Patents by Inventor Wan-Yun Chi

Wan-Yun Chi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fin height monitoring structure and fin height monitoring method
    Patent number: 11362007
    Abstract: A fin height monitoring structure including a substrate, isolation structures, a first word line, and a second word line is provided. The substrate includes a first region and a second region. The isolation structures are located in the substrate of the first region to define at least one active area. The substrate in the active area has a fin that is higher than the isolation structures. The first word line is located on the isolation structures of the first region and on the fin of the first region. The second word line is located on the substrate of the second region.
    Type: Grant
    Filed: January 21, 2020
    Date of Patent: June 14, 2022
    Assignee: Winbond Electronics Corp.
    Inventors: Wan-Yun Chi, Yi-Chun Chin
  • FIN HEIGHT MONITORING STRUCTURE AND FIN HEIGHT MONITORING METHOD
    Publication number: 20210225714
    Abstract: A fin height monitoring structure including a substrate, isolation structures, a first word line, and a second word line is provided. The substrate includes a first region and a second region. The isolation structures are located in the substrate of the first region to define at least one active area. The substrate in the active area has a fin that is higher than the isolation structures. The first word line is located on the isolation structures of the first region and on the fin of the first region. The second word line is located on the substrate of the second region.
    Type: Application
    Filed: January 21, 2020
    Publication date: July 22, 2021
    Applicant: Winbond Electronics Corp.
    Inventors: Wan-Yun Chi, Yi-Chun Chin