Patents by Inventor Wan-Yu Chang
Wan-Yu Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11968856Abstract: Exemplary subpixel structures include a directional light-emitting diode structure characterized by a full-width-half-maximum (FWHM) of emitted light having a divergence angle of less than or about 10°. The subpixel structure further includes a lens positioned a first distance from the light-emitting diode structure, where the lens is shaped to focus the emitted light from the light-emitting diode structure. The subpixel structure still further includes a patterned light absorption barrier positioned a second distance from the lens. The patterned light absorption barrier defines an opening in the barrier, and the focal point of the light focused by the lens is positioned within the opening. The subpixels structures may be incorporated into a pixel structure, and pixel structures may be incorporated into a display that is free of a polarizer layer.Type: GrantFiled: October 4, 2021Date of Patent: April 23, 2024Assignee: Applied Materials, Inc.Inventors: Chung-Chih Wu, Po-Jui Chen, Hoang Yan Lin, Guo-Dong Su, Wei-Kai Lee, Chi-Jui Chang, Wan-Yu Lin, Byung Sung Kwak, Robert Jan Visser
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Patent number: 11956994Abstract: The present disclosure is generally related to 3D imaging capable OLED displays. A light field display comprises an array of 3D light field pixels, each of which comprises an array of corrugated OLED pixels, a metasurface layer disposed adjacent to the array of 3D light field pixels, and a plurality of median layers disposed between the metasurface layer and the corrugated OLED pixels. Each of the corrugated OLED pixels comprises primary or non-primary color subpixels, and produces a different view of an image through the median layers to the metasurface to form a 3D image. The corrugated OLED pixels combined with a cavity effect reduce a divergence of emitted light to enable effective beam direction manipulation by the metasurface. The metasurface having a higher refractive index and a smaller filling factor enables the deflection and direction of the emitted light from the corrugated OLED pixels to be well controlled.Type: GrantFiled: August 10, 2021Date of Patent: April 9, 2024Assignee: Applied Materials, Inc.Inventors: Chung-Chih Wu, Hoang Yan Lin, Guo-Dong Su, Zih-Rou Cyue, Li-Yu Yu, Wei-Kai Lee, Guan-Yu Chen, Chung-Chia Chen, Wan-Yu Lin, Gang Yu, Byung-Sung Kwak, Robert Jan Visser, Chi-Jui Chang
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Publication number: 20240093024Abstract: A polymer is formed by capping a copolymer-graft-polylactone with an alcohol, wherein the copolymer is copolymerized from an anhydride monomer with a double bond, a monomer with a double bond, and an initiator. The polymer can be mixed with an organic solvent and pigment powder to form a dispersion. The dispersion can be mixed with a binder to form a paint.Type: ApplicationFiled: November 23, 2022Publication date: March 21, 2024Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Cha-Wen CHANG, Jen-Yu CHEN, Wan-Jung TENG, Wen-Pin CHUANG, Ruo-Han YU
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Patent number: 11398442Abstract: A bonding structure, a package structure, and a method for manufacturing a package structure are provided. The package structure includes a first substrate, a first passivation layer, a first conductive layer, and a first conductive bonding structure. The first passivation layer is disposed on the first substrate and has an upper surface. The first passivation layer and the first substrate define a first cavity. The first conductive layer is disposed in the first cavity and has an upper surface. A portion of the upper surface of the first conductive layer is below the upper surface of the first passivation layer. The first conductive bonding structure is disposed on the first conductive layer.Type: GrantFiled: October 29, 2020Date of Patent: July 26, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Wan Yu Chang, Shao Hsuan Chuang
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Publication number: 20220139854Abstract: A bonding structure, a package structure, and a method for manufacturing a package structure are provided. The package structure includes a first substrate, a first passivation layer, a first conductive layer, and a first conductive bonding structure. The first passivation layer is disposed on the first substrate and has an upper surface. The first passivation layer and the first substrate define a first cavity. The first conductive layer is disposed in the first cavity and has an upper surface. A portion of the upper surface of the first conductive layer is below the upper surface of the first passivation layer. The first conductive bonding structure is disposed on the first conductive layer.Type: ApplicationFiled: October 29, 2020Publication date: May 5, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Wan Yu CHANG, Shao Hsuan CHUANG
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Patent number: 8604358Abstract: An inner wire capable of power integration and power division and adapted for use with an inverter having a casing and a circuit board includes a female connector and a male connector. The female and male connectors are each disposed in the casing and each include power lines, at least two signal lines, and a ground line. The power lines each have one end electrically connected to power connectors in pairs and the other end to power terminals respectively. The signal lines have one end electrically connected to two signal connectors respectively and the other end to signal terminals. The ground lines have one end electrically connected to ground connectors and the other end to ground terminals. The power terminals, signal terminals, and ground terminals are disposed in the male and female connectors. The signal connectors, ground connectors, and power connectors are electrically connected to the circuit board.Type: GrantFiled: September 8, 2011Date of Patent: December 10, 2013Inventor: Wan-Yu Chang
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Publication number: 20130065431Abstract: An inner wire capable of power integration and power division and adapted for use with an inverter having a casing and a circuit board includes a female connector and a male connector. The female and male connectors are each disposed in the casing and each include power lines, at least two signal lines, and a ground line. The power lines each have one end electrically connected to power connectors in pairs and the other end to power terminals respectively. The signal lines have one end electrically connected to two signal connectors respectively and the other end to signal terminals. The ground lines have one end electrically connected to ground connectors and the other end to ground terminals. The power terminals, signal terminals, and ground terminals are disposed in the male and female connectors. The signal connectors, ground connectors, and power connectors are electrically connected to the circuit board.Type: ApplicationFiled: September 8, 2011Publication date: March 14, 2013Inventor: Wan-Yu Chang
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Publication number: 20130062115Abstract: An outdoor control cable includes a cable, a ground terminal, other terminals, and a connector. The cable includes an insulating coating, power lines enclosed by an insulating layer, signal lines enclosed by the insulating layer, and a metal shield. The power lines and the signal lines are enclosed by the insulating coating. The signal lines are further enclosed by the metal shield. The ground terminal is electrically connected to the metal shield. The other terminals are electrically connected to the power lines and the signal lines. The connector includes a casing, a jack, and the ground terminal and other terminals which are protruded and exposed from the jack. Hence, the outdoor control cable has both power lines and signal lines. The metal shield blocks electromagnetic interference from the power lines. The ground terminal is electrically connected to the metal shield and thereby grounds and guides the electromagnetic interference to earth.Type: ApplicationFiled: September 8, 2011Publication date: March 14, 2013Inventor: Wan-Yu Chang