Patents by Inventor Wan YOU

Wan YOU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260051595
    Abstract: A protective plate includes a first composite layer having a thickness of d1 in mm, a metal substrate, and a second composite layer having a thickness of d2 in mm that are sequentially stacked, where d1>0, and d2?0. The first composite layer and the second composite layer each includes a polymer base material and a reinforcing material, the reinforcing material includes nanoparticles, the first composite layer has a tensile strength of ?1 in MPa, the second composite layer has a tensile strength of ?2 in MPa, the metal substrate has a thickness of d3 in mm and a tensile strength of ?3 in MPa, and the protection plate meets a formula: d 3 ( d 1 + d 2 ) + d 3 × ? 3 ( ? 1 + ? 1 ) + ? 3 > 0.032 .
    Type: Application
    Filed: October 27, 2025
    Publication date: February 19, 2026
    Inventors: Peng LI, Long WAN, Shenglin YANG, Yu SHEN, Wan YOU