Abstract: According to one embodiment described herein, a method for assembling a multi-emitter laser pump package, includes providing a base substrate comprising a laser riser block. A chip-on-hybrid laser assembly is bonded to the laser riser block with a solder preform. A scalar module is bonded to the base substrate with an adhesive such that an output of the chip-on-hybrid laser assembly is optically coupled into an input of the scalar module. A sidewall ring is adhesively bonded to the base substrate with a non-hermetic adhesive, the sidewall ring comprising a fiber interconnect fitting and at least one electrical connector. A first end of a fiber interconnect is optically coupled to an output of the scalar module and a second end of the fiber interconnect is positioned in the fiber interconnect fitting of the sidewall ring.