Patents by Inventor Wan Yin YAU
Wan Yin YAU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11600516Abstract: A die ejection apparatus operable to eject a die from a support has at least two ejector components configured to lift a die located on the support. The ejector components are moveable to a position in which a lifting force is exertable by the ejector components on the support, so as to lift a die located on the support. Movement of the die ejector components is initiated towards the support, and a moment when each of the die ejector components reaches the position is determined. A height offset of each die ejector component relative to a height of another die ejector component is determined upon reaching the said position, and relative heights of the die ejector components are adjusted in dependence upon the evaluated height offset.Type: GrantFiled: May 13, 2020Date of Patent: March 7, 2023Assignee: ASMPT SINGAPORE PTE. LTD.Inventors: Chi Wah Cheng, Wan Yin Yau, Kwok Pun Law
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Patent number: 11343949Abstract: An apparatus and a method for dispensing a viscous adhesive for attaching a semiconductor die onto a substrate are provided, where the method comprises the steps of dispensing a volume of viscous adhesive from a nozzle onto the substrate and moving the nozzle away from the substrate such that an adhesive tail is formed between the nozzle and the volume of viscous adhesive. The method further comprises the steps of capturing multiple images of the adhesive tail with an imaging device as the nozzle is moving away from the substrate with an imaging device; and thereafter detecting with the imaging device an instant when the adhesive tail breaks from the volume of viscous adhesive.Type: GrantFiled: March 13, 2018Date of Patent: May 24, 2022Assignee: ASM TECHNOLOGY SINGAPORE PTE LTDInventors: Chi Wah Cheng, Wan Yin Yau
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Patent number: 11289445Abstract: An adhesive dispenser for a die bonding apparatus has an adhesive dispenser head configured to dispense adhesive onto bonding pads of a substrate, and a head conveyer configured to convey the adhesive dispenser head along orthogonal first and second axes for dispensing the adhesive onto target dispensing positions on the bonding pads. The head conveyor includes a first linear positioning motor operative to convey the adhesive dispenser head along the first axis and a rotary positioning motor coupled to the first linear positioning motor which is operative to rotate the adhesive dispenser head. The rotary positioning motor is configured to cooperate with the first linear positioning motor to convey the adhesive dispenser head along the second axis to the target dispensing positions.Type: GrantFiled: December 24, 2018Date of Patent: March 29, 2022Assignee: ASM TECHNOLOGY SINGAPORE PTE LTDInventors: Wan Yin Yau, See Lok Chan, Chi Wah Cheng
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Publication number: 20210354355Abstract: A die ejection apparatus operable to eject a die from a support has at least two ejector components configured to lift a die located on the support. The ejector components are moveable to a position in which a lifting force is exertable by the ejector components on the support, so as to lift a die located on the support. Movement of the die ejector components is initiated towards the support, and a moment when each of the die ejector components reaches the position is determined. A height offset of each die ejector component relative to a height of another die ejector component is determined upon reaching the said position, and relative heights of the die ejector components are adjusted in dependence upon the evaluated height offset.Type: ApplicationFiled: May 13, 2020Publication date: November 18, 2021Inventors: Chi Wah CHENG, Wan Yin YAU, Kwok Pun LAW
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Patent number: 10882298Abstract: A bonding apparatus comprises a movable bond head collet, a reference marker configured to move with the bond head collet, a flip head collet, first and second imaging devices and an adjusting mechanism. In use, the first imaging device captures one or more images of the reference marker and the flip head collet, and the second imaging device captures one or more images of the reference marker and the bond head collet. The adjusting mechanism aligns a position of the bond head collet with a position of the flip head collet based on an offset that is determined from the images of the flip head collet, bond head collet and reference marker. The flip head collet retrieves an electrical component and transfers the electrical component to the bond head collet at the alignment position.Type: GrantFiled: November 7, 2016Date of Patent: January 5, 2021Assignee: ASM TECHNOLOGY SINGAPORE PTE LTDInventors: Shui Cheung Woo, Liang Hong Tang, Wan Yin Yau, Wai Yuen Cheung, Kui Kam Lam
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Publication number: 20200203305Abstract: An adhesive dispenser for a die bonding apparatus has an adhesive dispenser head configured to dispense adhesive onto bonding pads of a substrate, and a head conveyer configured to convey the adhesive dispenser head along orthogonal first and second axes for dispensing the adhesive onto target dispensing positions on the bonding pads. The head conveyor includes a first linear positioning motor operative to convey the adhesive dispenser head along the first axis and a rotary positioning motor coupled to the first linear positioning motor which is operative to rotate the adhesive dispenser head. The rotary positioning motor is configured to cooperate with the first linear positioning motor to convey the adhesive dispenser head along the second axis to the target dispensing positions.Type: ApplicationFiled: December 24, 2018Publication date: June 25, 2020Inventors: Wan Yin YAU, See Lok CHAN, Chi Wah CHENG
