a method of manufacturing the same. The image sensor includes: a base substrate having an image sensor mounted groove including a first groove and a second groove having a stepped shape; and an image sensor mounted in a groove of the base substrate.

Abstract: Disclosed herein are a calibration block for measuring warpage, a warpage measuring apparatus using the same, and a method thereof. The calibration block includes a substrate having one planar surface; and a stepped part forming a step at the center of the other surface of the substrate.