Abstract: A semiconductor die including mechanical-stress-resistant bump structures is provided. The semiconductor die includes dielectric material layers embedding metal interconnect structures, a connection pad-and-via structure, and a bump structure including a bump via portion and a bonding bump portion. The entirety of a bottom surface of the bump via portion is located within an area of a horizontal top surface of a pad portion of the connection pad-and-via structure.

Abstract: A device includes a first buried layer over a substrate, a second buried layer over the first buried layer, a first well over the first buried layer and the second buried layer, a first high voltage well, a second high voltage well and a third high voltage well extending through the first well, wherein the second high voltage well is between the first high voltage well and the third high voltage well, a first drain/source region in the first high voltage well, a first gate electrode over the first well, a second drain/source region in the second high voltage well and a first isolation region in the second high voltage well, and between the second drain/source region and the first gate electrode, wherein a bottom of the first isolation region is lower than a bottom of the second drain/source region.

Abstract: Provided are a package structure and a method of forming the same. The method includes providing a first package having a plurality of first dies and a plurality of second dies therein; performing a first sawing process to cut the first package into a plurality of second packages, wherein one of the plurality of second packages comprises three first dies and one second die; and performing a second sawing process to remove the second die of the one of the plurality of second packages, so that a cut second package is formed into a polygonal structure with the number of nodes greater than or equal to 5.

Abstract: A substrate carrier unit includes a substrate carrier and a phase transition material. The substrate carrier defines an isolated space therein. The phase transition material is filled into the isolated space of the substrate carrier and has a melting point ranging between 18° C. and 95° C. The phase transition material is capable of absorbing thermal energy from the substrate carrier as latent heat to change the phase from solid to liquid.

Abstract: A film deposition system includes a substrate carrier, a film deposition device, a transport device and a cooling device. The substrate carrier includes a carrier body that defines an isolated space therein, and a phase transition material that is filled into the isolated space and that has a melting point ranging between 18° C. and 95° C. The phase transition material is capable of absorbing thermal energy from the carrier body as latent heat to change the phase of the phase transition material from solid to liquid. The cooling device is configured to absorb thermal energy from the substrate carrier so as to change the phase of the phase transition material from liquid to solid.

Abstract: Liquid-crystal compounds, liquid-crystal compositions, and liquid-crystal devices employing the same are provided. The liquid-crystal compound has a structure of Formula (I): wherein R1 is hydrogen, C1-10 alkyl, or C2-10 alkenyl; R2 is, C2-10 alkenyl, or C2-10 fluoroalkenyl, in which one or two nonadjacent —CH2— is replaced by —O—, or C2-10 ether; A1, A2, A3, and A4 are independently R3 is independently hydrogen, or halogen; Z1, Z2, and Z3 are independently single bond, —CH2—, —(CH2)2—, —(CH2)4—, —CH2O—, —OCH2—, —CF?CF—, —(CH2)2CF2O—, —(CH2)2OCF2—, —OCF2(CH2)2—, —CF2O(CH2)2—, —COO—, —OCO—, —CF2O—, —OCF2—, —C?C—, —CH?CH—, —CH?CH—(CH2)2—, or —(CH2)2—CH?CH—; and n and m are independently 1 or 0.

Abstract: A substrate carrier unit includes a substrate carrier and a phase transition material. The substrate carrier defines an isolated space therein. The phase transition material is filled into the isolated space of the substrate carrier and has a melting point ranging between 18° C. and 95° C. The phase transition material is capable of absorbing thermal energy from the substrate carrier as latent heat to change the phase from solid to liquid.

Abstract: A film deposition system includes a substrate carrier, a film deposition device, a transport device and a cooling device. The substrate carrier includes a carrier body that defines an isolated space therein, and a phase transition material that is filled into the isolated space and that has a melting point ranging between 18° C. and 95° C. The phase transition material is capable of absorbing thermal energy from the carrier body as latent heat to change the phase of the phase transition material from solid to liquid. The cooling device is configured to absorb thermal energy from the substrate carrier so as to change the phase of the phase transition material from liquid to solid.

Abstract: A liquid crystal compound of formula (I): where A1, A2, A3, A4, R1, R2, Z1, Z2, Z3, n, and m are as defined in the specification.

Abstract: Liquid-crystal compounds, liquid-crystal compositions, and liquid-crystal devices employing the same are provided. The liquid-crystal compound has a structure of Formula (I): wherein R1 is hydrogen, C1-10 alkyl, or C2-10 alkenyl; R2 is, C2-10 alkenyl, or C2-10 fluoroalkenyl, in which one or two nonadjacent —CH2— is replaced by —O—, or C2-10 ether; A1, A2, A3, and A4 are independently R3 is independently hydrogen, or halogen; Z1, Z2, and Z3 are independently single bond, —CH2—, —(CH2)2—, —(CH2)4—, —CH2O—, —OCH2—, —CF?CF—, —(CH2)2CF2O—, —(CH2)2OCF2—, —OCF2(CH2)2—, —CF2O(CH2)2—, —COO—, —OCO—, —CF2O—, —OCF2—, —C?C—, —CH?CH—, —CH?CH—(CH2)2—, or —(CH2)2—CH?CH—; and n and m are independently 1 or 0.

Abstract: A liquid crystal compound of formula (I): where A1, A2, A3, A4, R1, R2, Z1, Z2, Z3, n, and m are as defined in the specification.

Abstract: Disclosed are virtual glasses try-on method and apparatus, and the apparatus includes an image capturing unit for capturing a user's image and a processing device for detecting a face image from the user's image, storing a glasses model, defining a first feature point of a lens of the glasses model and a second feature point at the center of a frame, and obtaining vertical vectors of the first and second feature points to find a third feature point. Two eye images are searched and binarized into a binarized picture that is divided into an eye area and a non-eye area. A center point between first and second extreme values is found, and vertical vectors of the first extreme value and the center point are obtained to find an example point. An affine transformation of the feature points is performed and attached to the face image to form a try-on image.

Abstract: Disclosed are virtual glasses try-on method and apparatus, and the apparatus includes an image capturing unit for capturing a user's image and a processing device for detecting a face image from the user's image, storing a glasses model, defining a first feature point of a lens of the glasses model and a second feature point at the center of a frame, and obtaining vertical vectors of the first and second feature points to find a third feature point. Two eye images are searched and binarized into a binarized picture that is divided into an eye area and a non-eye area. A center point between first and second extreme values is found, and vertical vectors of the first extreme value and the center point are obtained to find an example point. An affine transformation of the feature points is performed and attached to the face image to form a try-on image.

Abstract: Disclosed is a memory card package with a small substrate by using a metal die pad having an opening to substitute the chip-carrying function of a conventional substrate so that substrate dimension can be reduced. A substrate is attached under the metal die pad. A first chip is disposed on the substrate located inside the opening. A second chip is disposed on the metal die pad without covering the opening. A card-like encapsulant encapsulates the metal die pad, the top surface of the substrate, the first chip, and the second chip. The dimension of the substrate is smaller than the dimension of the encapsulant. The substrate has a lumpy sidewall encapsulated by the encapsulant so that the bottom surface of the substrate is coplanar with a bottom side of the encapsulant to increase the adhesion between the substrate and the encapsulant.