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Publication number: 20190289760Abstract: An apparatus and a method for dispensing a viscous adhesive for attaching a semiconductor die onto a substrate are provided, where the method comprises the steps of dispensing a volume of viscous adhesive from a nozzle onto the substrate and moving the nozzle away from the substrate such that an adhesive tail is formed between the nozzle and the volume of viscous adhesive. The method further comprises the steps of capturing multiple images of the adhesive tail with an imaging device as the nozzle is moving away from the substrate with an imaging device; and thereafter detecting with the imaging device an instant when the adhesive tail breaks from the volume of viscous adhesive.Type: ApplicationFiled: March 13, 2018Publication date: September 19, 2019Inventors: Chi Wah CHENG, Wan Yin YAU
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Patent number: 10096568Abstract: Disclosed is a die bonding tool comprising: a rigid body; and a collet having a die-holding portion; wherein the collet is mechanically coupled to the rigid body by a flexible element which is configured to angularly deflect relative to the rigid body on application of a torque to the collet and/or to a die held by the collet. Also disclosed is a die bonding system comprising the die bonding tool, and an adhesive dispenser for a die bonding system.Type: GrantFiled: September 18, 2014Date of Patent: October 9, 2018Assignee: ASM TECHNOLOGY SINGAPORE PTE LTDInventors: Kwok Yuen Cheung, Kwok Wah Tong, Jin Hui Meng, Wan Yin Yau, Man Kit Chow
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Patent number: 10050008Abstract: A method, as well as a system implementing the method, for automatically aligning a bond arm with respect to a bonding support surface for supporting a substrate during a bonding process. The method comprises: rotating the bond arm for a first revolution around a longitudinal axis through a bond head moveably coupled to the bond arm, the first revolution including a plurality of predefined rotary angular positions; pausing the rotation of the bond arm at each of the plurality of rotary angular positions; determining a tilt angle of the bond arm relative to the bonding support surface during each pause at the respective rotary angular position; and selecting the rotary angular position of the bond arm which has a tilt angle that satisfies a predefined specification such that the bond arm is aligned substantially perpendicular to the bonding support surface.Type: GrantFiled: January 24, 2017Date of Patent: August 14, 2018Assignee: ASM TECHNOLOGY SINGAPORE PTE LTDInventors: Shui Cheung Woo, Liang Hong Tang, Wan Yin Yau
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Publication number: 20180211932Abstract: A method, as well as a system implementing the method, for automatically aligning a bond arm with respect to a bonding support surface for supporting a substrate during a bonding process. The method comprises: rotating the bond arm for a first revolution around a longitudinal axis through a bond head moveably coupled to the bond arm, the first revolution including a plurality of predefined rotary angular positions; pausing the rotation of the bond arm at each of the plurality of rotary angular positions; determining a tilt angle of the bond arm relative to the bonding support surface during each pause at the respective rotary angular position; and selecting the rotary angular position of the bond arm which has a tilt angle that satisfies a predefined specification such that the bond arm is aligned substantially perpendicular to the bonding support surface.Type: ApplicationFiled: January 24, 2017Publication date: July 26, 2018Inventors: Shui Cheung WOO, Liang Hong TANG, Wan Yin YAU
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Publication number: 20180126718Abstract: A bonding apparatus comprises a movable bond head collet, a reference marker configured to move with the bond head collet, a flip head collet, first and second imaging devices and an adjusting mechanism. In use, the first imaging device captures one or more images of the reference marker and the flip head collet, and the second imaging device captures one or more images of the reference marker and the bond head collet. The adjusting mechanism aligns a position of the bond head collet with a position of the flip head collet based on an offset that is determined from the images of the flip head collet, bond head collet and reference marker. The flip head collet retrieves an electrical component and transfers the electrical component to the bond head collet at the alignment position.Type: ApplicationFiled: November 7, 2016Publication date: May 10, 2018Inventors: Shui Cheung WOO, Liang Hong TANG, Wan Yin YAU, Wai Yuen CHEUNG, Kui Kam LAM
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Publication number: 20160086830Abstract: Disclosed is a die bonding tool comprising: a rigid body; and a collet having a die-holding portion; wherein the collet is mechanically coupled to the rigid body by a flexible element which is configured to angularly deflect relative to the rigid body on application of a torque to the collet and/or to a die held by the collet. Also disclosed is a die bonding system comprising the die bonding tool, and an adhesive dispenser for a die bonding system.Type: ApplicationFiled: September 18, 2014Publication date: March 24, 2016Inventors: Kwok Yuen CHEUNG, Kwok Wah TONG, Jin Hui MENG, Wan Yin YAU, Man Kit CHOW
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Publication number: 20130011941Abstract: A semiconductor die is attached onto a substrate on a process platform during manufacturing of a semiconductor package. A dispenser dispenses an adhesive onto the substrate, and the semiconductor die is bonded onto the adhesive which has been dispensed onto the substrate with a bonding tool. Thereafter, a bond line thickness between a bottom surface of the semiconductor die and a top surface of the substrate on the process platform is measured using a measuring device.Type: ApplicationFiled: July 7, 2011Publication date: January 10, 2013Inventors: Man Wai CHAN, Shiu Kei LAM, Wan Yin YAU, Kwok Yuen CHEUNG